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BSS84PH6327XTSA2

Infineon Technologies

BSS84PH6327XTSA2 by Infineon Technologies

BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.

Median Price

$0.189

Lifecycle Status

Suppliers In-Stock

44

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 288,716 parts In-Stock

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$0.032

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288,716

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$0.032

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Bürklin Elektronik

Germany . 3,056 parts In-Stock

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$0.197

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$0.089

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$0.063

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3,056

$0.197

$0.089

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Chip1Stop

Japan . 70,558 parts In-Stock

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$0.239

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Mouser Electronics

USA . 104,848 parts In-Stock

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$0.064

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104,848

$0.260

$0.099

$0.064

$0.039

DigiKey

USA . 254,065 parts In-Stock

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Distrelec

Netherlands . 2,920 parts In-Stock

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$0.254

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Adafruit Industries

USA . 100 parts In-Stock

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$1.358

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$1.290

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EBV Elektronik

Germany . 5,118,000 parts In-Stock

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Avnet

USA . 2,970,000 parts In-Stock

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Arrow

USA . 1,713,000 parts In-Stock

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Element14

Singapore . 1,176,155 parts In-Stock

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Farnell

UK . 1,088,921 parts In-Stock

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Verical

USA . 537,000 parts In-Stock

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Future Electronics

Canada . 273,000 parts In-Stock

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Ozdisan Elektronik

Türkiye . 9,870 parts In-Stock

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$0.039

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Digiode

USA . 657 parts In-Stock

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Maritex

Poland . 57,000 parts In-Stock

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Nova Conductors

Japan . 26 parts In-Stock

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TME

Poland . 5,786 parts In-Stock

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5,786

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$0.044

NAC Semi

USA . 4,326,000 parts In-Stock

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IBS Electronics

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Vyrian

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Rutronik

Germany . 261,000 parts In-Stock

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Schukat

Germany . 231,200 parts In-Stock

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Micros

Poland . 43,951 parts In-Stock

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Partservice

France . 43,751 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 40,601 parts In-Stock

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Cyclops Electronics Ltd

UK . 36,661 parts In-Stock

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ComSIT USA

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Chip Stock

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Bristol Electronics

USA . 10,627 parts In-Stock

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South Electronics

USA . 9,732 parts In-Stock

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PC Components Company LLC

USA . 5,805 parts In-Stock

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Inventory MP

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Semi Source

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France . 1,349 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 800 parts In-Stock

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Sensible Micro Corp

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Ampacity Inc.

Singapore . 1,205,667 parts In-Stock

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$0.020

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Semicontronic

India . 989,699 parts In-Stock

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Corphita

USA . 624 parts In-Stock

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Argo Parts USA

USA . 426 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$0.083

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$0.084

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Continental Prestige Electronics

USA . 706,140 parts In-Stock

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$0.322

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$0.123

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$0.061

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$0.041

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$0.123

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$0.041

Aztec Data Supply Inc.

USA . 3,155 parts In-Stock

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$0.887

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Corohmni

South Africa . 657 parts In-Stock

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$0.972

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657

$0.972

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.358

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$1.290

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$1.290

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100

$1.358

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$1.290

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Glotronic Ltd.

UK . 982,260 parts In-Stock

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GreenTree Electronics

Israel . 829,829 parts In-Stock

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RC Electronics

USA . 146,903 parts In-Stock

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Perfect Parts

USA . 137,668 parts In-Stock

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Allen Electronics Distributors

USA . 90,400 parts In-Stock

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iodParts Technologies Inc.

India . 23,135 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,095 parts In-Stock

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Metaverse IC Inc.

Canada . 5,242 parts In-Stock

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Robosynatics

Brazil . 3,940 parts In-Stock

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$0.441

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$0.441

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Lucentia Tech

USA . 3,940 parts In-Stock

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$0.441

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$0.441

Component Connect

USA . 3,368 parts In-Stock

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Kepictronics

USA . 673 parts In-Stock

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Assy Fe

Spain . 209 parts In-Stock

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Overview

Discover the power of Infineon Technologies with the BSS84PH6327XTSA2, a high-quality P-CHANNEL FET perfect for switching applications. With its innovative design and reliable performance, this transistor offers customers unmatched value and efficiency. Whether you're looking to improve your electronic devices or enhance your projects, the BSS84PH6327XTSA2 delivers on all fronts. Trust in Infineon Technologies to provide cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low gate leakage and high input impedance, ensuring efficient switching performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse bias protection, making the product versatile and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Surface mount packaging allows for easy integration onto PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage provides a safety margin for voltage spikes, increasing reliability.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement and alignment on a circuit board.

Terminal Form: GULL WING

Gull-wing terminals are suitable for surface mount soldering, ensuring secure connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input resistance and low conduction resistance, improving efficiency.

Maximum Drain Current (Abs) (ID): 0.17 A

The high maximum drain current allows for handling of higher power loads.

No. of Terminals: 3

With three terminals, the FET can be easily configured in various circuit designs.

Maximum Power Dissipation (Abs): 0.36 W

The low power dissipation rating indicates the FET can operate efficiently without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB, ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high switching speeds and low power consumption for improved performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature range allows for reliable operation in various environments.

Transistor Element Material: SILICON

Silicon-based transistors offer stable and consistent performance over a wide temperature range.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the FET can be used in cold environments without issues.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable electrical connections.

Maximum Drain-Source On Resistance: 8 ohm

Low drain-source on resistance minimizes power losses and heat generation during operation.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and ease of connection.

Maximum Feedback Capacitance (Crss): 3 pF

Low feedback capacitance improves high-frequency performance and stability in switching applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high reliability and quality for automotive applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS84PH6327XTSA2 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.17 A

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS84PH6327XTSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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