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TLE6250GXUMA1

Infineon Technologies

TLE6250GXUMA1 by Infineon Technologies

TLE6250GXUMA1 by Infineon Technologies is a CAN transceiver with BICMOS technology, 8 terminals, and 5V supply voltage. It is used in network interfaces for automotive applications due to its small outline package and gull wing terminal form.

Median Price

$0.962

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 257 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$0.824

-

-

-

Mouser Electronics

USA . 803 parts In-Stock

1+ parts

$1.360

100+ parts

$1.080

1k+ parts

-

10k+ parts

$0.910

803

$1.360

$1.080

-

$0.910

Rochester

USA . 56,733 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

$0.872

10k+ parts

$0.777

56,733

-

$1.050

$0.872

$0.777

Element14

Singapore . 13,002 parts In-Stock

1+ parts

-

100+ parts

$2.470

1k+ parts

$1.854

10k+ parts

-

13,002

-

$2.470

$1.854

-

Verical

USA . 2,767 parts In-Stock

1+ parts

-

100+ parts

$0.790

1k+ parts

-

10k+ parts

-

2,767

-

$0.790

-

-

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.748

2,500

-

-

-

$0.748

Farnell

UK . 2,395 parts In-Stock

1+ parts

-

100+ parts

$0.962

1k+ parts

$0.802

10k+ parts

-

2,395

-

$0.962

$0.802

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Tomark Electronics Ltd

UK . 7,500 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

$0.470

-

-

-

Digiode

USA . 395 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$0.692

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.918

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.918

-

-

-

Chip Stock

USA . 72,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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72,500

-

-

-

-

Vyrian

USA . 9,477 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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9,477

-

-

-

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Bristol Electronics

USA . 5,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,906

-

-

-

-

NAC Semi

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.200

5,000

-

-

-

$1.200

Martec Srl

Italy . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

-

-

-

-

Elcom Components

USA . 1,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,115

-

-

-

-

Rutronik

Germany . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.250

5

-

-

-

$3.250

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 10,386 parts In-Stock

1+ parts

$0.620

100+ parts

$0.604

1k+ parts

$0.601

10k+ parts

-

10,386

$0.620

$0.604

$0.601

-

Ampacity Inc.

Singapore . 9,457 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

10k+ parts

-

9,457

$0.620

-

-

-

Corphita

USA . 56 parts In-Stock

1+ parts

$0.655

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$0.655

-

-

-

Argo Parts USA

USA . 4,620 parts In-Stock

1+ parts

$0.918

100+ parts

-

1k+ parts

-

10k+ parts

-

4,620

$0.918

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.918

100+ parts

$0.900

1k+ parts

-

10k+ parts

-

50

$0.918

$0.900

-

-

Continental Prestige Electronics

USA . 15,977 parts In-Stock

1+ parts

$1.750

100+ parts

$1.050

1k+ parts

$0.797

10k+ parts

-

15,977

$1.750

$1.050

$0.797

-

Microchip USA

USA . 2,235 parts In-Stock

1+ parts

$5.960

100+ parts

$5.930

1k+ parts

$5.910

10k+ parts

$5.890

2,235

$5.960

$5.930

$5.910

$5.890

Aztec Data Supply Inc.

USA . 6,017 parts In-Stock

1+ parts

$6.390

100+ parts

-

1k+ parts

-

10k+ parts

-

6,017

$6.390

-

-

-

Modulus Dynamics

Lithuania . 3,748 parts In-Stock

1+ parts

$8.562

100+ parts

$8.220

1k+ parts

$7.877

10k+ parts

-

3,748

$8.562

$8.220

$7.877

-

Corohmni

South Africa . 103 parts In-Stock

1+ parts

$11.166

100+ parts

-

1k+ parts

-

10k+ parts

-

103

$11.166

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$17.657

100+ parts

$16.774

1k+ parts

$16.774

10k+ parts

-

50

$17.657

$16.774

$16.774

-

Perfect Parts

USA . 61,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

61,383

-

-

-

-

RC Electronics

USA . 36,296 parts In-Stock

1+ parts

-

100+ parts

$1.100

1k+ parts

$1.010

10k+ parts

$0.980

36,296

-

$1.100

$1.010

$0.980

Infinite Electronics LLP (Excess)

. 33,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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33,414

-

-

-

-

GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Speed Components Ltd (Excess)

Israel . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

iodParts Technologies Inc.

India . 738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

738

-

-

-

-

Robosynatics

Brazil . 585 parts In-Stock

1+ parts

-

100+ parts

$6.893

1k+ parts

$6.753

10k+ parts

$6.753

585

-

$6.893

$6.753

$6.753

Lucentia Tech

USA . 585 parts In-Stock

1+ parts

-

100+ parts

$6.893

1k+ parts

$6.753

10k+ parts

$6.753

585

-

$6.893

$6.753

$6.753

Formix International (Excess)

India . 158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

158

-

-

-

-

Overview

Experience seamless communication with the TLE6250GXUMA1 by Infineon Technologies, a top-of-the-line CAN transceiver designed for reliability and efficiency. Crafted with precision using advanced BICMOS technology, this network interface boasts a compact design that ensures easy integration into any system. Whether you're in automotive, industrial, or consumer electronics, this product guarantees optimal performance and long-term durability. Trust Infineon Technologies to deliver unparalleled quality and innovation, providing you with the value and benefits you need for your next project. Elevate your connectivity with the TLE6250GXUMA1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable, the product offers easy installation and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space.

No. of Terminals: 8

With 8 terminals, the product offers versatile connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in compact designs.

Terminal Finish: TIN

The use of tin terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position enhances stability and reliability of connections.

Maximum Seated Height: 1.75 mm

The low seated height is beneficial for slim and compact device designs.

Width: 4 mm

The narrow width of 4 mm contributes to space-saving on the PCB.

Length: 5 mm

The compact length of 5 mm adds to the overall compactness of the product.

Technology: BICMOS

BICMOS technology offers a good balance between Bipolar and CMOS technologies, providing high performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form ensures secure soldering and robust mechanical connections.

Telecom IC Type: CAN TRANSCEIVER

Being a CAN transceiver, the product is suitable for communication in automotive and industrial applications.

Nominal Supply Voltage: 5 V

Operates at the standard 5V supply voltage, making it compatible with a wide range of systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and reliable connections.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product is suitable for reflow soldering processes and has moderate sensitivity to moisture.

Technical Specifications

Network Interfaces TLE6250GXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE6250GXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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