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TLE6250GV33NTMA1

Infineon Technologies

TLE6250GV33NTMA1 by Infineon Technologies

TLE6250GV33NTMA1 by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 80,000 parts In-Stock

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Vyrian

USA . 1,313 parts In-Stock

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Digiode

USA . 95 parts In-Stock

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95

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Nova Conductors

Japan . 15 parts In-Stock

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Modulus Dynamics

Lithuania . 4,034 parts In-Stock

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$8.396

100+ parts

$8.060

1k+ parts

$7.724

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4,034

$8.396

$8.060

$7.724

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Aztec Data Supply Inc.

USA . 1,265 parts In-Stock

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$13.700

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$13.700

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AZTECH Wire

Italy . 692 parts In-Stock

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$13.881

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Corohmni

South Africa . 90 parts In-Stock

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$14.227

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90

$14.227

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Advanced Electronics

New Zealand . 75 parts In-Stock

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$15.454

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$14.681

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$14.681

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$15.454

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$14.681

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Semicontronic

India . 1,457 parts In-Stock

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$516.000

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$503.100

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$500.520

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1,457

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Ampacity Inc.

Singapore . 833 parts In-Stock

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$717.000

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,923 parts In-Stock

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Argo Parts USA

USA . 1,527 parts In-Stock

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Corphita

USA . 257 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Robosynatics

Brazil . 10 parts In-Stock

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10

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Lucentia Tech

USA . 10 parts In-Stock

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$77.790

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$77.790

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$77.790

10

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$77.790

$77.790

$77.790

Overview

Elevate your network interfaces with the TLE6250GV33NTMA1 by Infineon Technologies. Known for their top-notch quality and innovative technology, Infineon brings you a compact and efficient solution for your communication needs. This CAN transceiver offers seamless integration, reliable performance, and unparalleled value to customers in various industries. Upgrade your network capabilities with Infineon's superior product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable devices or applications where weight is a concern.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Seated Height: 1.75 mm

Low seated height enables compact design and integration into space-constrained environments.

Technology: BICMOS

BiCMOS technology offers a combination of bipolar and CMOS characteristics, providing high speed performance and low power consumption.

Nominal Supply Voltage: 3.3 V

Operates at a common supply voltage of 3.3V, making it compatible with a wide range of systems and power sources.

Terminal Pitch: 1.27 mm

The close terminal pitch allows for high-density mounting on the PCB, saving space and enabling more connections in a limited area.

Technical Specifications

Network Interfaces TLE6250GV33NTMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

TLE6250GV33NTMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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