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TLE62513GXUMA2

Infineon Technologies

TLE62513GXUMA2 by Infineon Technologies

TLE62513GXUMA2 by Infineon: BICMOS tech, 14 terminals, 5V supply. Telecom interface circuit with small outline package for surface mount applications in network interfaces.

Median Price

$2.040

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,070 parts In-Stock

1+ parts

$0.870

100+ parts

$0.830

1k+ parts

$0.789

10k+ parts

-

2,070

$0.870

$0.830

$0.789

-

Farnell

UK . 1,704 parts In-Stock

1+ parts

$1.370

100+ parts

$1.170

1k+ parts

$1.100

10k+ parts

-

1,704

$1.370

$1.170

$1.100

-

Chip1Stop

Japan . 2,152 parts In-Stock

1+ parts

$2.040

100+ parts

$1.497

1k+ parts

$1.425

10k+ parts

-

2,152

$2.040

$1.497

$1.425

-

Element14

Singapore . 1,704 parts In-Stock

1+ parts

$2.100

100+ parts

$2.060

1k+ parts

$1.960

10k+ parts

$1.920

1,704

$2.100

$2.060

$1.960

$1.920

Newark

USA . 323 parts In-Stock

1+ parts

$3.240

100+ parts

$2.010

1k+ parts

$1.780

10k+ parts

-

323

$3.240

$2.010

$1.780

-

Mouser Electronics

USA . 2,290 parts In-Stock

1+ parts

$3.280

100+ parts

$1.640

1k+ parts

-

10k+ parts

$1.630

2,290

$3.280

$1.640

-

$1.630

RS (Exports)

UK . 12,445 parts In-Stock

1+ parts

-

100+ parts

$2.747

1k+ parts

$2.482

10k+ parts

-

12,445

-

$2.747

$2.482

-

Rochester

USA . 3,770 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.370

10k+ parts

$1.290

3,770

-

$1.530

$1.370

$1.290

Verical

USA . 2,070 parts In-Stock

1+ parts

-

100+ parts

$0.830

1k+ parts

$0.789

10k+ parts

-

2,070

-

$0.830

$0.789

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 276 parts In-Stock

1+ parts

$1.302

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$1.302

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.593

-

-

-

Vyrian

USA . 2,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,777

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,672 parts In-Stock

1+ parts

$0.700

100+ parts

$0.682

1k+ parts

$0.679

10k+ parts

-

2,672

$0.700

$0.682

$0.679

-

Ampacity Inc.

Singapore . 2,808 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

-

2,808

$1.160

-

-

-

Corphita

USA . 432 parts In-Stock

1+ parts

$1.233

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$1.233

-

-

-

Argo Parts USA

USA . 1,773 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

1,773

$1.593

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.593

-

-

-

Continental Prestige Electronics

USA . 1,852 parts In-Stock

1+ parts

$3.030

100+ parts

$1.980

1k+ parts

$1.540

10k+ parts

-

1,852

$3.030

$1.980

$1.540

-

Corohmni

South Africa . 1,157 parts In-Stock

1+ parts

$6.368

100+ parts

-

1k+ parts

-

10k+ parts

-

1,157

$6.368

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$6.553

100+ parts

$6.225

1k+ parts

$6.225

10k+ parts

-

2,000

$6.553

$6.225

$6.225

-

Aztec Data Supply Inc.

USA . 2,188 parts In-Stock

1+ parts

$14.570

100+ parts

-

1k+ parts

-

10k+ parts

-

2,188

$14.570

-

-

-

Modulus Dynamics

Lithuania . 2,338 parts In-Stock

1+ parts

$14.832

100+ parts

$14.239

1k+ parts

$13.645

10k+ parts

-

2,338

$14.832

$14.239

$13.645

-

Overview

Unleash the power of seamless connectivity with the TLE62513GXUMA2 by Infineon Technologies. Crafted with precision and expertise, this network interface device is designed to elevate your connectivity experience. Whether you're in automotive or industrial applications, this small outline package delivers unparalleled performance and reliability. Say goodbye to connectivity issues and hello to a world of seamless communication. Trust Infineon Technologies to bring you quality and innovation like never before. Experience the difference with the TLE62513GXUMA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to harsh environmental conditions, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and compatible with many standard designs, ensuring easy compatibility with existing hardware.

No. of Terminals: 14

Having 14 terminals allows for connection to multiple components and devices, increasing the versatility and functionality of this product.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the PCB, especially in compact designs where size constraints are a concern.

Terminal Finish: Nickel/Gold/Palladium (Ni/Au/Pd)

A combination of Nickel, Gold, and Palladium finish on the terminals ensures good conductivity, corrosion resistance, and longevity for stable performance.

Terminal Position: DUAL

Dual terminal position allows for flexible connectivity options, enabling multiple configurations for different usage scenarios.

Maximum Seated Height: 1.75 mm

Low seated height makes this product suitable for space-constrained applications where component height is a critical factor.

Width: 4 mm

Compact width dimension helps in fitting this product into narrow spaces or alongside other components on the circuit board, optimizing use of available space.

Length: 8.75 mm

With a moderate length, this product strikes a balance between size and functionality, making it versatile for various electronic designs.

Technology: BICMOS

BICMOS technology combines the benefits of both Bipolar and CMOS technologies, offering high performance, low power consumption, and improved reliability.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring a robust and secure connection.

Telecom IC Type: INTERFACE CIRCUIT

Being an interface circuit for telecom applications, this product facilitates communication between devices, making it suitable for networking and telecommunication systems.

Nominal Supply Voltage: 5 V

Operating at a common supply voltage of 5V, this product can be easily integrated into existing systems without the need for additional power source arrangements.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27mm, this product ensures compatibility with commonly used connectors and allows for easy connection to other components.

Moisture Sensitivity Level (MSL): 2A

Having a moisture sensitivity level of 2A indicates that this product is resistant to moisture-related issues during storage and operation, ensuring long-term reliability.

Technical Specifications

Network Interfaces TLE62513GXUMA2 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.75 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

Nickel/Gold/Palladium (Ni/Au/Pd)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

TLE62513GXUMA2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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