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TLE62512GXT

Infineon Technologies

TLE62512GXT by Infineon Technologies

TLE62512GXT by Infineon is a BICMOS technology interface circuit with 14 terminals in a small outline package. It operates at 5V nominal voltage, AEC-Q100 screening level for automotive applications. The GULL WING terminal form and dual position make it suitable for network interfaces in compact designs.

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4

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1k+

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Chip Stock

USA . 9,063 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

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Corohmni

South Africa . 344 parts In-Stock

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AZTECH Wire

Italy . 867 parts In-Stock

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Modulus Dynamics

Lithuania . 2,093 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,562 parts In-Stock

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Ampacity Inc.

Singapore . 1,150 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Corphita

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Overview

Enhance your network connectivity with the TLE62512GXT by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and reliability. This product offers seamless integration into various applications within the network interfaces category, making it an essential component for your projects. With its compact design and advanced technology, the TLE62512GXT ensures superior performance and efficiency. Experience the value and benefits that this product brings to your systems, setting you apart from the competition. Elevate your network solutions with the TLE62512GXT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easier and more efficient mounting onto circuit boards.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards.

No. of Terminals: 14

Provides ample connectivity options for various devices and applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the circuit board.

Terminal Position: DUAL

Dual terminal position allows for increased stability and robustness of the connection.

Maximum Seated Height: 1.75 mm

Low seated height helps in reducing overall profile of the product.

Width: 4 mm

Compact width size helps in fitting the product in tight spaces on the circuit board.

Length: 8.75 mm

Optimal length size for efficient placement and connectivity.

Technology: BICMOS

Utilization of BiCMOS technology provides a good balance of high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical strength and reliability in the connection.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuits in telecom applications, ensuring compatibility and performance.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is commonly used in many electronic systems and provides compatibility.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high density mounting on circuit boards.

Technical Specifications

Network Interfaces TLE62512GXT attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.75 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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