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PTCAN1043HGDQ1

Texas Instruments

PTCAN1043HGDQ1 by Texas Instruments

Texas Instruments PTCAN1043HGDQ1 is an AEC-Q100 compliant Ethernet transceiver with 14 terminals in a small outline package. Operating temperature ranges from -40 to 125°C, suitable for automotive applications. Utilizes CMOS technology, supports 5V supply voltage, and features gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,514 parts In-Stock

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Digiode

USA . 542 parts In-Stock

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542

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Parana Technologies

USA . 1,806 parts In-Stock

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$7.014

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$7.570

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1,806

$7.014

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$7.570

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AZTECH Wire

Italy . 473 parts In-Stock

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$7.267

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473

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DigiPath Technology Company

USA . 2,206 parts In-Stock

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$7.723

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$7.723

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ChromeModa Solutions

Germany . 1,346 parts In-Stock

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$7.881

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$6.462

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$7.881

$6.462

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IDEA Electronic Components Group

UK . 182 parts In-Stock

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$7.881

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$7.093

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182

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$7.093

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Corohmni

South Africa . 219 parts In-Stock

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$12.576

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219

$12.576

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Semicontronic

India . 873 parts In-Stock

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$13.000

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$12.675

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$12.610

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873

$13.000

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$12.610

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$15.638

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$14.857

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$14.857

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$15.638

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$14.857

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One Stop Electronics

USA . 983 parts In-Stock

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$478.000

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983

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Ampacity Inc.

Singapore . 178 parts In-Stock

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$803.000

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Continental Prestige Electronics

USA . 5,744 parts In-Stock

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Argo Parts USA

USA . 2,451 parts In-Stock

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Corphita

USA . 1,497 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your automotive networking systems with the PTCAN1043HGDQ1 by Texas Instruments. Built with precision and reliability in mind, this network interface device offers seamless integration and high-performance connectivity for various applications. Whether you're looking to optimize your vehicle's communication systems or enhance data transmission efficiency, this product delivers value and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and elevate your automotive technology with the PTCAN1043HGDQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for automotive applications where weight and durability are important factors.

Surface Mount: YES

Surface mount technology reduces the space required for installation, making the product suitable for compact electronic devices.

Screening Level: AEC-Q100

This screening level ensures that the product meets stringent automotive quality standards, making it a reliable choice for automotive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can withstand harsh automotive environments without malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Network Interfaces PTCAN1043HGDQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

PTCAN1043HGDQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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