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TJA1050T/N1

NXP Semiconductors

TJA1050T/N1 by NXP Semiconductors

NXP Semiconductors' TJA1050T/N1 is a network interface IC with 8 terminals, operating at 5V. It features a data rate of 1 Mbps and is designed for automotive applications. With a temperature range from -40 to 125°C, this CMOS technology-based chip offers low supply current at 0.075 mA.

Median Price

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Digiode

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J2 Sourcing AB

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Semtec, LLC

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Prism Electronics

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Nova Conductors

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PC Components Company LLC

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Bristol Electronics

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Zilex Electronics Inc.

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Corohmni

South Africa . 180 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,385 parts In-Stock

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AZTECH Wire

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Ampacity Inc.

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Overview

Unlock seamless and reliable communication with the TJA1050T/N1 from NXP Semiconductors. Crafted with precision and expertise, this network interface offers unparalleled quality and performance. Ideal for automotive applications, this small outline package guarantees robust connectivity without compromising on efficiency. Stay ahead of the curve and experience the value of superior technology with the TJA1050T/N1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and lightweight design, making the product suitable for various applications.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and compatibility with different systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme conditions and maintain consistent performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation of the network interface.

Data Rate: 1 Mbps

A data rate of 1 Mbps allows for fast and efficient data transfer, making the product suitable for various network applications.

Technical Specifications

Network Interfaces TJA1050T/N1 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1050T/N1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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