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PTCAN1057VDDFRQ1

Texas Instruments

PTCAN1057VDDFRQ1 by Texas Instruments

Texas Instruments PTCAN1057VDDFRQ1 is an AEC-Q100 compliant CAN FD transceiver with 8 Mbps data rate. It features a small outline, thin profile package style and operates in automotive temperature grade (-40 to 125 °C). Ideal for automotive network interfaces requiring high-speed communication in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,713 parts In-Stock

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Digiode

USA . 894 parts In-Stock

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Nova Conductors

Japan . 21 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 533 parts In-Stock

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$9.228

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533

$9.228

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Parana Technologies

USA . 192 parts In-Stock

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$10.089

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$10.638

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$10.089

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$10.638

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IDEA Electronic Components Group

UK . 1,204 parts In-Stock

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$11.336

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$10.769

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$10.202

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$11.336

$10.769

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ChromeModa Solutions

Germany . 33 parts In-Stock

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$11.336

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$9.296

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33

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One Stop Electronics

USA . 983 parts In-Stock

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$524.000

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Ampacity Inc.

Singapore . 978 parts In-Stock

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$863.000

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Continental Prestige Electronics

USA . 6,555 parts In-Stock

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Argo Parts USA

USA . 4,913 parts In-Stock

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Corphita

USA . 2,192 parts In-Stock

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DigiPath Technology Company

USA . 2,053 parts In-Stock

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$10.221

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Looking for a reliable CAN FD Transceiver for your automotive applications? Look no further than the PTCAN1057VDDFRQ1 by Texas Instruments. With a reputation for producing high-quality network interfaces, Texas Instruments delivers a top-notch product that offers superior performance and durability. Perfect for automotive environments, this transceiver boasts a small outline, thin profile, and shrink pitch design, making it ideal for space-constrained applications. Say goodbye to connectivity issues and hello to seamless communication with the PTCAN1057VDDFRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making this product suitable for various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive industry standards for reliability and quality, making it ideal for automotive applications.

Package Shape: RECTANGULAR

Rectangular package shape offers space-efficient design and easy integration into electronic systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, facilitating communication and data transfer between devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand intense heat conditions, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function efficiently even in extremely cold conditions, enhancing its versatility.

Terminal Position: DUAL

Dual terminal position offers flexibility in connectivity options, allowing for versatile configurations in different applications.

Maximum Seated Height: 1.1 mm

The small maximum seated height of 1.1mm enables a compact design, which is beneficial for space-constrained installations.

Width: 1.6 mm

The narrow width of 1.6mm contributes to the overall compactness of the product, making it suitable for compact electronic devices.

Length: 2.9 mm

The short length of 2.9mm further enhances the compact form factor of the product, making it ideal for applications where space is limited.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this product meets stringent automotive industry standards, ensuring reliability and performance in automotive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and ease of installation, ensuring reliable electrical connections in the circuit.

Telecom IC Type: CAN FD TRANSCEIVER

As a CAN FD transceiver, this product facilitates high-speed data communication in automotive and industrial applications, enabling efficient data exchange between devices.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for closer terminal spacing, enabling a higher density of connections on the circuit board.

Data Rate: 8 Mbps

With a data rate of 8 Mbps, this product offers high-speed data transmission capabilities, making it suitable for applications requiring fast and efficient data transfer.

Technical Specifications

Network Interfaces PTCAN1057VDDFRQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

8 Mbps

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.11

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

PTCAN1057VDDFRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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