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BSS83PH6327XTSA1

Infineon Technologies

BSS83PH6327XTSA1 by Infineon Technologies

Infineon's BSS83PH6327XTSA1 is a P-CHANNEL FET with 60V DS Breakdown Voltage. It features SINGLE configuration with built-in diode, GULL WING terminals, and operates in ENHANCEMENT MODE. Ideal for small outline applications requiring low on-resistance and high drain current up to 0.33A at temperatures ranging from -55°C to 150°C.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

36

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Distrelec

Netherlands . 2,930 parts In-Stock

1+ parts

$0.320

100+ parts

$0.221

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$0.121

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2,930

$0.320

$0.221

$0.121

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Mouser Electronics

USA . 98,780 parts In-Stock

1+ parts

$0.420

100+ parts

$0.161

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$0.108

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$0.064

98,780

$0.420

$0.161

$0.108

$0.064

DigiKey

USA . 75,344 parts In-Stock

1+ parts

$0.500

100+ parts

$0.192

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$0.127

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75,344

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Future Electronics

Canada . 396,000 parts In-Stock

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Arrow

USA . 96,000 parts In-Stock

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Verical

USA . 96,000 parts In-Stock

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RS (Exports)

UK . 48,000 parts In-Stock

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EBV Elektronik

Germany . 39,000 parts In-Stock

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Rochester

USA . 36,000 parts In-Stock

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$0.075

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$0.055

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$0.075

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Chip1Stop

Japan . 33,531 parts In-Stock

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$0.151

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Avnet

USA . 18,000 parts In-Stock

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$0.048

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Farnell

UK . 16,057 parts In-Stock

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$0.158

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$0.083

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$0.071

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Element14

Singapore . 7,985 parts In-Stock

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$0.218

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$0.127

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$0.125

7,985

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$0.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 15 parts In-Stock

1+ parts

$0.093

100+ parts

$0.062

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$0.051

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$0.046

15

$0.093

$0.062

$0.051

$0.046

Nova Conductors

Japan . 500 parts In-Stock

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$0.145

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$0.145

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Digiode

USA . 67 parts In-Stock

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$0.304

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67

$0.304

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TME

Poland . 9,569 parts In-Stock

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$0.400

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$0.164

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$0.092

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$0.060

9,569

$0.400

$0.164

$0.092

$0.060

IBS Electronics

USA . 669,000 parts In-Stock

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Chip Stock

USA . 220,500 parts In-Stock

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Rutronik

Germany . 129,000 parts In-Stock

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Schukat

Germany . 121,100 parts In-Stock

1+ parts

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$0.097

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$0.077

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$0.064

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$0.097

$0.077

$0.064

Vyrian

USA . 119,300 parts In-Stock

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NAC Semi

USA . 60,000 parts In-Stock

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$0.187

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Micros

Poland . 44,547 parts In-Stock

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$0.095

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$0.089

44,547

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$0.089

Partservice

France . 33,000 parts In-Stock

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$0.086

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$0.067

33,000

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Component Sense

UK . 28,495 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 23,340 parts In-Stock

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$0.072

Bristol Electronics

USA . 22,005 parts In-Stock

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Sensible Micro Corp

USA . 14,695 parts In-Stock

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VNN

France . 5,551 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,732 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1,332 parts In-Stock

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Cyclops Electronics Ltd

UK . 995 parts In-Stock

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NexGen Digital

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Contempo Components LLC

USA . 149 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Semicontronic

India . 110,160 parts In-Stock

1+ parts

$0.043

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$0.042

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$0.042

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Ampacity Inc.

Singapore . 108,682 parts In-Stock

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Component Stockers USA

USA . 274,255 parts In-Stock

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$0.100

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$0.100

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$0.100

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$0.080

274,255

$0.100

$0.100

$0.100

$0.080

Continental Prestige Electronics

USA . 6,375 parts In-Stock

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$0.132

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$0.130

6,375

$0.132

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$0.130

Argo Parts USA

USA . 1,834 parts In-Stock

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$0.132

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$0.128

1,834

$0.132

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$0.128

Netroflash

USA . 500 parts In-Stock

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$0.145

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$0.138

10k+ parts

$0.135

500

$0.145

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$0.138

$0.135

Corphita

USA . 821 parts In-Stock

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$0.288

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821

$0.288

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Corohmni

South Africa . 243 parts In-Stock

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$0.813

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243

$0.813

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Aztec Data Supply Inc.

USA . 1,556 parts In-Stock

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$1.017

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1,556

$1.017

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.500

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$1.365

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$1.230

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100

$1.500

$1.365

$1.230

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Modulus Dynamics

Lithuania . 13,567 parts In-Stock

1+ parts

$1.919

100+ parts

$1.842

1k+ parts

$1.765

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13,567

$1.919

$1.842

$1.765

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Perfect Parts

USA . 460,103 parts In-Stock

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S.R.D Solutions

India . 126,000 parts In-Stock

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RC Electronics

USA . 100,000 parts In-Stock

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$0.150

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$0.140

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$0.130

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Futuretech Components

Singapore . 60,000 parts In-Stock

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Lixinc

USA . 19,611 parts In-Stock

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iodParts Technologies Inc.

India . 17,595 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,918 parts In-Stock

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Robosynatics

Brazil . 4,940 parts In-Stock

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$1.052

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$1.030

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$1.030

4,940

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$1.052

$1.030

$1.030

Lucentia Tech

USA . 4,940 parts In-Stock

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$1.052

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$1.030

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$1.030

4,940

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$1.030

Microchip USA

USA . 3,166 parts In-Stock

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3,166

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Overview

Unlock the power of innovation with the BSS83PH6327XTSA1 by Infineon Technologies. Designed with precision and quality in mind, this P-channel small signal field effect transistor offers a range of applications for your electronic projects. With a single configuration featuring a built-in diode, this transistor provides optimal performance and reliability. Experience enhanced efficiency and functionality with this cutting-edge technology. Elevate your designs with the unparalleled value and benefits that only Infineon Technologies can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: P-CHANNEL

P-channel transistors have lower leakage current and can be more efficient in certain circuit configurations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can help protect against reverse voltage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly and saves space on the board.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can handle higher voltages safely.

Package Shape: RECTANGULAR

The rectangular shape is standard and allows for easy placement on the PCB.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and make soldering easy during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are typically easier to control and have lower on-state resistance.

No. of Terminals: 3

Having only 3 terminals simplifies the circuit design and reduces complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package is compact and saves space on the PCB, ideal for smaller electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability for small signal applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance in a variety of environments.

Transistor Element Material: SILICON

Silicon transistors are widely used and offer good performance characteristics.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for operation even in cold environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and reliability in various operating conditions.

Maximum Drain Current (ID): 0.33 A

The high maximum drain current allows for handling higher currents without overheating.

Maximum Drain-Source On Resistance: 3 ohm

Lower on-resistance leads to lower power dissipation and higher efficiency in the circuit.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and placement on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The transistor can withstand peak reflow temperatures for a sufficient amount of time during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during assembly.

Maximum Feedback Capacitance (Crss): 9 pF

Low feedback capacitance helps in reducing signal distortion and improving high-frequency performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS83PH6327XTSA1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.33 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

9 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

BSS83PH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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