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PTCAN1057AVDDFRQ1

Texas Instruments

PTCAN1057AVDDFRQ1 by Texas Instruments

PTCAN1057AVDDFRQ1 by Texas Instruments is an AEC-Q100 compliant CAN FD transceiver with 8 Mbps data rate. It operates at -40 to 150 °C, suitable for automotive applications. This small outline package has gull wing terminals and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,731 parts In-Stock

1+ parts

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9,731

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Digiode

USA . 549 parts In-Stock

1+ parts

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549

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 480 parts In-Stock

1+ parts

$5.343

100+ parts

$496.148

1k+ parts

$4.808

10k+ parts

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480

$5.343

$496.148

$4.808

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DigiPath Technology Company

USA . 1,732 parts In-Stock

1+ parts

$5.883

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1,732

$5.883

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ChromeModa Solutions

Germany . 1,378 parts In-Stock

1+ parts

$6.003

100+ parts

$4.922

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1,378

$6.003

$4.922

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

1+ parts

$6.003

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$5.403

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1,089

$6.003

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$5.403

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AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$18.772

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316

$18.772

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Semicontronic

India . 1,312 parts In-Stock

1+ parts

$163.000

100+ parts

$158.925

1k+ parts

$158.110

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1,312

$163.000

$158.925

$158.110

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One Stop Electronics

USA . 1,407 parts In-Stock

1+ parts

$194.000

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1,407

$194.000

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Ampacity Inc.

Singapore . 948 parts In-Stock

1+ parts

$672.000

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948

$672.000

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Argo Parts USA

USA . 4,251 parts In-Stock

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Continental Prestige Electronics

USA . 3,655 parts In-Stock

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Corphita

USA . 3,305 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Upgrade your automotive network interfaces with the PTCAN1057AVDDFRQ1 from Texas Instruments. Designed with quality in mind, this CAN FD transceiver offers reliable performance in extreme temperatures, making it ideal for automotive applications. With a small, thin profile package and dual terminal position, this component is easy to integrate into your designs. Trust in Texas Instruments' reputation for excellence and choose the PTCAN1057AVDDFRQ1 for your next project. Unlock the value and benefits of this high-speed data rate solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction, making it ideal for automotive applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying manufacturing processes.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive electronics that require stringent performance criteria.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable operation even in extreme automotive environments, ensuring optimal performance under harsh conditions.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V makes it compatible with standard automotive power systems, ensuring seamless integration into existing vehicle electronics.

Technical Specifications

Network Interfaces PTCAN1057AVDDFRQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

8 Mbps

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.11

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

PTCAN1057AVDDFRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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