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SN65HVD230MDREP

Texas Instruments

SN65HVD230MDREP by Texas Instruments

SN65HVD230MDREP by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, ideal for military-grade applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -55 to 125°C. This surface-mount device with gull wing terminals is designed for network interfaces requiring low supply current.

Median Price

$8.692

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,376 parts In-Stock

1+ parts

$8.323

100+ parts

$5.703

1k+ parts

$5.465

10k+ parts

$4.982

1,376

$8.323

$5.703

$5.465

$4.982

Chip1Stop

Japan . 1,376 parts In-Stock

1+ parts

$9.060

100+ parts

$5.940

1k+ parts

$5.300

10k+ parts

$4.790

1,376

$9.060

$5.940

$5.300

$4.790

DigiKey

USA . 2,250 parts In-Stock

1+ parts

$9.350

100+ parts

$6.183

1k+ parts

$6.068

10k+ parts

-

2,250

$9.350

$6.183

$6.068

-

Mouser Electronics

USA . 342 parts In-Stock

1+ parts

$9.350

100+ parts

$6.190

1k+ parts

$5.820

10k+ parts

$5.380

342

$9.350

$6.190

$5.820

$5.380

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.639

2,500

-

-

-

$3.639

Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$4.970

1k+ parts

$4.450

10k+ parts

$4.180

20

-

$4.970

$4.450

$4.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.089

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.089

-

-

-

Digiode

USA . 3,911 parts In-Stock

1+ parts

$4.132

100+ parts

-

1k+ parts

-

10k+ parts

-

3,911

$4.132

-

-

-

Vyrian

USA . 1,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

1,851

-

-

-

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Chip Stock

USA . 625 parts In-Stock

1+ parts

-

100+ parts

-

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625

-

-

-

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Bristol Electronics

USA . 11 parts In-Stock

1+ parts

-

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-

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11

-

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Atlantic Semiconductor

USA . 11 parts In-Stock

1+ parts

-

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11

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,813 parts In-Stock

1+ parts

$3.090

100+ parts

$3.013

1k+ parts

$2.997

10k+ parts

-

1,813

$3.090

$3.013

$2.997

-

Ampacity Inc.

Singapore . 1,622 parts In-Stock

1+ parts

$3.090

100+ parts

-

1k+ parts

-

10k+ parts

-

1,622

$3.090

-

-

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Corphita

USA . 4,545 parts In-Stock

1+ parts

$3.915

100+ parts

-

1k+ parts

-

10k+ parts

-

4,545

$3.915

-

-

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Bastille Electronics

Australia . 1,052 parts In-Stock

1+ parts

$4.089

100+ parts

$3.885

1k+ parts

$3.690

10k+ parts

$3.639

1,052

$4.089

$3.885

$3.690

$3.639

Continental Prestige Electronics

USA . 4,682 parts In-Stock

1+ parts

$4.089

100+ parts

-

1k+ parts

-

10k+ parts

$4.007

4,682

$4.089

-

-

$4.007

Argo Parts USA

USA . 1,219 parts In-Stock

1+ parts

$4.089

100+ parts

-

1k+ parts

-

10k+ parts

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1,219

$4.089

-

-

-

Corohmni

South Africa . 113 parts In-Stock

1+ parts

$12.316

100+ parts

-

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-

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113

$12.316

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$12.836

100+ parts

$12.194

1k+ parts

$12.194

10k+ parts

-

450

$12.836

$12.194

$12.194

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Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

$15.374

100+ parts

-

1k+ parts

$15.762

10k+ parts

-

1,542

$15.374

-

$15.762

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DigiPath Technology Company

USA . 2,062 parts In-Stock

1+ parts

$16.929

100+ parts

-

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2,062

$16.929

-

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ChromeModa Solutions

Germany . 2,005 parts In-Stock

1+ parts

$17.274

100+ parts

$14.165

1k+ parts

-

10k+ parts

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2,005

$17.274

$14.165

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IDEA Electronic Components Group

UK . 1,043 parts In-Stock

1+ parts

$17.274

100+ parts

$16.410

1k+ parts

$15.547

10k+ parts

-

1,043

$17.274

$16.410

$15.547

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Lixinc

USA . 13,847 parts In-Stock

1+ parts

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13,847

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Perfect Parts

USA . 11,848 parts In-Stock

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11,848

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A-Z Elektronik GmbH

Germany . 1,538 parts In-Stock

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1,538

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

$38.266

1k+ parts

$38.266

10k+ parts

$38.266

500

-

$38.266

$38.266

$38.266

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$38.266

1k+ parts

$38.266

10k+ parts

$38.266

500

-

$38.266

$38.266

$38.266

Overview

Elevate your network interfaces with the SN65HVD230MDREP by Texas Instruments. This high-quality product offers unparalleled reliability and performance, thanks to the trusted manufacturer's expertise. Ideal for a wide range of applications, this interface circuit ensures seamless communication at a blazing 1 Mbps data rate. With its compact design and military-grade temperature tolerance, this small outline package is the perfect solution for your networking needs. Experience the value and benefits that Texas Instruments brings to the table with the SN65HVD230MDREP.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and resistance to external factors, making it a reliable choice.

Surface Mount

YES - Allows for easy and convenient installation on circuit boards, saving time and effort.

Package Shape

RECTANGULAR - Offers a compact design that can easily fit in tight spaces.

Power Supplies (V)

3.3 - Operates efficiently with low power consumption, saving energy costs.

No. of Terminals

8 - Provides multiple connection options for versatile usage in different applications.

Package Style (Meter)

SMALL OUTLINE - Offers a sleek and slim profile for space-saving integration into systems.

Maximum Operating Temperature

125 °C - Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature

55 °C - Can withstand extremely cold conditions, ideal for various settings.

Terminal Finish

NICKEL PALLADIUM GOLD - Ensures strong and reliable connections for uninterrupted data transfer.

Terminal Position

DUAL - Allows for flexible installation orientations for greater compatibility.

Maximum Seated Height

1.75 mm - Low-profile design enables compact and efficient circuit layouts.

Width

3.9 mm - Compact size makes it ideal for small devices or densely packed circuit boards.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures a quick and efficient soldering process for ease of assembly.

Peak Reflow Temperature °C

260 - Withstands high temperatures during soldering without compromising performance.

Length

4.9 mm - Offers a balanced size for easy integration without taking up too much space.

Temperature Grade

MILITARY - Meets strict standards for reliability and durability in demanding conditions.

Technology

BICMOS - Combines the advantages of bipolar and CMOS technologies for optimized performance.

Terminal Form

GULL WING - Provides secure and stable connections for consistent data transmission.

Maximum Supply Current

0.017 mA - Operates efficiently with minimal power usage for energy-efficient performance.

Telecom IC Type

INTERFACE CIRCUIT - Designed specifically for telecom applications, ensuring compatibility and reliability.

Nominal Supply Voltage

3.3 V - Operates effectively with standard voltage levels for universal usage.

Terminal Pitch

1.27 mm - Allows for precise connections and orderly layouts for improved signal transmission.

Data Rate

1 Mbps - Supports high-speed data transfer for smooth and efficient communication.

Technical Specifications

Network Interfaces SN65HVD230MDREP attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.017 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN65HVD230MDREP Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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