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SN65HVD235D

Texas Instruments

SN65HVD235D by Texas Instruments

SN65HVD235D by Texas Instruments is a Network Interface IC with 1 channel, operating at 1 Mbps data rate. It has a supply voltage of 3.3V and low supply current of 6mA, suitable for automotive applications due to its temperature grade. The package style is small outline with gull wing terminals, making it ideal for surface mount designs in harsh environments.

Median Price

$4.340

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 414 parts In-Stock

1+ parts

$4.340

100+ parts

$2.787

1k+ parts

$2.574

10k+ parts

-

414

$4.340

$2.787

$2.574

-

Mouser Electronics

USA . 12,685 parts In-Stock

1+ parts

$4.530

100+ parts

$3.320

1k+ parts

$2.820

10k+ parts

$2.360

12,685

$4.530

$3.320

$2.820

$2.360

RS (Exports)

UK . 769 parts In-Stock

1+ parts

-

100+ parts

$3.778

1k+ parts

-

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769

-

$3.778

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

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100

$3.500

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Component Electronics Inc.

Canada . 7 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

-

7

$3.850

$2.880

$2.500

-

Digiode

USA . 1,490 parts In-Stock

1+ parts

$4.304

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-

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1,490

$4.304

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Forefront Electronics and Design

USA . 4 parts In-Stock

1+ parts

$19.600

100+ parts

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4

$19.600

-

-

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Chip Stock

USA . 7,389 parts In-Stock

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7,389

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Vyrian

USA . 4,808 parts In-Stock

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4,808

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Elcom Components

USA . 377 parts In-Stock

1+ parts

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377

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QIE Inc.

USA . 238 parts In-Stock

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238

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Bristol Electronics

USA . 64 parts In-Stock

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64

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Atlantic Semiconductor

USA . 64 parts In-Stock

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64

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Speed Components Ltd

Israel . 51 parts In-Stock

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51

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Cyclops Electronics Ltd

UK . 26 parts In-Stock

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26

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Connector Distribution Corp

USA . 26 parts In-Stock

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26

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Right Parts Inc.

USA . 26 parts In-Stock

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26

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LWI Electronics Inc

India . 3 parts In-Stock

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3

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MISTER SPROCKETS

USA . 3 parts In-Stock

1+ parts

-

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3

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,915 parts In-Stock

1+ parts

$3.210

100+ parts

-

1k+ parts

-

10k+ parts

-

4,915

$3.210

-

-

-

Semicontronic

India . 4,893 parts In-Stock

1+ parts

$3.210

100+ parts

$3.130

1k+ parts

$3.114

10k+ parts

-

4,893

$3.210

$3.130

$3.114

-

Continental Prestige Electronics

USA . 3,251 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

$3.430

3,251

$3.500

-

-

$3.430

Argo Parts USA

USA . 1,214 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

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10k+ parts

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1,214

$3.500

-

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$3.500

100+ parts

$3.325

1k+ parts

$3.159

10k+ parts

$3.115

1,000

$3.500

$3.325

$3.159

$3.115

Corphita

USA . 3,751 parts In-Stock

1+ parts

$4.077

100+ parts

-

1k+ parts

-

10k+ parts

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3,751

$4.077

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Parana Technologies

USA . 2,018 parts In-Stock

1+ parts

$12.720

100+ parts

-

1k+ parts

$13.185

10k+ parts

-

2,018

$12.720

-

$13.185

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$12.787

100+ parts

$12.148

1k+ parts

$12.148

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40

$12.787

$12.148

$12.148

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ChromeModa Solutions

Germany . 2,375 parts In-Stock

1+ parts

$14.292

100+ parts

$11.719

1k+ parts

-

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2,375

$14.292

$11.719

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$14.292

100+ parts

$13.577

1k+ parts

$12.863

10k+ parts

-

1,283

$14.292

$13.577

$12.863

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Corohmni

South Africa . 183 parts In-Stock

1+ parts

$15.482

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183

$15.482

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Microchip USA

USA . 2,236 parts In-Stock

1+ parts

$22.100

100+ parts

$21.970

1k+ parts

$21.900

10k+ parts

$21.830

2,236

$22.100

$21.970

$21.900

$21.830

Lixinc

USA . 8,583 parts In-Stock

1+ parts

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8,583

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Kepictronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

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DigiPath Technology Company

USA . 2,248 parts In-Stock

1+ parts

-

100+ parts

$12.886

1k+ parts

-

10k+ parts

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2,248

-

$12.886

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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100+ parts

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350

-

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$3.462

1k+ parts

$3.462

10k+ parts

$3.462

350

-

$3.462

$3.462

$3.462

Overview

Looking for a reliable network interface solution? Look no further than the SN65HVD235D by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers a cutting-edge interface circuit that is perfect for a wide range of applications. From automotive to industrial settings, this small outline package offers exceptional performance and efficiency. Trust Texas Instruments to provide you with the best in telecom IC technology. Upgrade your network interfaces today with the SN65HVD235D and experience the benefits of superior quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this network interface lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort during set-up.

No. of Functions: 1

With a single function, this network interface simplifies the design process and reduces complexity in the overall system.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard electronic components and ensures easy integration into existing systems.

No. of Terminals: 8

The eight terminals provide a sufficient number of connection points for reliable data transmission and signal integrity.

Package Style: SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact devices with limited real estate.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperatures, enhancing versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and ensures secure connections for improved reliability.

Maximum Seated Height: 1.75 mm

The low maximum seated height minimizes the overall profile of the network interface, ideal for applications with space constraints.

Width: 3.9 mm

The compact width of 3.9 mm allows for close placement of components on the circuit board, optimizing board real estate.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures robust solder joints and reliable performance during assembly processes.

Length: 4.9 mm

The length of 4.9 mm provides a balanced form factor that fits well within standard design layouts.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in harsh automotive environments, making it suitable for automotive applications.

No. of Channels: 1

The single channel design simplifies system architecture and reduces the complexity of signal routing.

Terminal Form: GULL WING

The gull wing terminal form allows for easy visual inspection and soldering during assembly, ensuring reliable connections.

No. of Transceivers: 1

The presence of a single transceiver simplifies the communication process and enhances compatibility with other devices.

Maximum Supply Current: 6 mA

The low maximum supply current minimizes power consumption and ensures energy-efficient operation.

Telecom IC Type: INTERFACE CIRCUIT

The telecom IC type interface circuit provides reliable data transfer and communication capabilities, making it suitable for telecom applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V offers compatibility with standard power sources and ensures stable performance.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting and compact design layouts.

Data Rate: 1 Mbps

The data rate of 1 Mbps supports fast and efficient data transmission, suitable for various networking applications.

Moisture Sensitivity Level (MSL): 1

The low moisture sensitivity level of 1 ensures the reliability of the network interface under humid conditions, making it suitable for diverse environments.

Technical Specifications

Network Interfaces SN65HVD235D attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

6 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD235D Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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