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TLE6250G

Infineon Technologies

TLE6250G by Infineon Technologies

TLE6250G by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, 5V supply voltage, and BICMOS technology. It has 8 terminals in a small outline package for automotive applications meeting AEC-Q100 standards. The device is surface mountable with gull wing terminal form and operates at a max supply current of 0.07 mA.

Median Price

$1.228

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,910 parts In-Stock

1+ parts

$2.680

100+ parts

$1.330

1k+ parts

$0.959

10k+ parts

$0.803

1,910

$2.680

$1.330

$0.959

$0.803

RS (Exports)

UK . 4,745 parts In-Stock

1+ parts

-

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-

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$0.949

4,745

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$0.949

Verical

USA . 2,434 parts In-Stock

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-

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$1.228

1k+ parts

$1.099

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2,434

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$1.228

$1.099

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Distributors (In-Stock)

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Tomark Electronics Ltd

UK . 7,500 parts In-Stock

1+ parts

$0.470

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$0.470

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Digiode

USA . 235 parts In-Stock

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$1.672

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235

$1.672

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Maritex

Poland . 52,250 parts In-Stock

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$2.337

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$1.163

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$0.839

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$0.703

52,250

$2.337

$1.163

$0.839

$0.703

Component Electronics Inc.

Canada . 37 parts In-Stock

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$6.150

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$4.620

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$4.000

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37

$6.150

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$4.000

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Cyclops Electronics Ltd

UK . 77,917 parts In-Stock

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Astute Electronics Inc

. 27,500 parts In-Stock

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Vyrian

USA . 3,245 parts In-Stock

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Connector Distribution Corp

USA . 2,224 parts In-Stock

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Right Parts Inc.

USA . 2,224 parts In-Stock

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Elcom Components

USA . 1,115 parts In-Stock

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Classic Components Corporation

USA . 492 parts In-Stock

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492

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J2 Sourcing AB

Sweden . 379 parts In-Stock

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ComSIT Distribution GmbH

Germany . 186 parts In-Stock

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Bristol Electronics

USA . 99 parts In-Stock

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Atlantic Semiconductor

USA . 99 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 55 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 32 parts In-Stock

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Holdelec - ElecDif-Pro

France . 32 parts In-Stock

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Pegasus Components GmbH

Germany . 30 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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Electronics Depot

USA . 10 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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North Shore Components

USA . 9 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Kiltronic GmbH

Germany . 3 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Semicontronic

India . 2,245 parts In-Stock

1+ parts

$0.810

100+ parts

$0.790

1k+ parts

$0.786

10k+ parts

-

2,245

$0.810

$0.790

$0.786

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Ampacity Inc.

Singapore . 2,072 parts In-Stock

1+ parts

$0.810

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2,072

$0.810

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CoreStaff

Japan . 2,449 parts In-Stock

1+ parts

$1.027

100+ parts

$0.678

1k+ parts

$0.676

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-

2,449

$1.027

$0.678

$0.676

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Corphita

USA . 881 parts In-Stock

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$1.584

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881

$1.584

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Corohmni

South Africa . 353 parts In-Stock

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$12.726

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353

$12.726

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Modulus Dynamics

Lithuania . 198 parts In-Stock

1+ parts

$13.814

100+ parts

$13.261

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$12.709

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198

$13.814

$13.261

$12.709

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Kepictronics

USA . 55,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 30,522 parts In-Stock

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Lixinc

USA . 15,069 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,110 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,606 parts In-Stock

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2,606

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Alle Elektronik GmbH

Germany . 2,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,123 parts In-Stock

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Assy Fe

Spain . 1,900 parts In-Stock

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Bastille Electronics

Australia . 69 parts In-Stock

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Overview

Unlock seamless communication and connectivity with the TLE6250G by Infineon Technologies, a leading manufacturer in network interfaces. Designed for reliability and performance, this CAN transceiver offers unparalleled value and benefits in automotive and industrial applications. With its compact design and advanced technology, the TLE6250G ensures smooth data transmission at a high data rate of 1 Mbps, making it the ideal choice for your connectivity needs. Trust Infineon Technologies to deliver top-notch quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this product lightweight and durable.

Surface Mount: YES

Being surface mount compatible allows for easy installation and flexibility in placement on a circuit board.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of space on a PCB and easy integration into existing designs.

Power Supplies (V): 5

Operating at 5V makes this network interface compatible with a wide range of systems and power sources.

No. of Terminals: 8

With 8 terminals, this product supports multiple connections for versatile networking capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enables compact designs in various applications.

Terminal Finish: TIN

The use of tin terminal finish enhances conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and accommodate different wiring configurations.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75mm allows for compact device assembly and minimizes board space requirements.

Technical Specifications

Network Interfaces TLE6250G attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.07 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE6250G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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