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TCAN1051HVD

Texas Instruments

TCAN1051HVD by Texas Instruments

TCAN1051HVD by Texas Instruments is a Network Interface IC with 2 Mbps data rate, 5V supply voltage, and 180mA max supply current. It is ideal for military-grade applications requiring interface circuits in telecom systems.

Median Price

$2.160

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 16 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$2.090

-

-

-

Mouser Electronics

USA . 47,506 parts In-Stock

1+ parts

$2.230

100+ parts

$1.500

1k+ parts

$1.320

10k+ parts

$0.980

47,506

$2.230

$1.500

$1.320

$0.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$1.057

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$1.057

-

-

-

Digiode

USA . 2,088 parts In-Stock

1+ parts

$2.118

100+ parts

-

1k+ parts

-

10k+ parts

-

2,088

$2.118

-

-

-

Vyrian

USA . 23,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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23,465

-

-

-

-

Chip Stock

USA . 18,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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18,500

-

-

-

-

Bas Electronics GmbH & Co. KG

Germany . 13 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,694 parts In-Stock

1+ parts

$1.057

100+ parts

-

1k+ parts

-

10k+ parts

$1.036

5,694

$1.057

-

-

$1.036

Argo Parts USA

USA . 1,539 parts In-Stock

1+ parts

$1.057

100+ parts

-

1k+ parts

-

10k+ parts

-

1,539

$1.057

-

-

-

Corohmni

South Africa . 571 parts In-Stock

1+ parts

$1.101

100+ parts

-

1k+ parts

-

10k+ parts

-

571

$1.101

-

-

-

Advanced Electronics

New Zealand . 33 parts In-Stock

1+ parts

$1.134

100+ parts

$1.077

1k+ parts

$1.077

10k+ parts

-

33

$1.134

$1.077

$1.077

-

Corphita

USA . 172 parts In-Stock

1+ parts

$2.007

100+ parts

-

1k+ parts

-

10k+ parts

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172

$2.007

-

-

-

Semicontronic

India . 23,816 parts In-Stock

1+ parts

$3.760

100+ parts

$3.666

1k+ parts

$3.647

10k+ parts

-

23,816

$3.760

$3.666

$3.647

-

Ampacity Inc.

Singapore . 23,493 parts In-Stock

1+ parts

$3.760

100+ parts

-

1k+ parts

-

10k+ parts

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23,493

$3.760

-

-

-

Parana Technologies

USA . 343 parts In-Stock

1+ parts

$15.244

100+ parts

-

1k+ parts

$15.640

10k+ parts

-

343

$15.244

-

$15.640

-

ChromeModa Solutions

Germany . 2,216 parts In-Stock

1+ parts

$17.128

100+ parts

$14.045

1k+ parts

-

10k+ parts

-

2,216

$17.128

$14.045

-

-

IDEA Electronic Components Group

UK . 1,795 parts In-Stock

1+ parts

$17.128

100+ parts

$16.272

1k+ parts

$15.415

10k+ parts

-

1,795

$17.128

$16.272

$15.415

-

A-Z Elektronik GmbH

Germany . 7,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,622

-

-

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-

Lixinc

USA . 4,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,972

-

-

-

-

DigiPath Technology Company

USA . 263 parts In-Stock

1+ parts

-

100+ parts

$15.443

1k+ parts

-

10k+ parts

-

263

-

$15.443

-

-

Overview

Discover the unparalleled quality and reliability of Texas Instruments with the TCAN1051HVD, a cutting-edge network interface solution that is sure to exceed your expectations. Designed for a wide range of applications, this small outline package offers customers the perfect balance of performance and value. With its high-speed data rate of 2 Mbps and military-grade temperature tolerance, this interface circuit ensures seamless communication in even the harshest environments. Trust Texas Instruments to deliver top-notch technology that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to damage, making the product suitable for long-term use.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, ensuring a stable connection.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers high conductivity and corrosion resistance, leading to reliable performance.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, making it suitable for military applications.

Data Rate: 2 Mbps

Supports high-speed data transmission, providing efficient network connectivity.

Technical Specifications

Network Interfaces TCAN1051HVD attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

2 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

180 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

TCAN1051HVD Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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