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TCAN4550RGYT

Texas Instruments

TCAN4550RGYT by Texas Instruments

TCAN4550RGYT by Texas Instruments is a network interface chip carrier with 20 terminals and a very thin profile. It operates at temperatures ranging from -40 to 125 °C and has a data rate of 5 Mbps. This automotive-grade IC is commonly used in interface circuits for telecom applications.

Median Price

$3.550

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 68,603 parts In-Stock

1+ parts

$2.287

100+ parts

$1.889

1k+ parts

$1.021

10k+ parts

-

68,603

$2.287

$1.889

$1.021

-

DigiKey

USA . 1,451 parts In-Stock

1+ parts

$3.550

100+ parts

$2.205

1k+ parts

-

10k+ parts

-

1,451

$3.550

$2.205

-

-

Mouser Electronics

USA . 1,364 parts In-Stock

1+ parts

$3.550

100+ parts

$2.210

1k+ parts

$1.920

10k+ parts

$1.900

1,364

$3.550

$2.210

$1.920

$1.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 18 parts In-Stock

1+ parts

$1.797

100+ parts

-

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-

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18

$1.797

-

-

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Digiode

USA . 2,306 parts In-Stock

1+ parts

$2.173

100+ parts

-

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2,306

$2.173

-

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Vyrian

USA . 24,538 parts In-Stock

1+ parts

-

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-

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24,538

-

-

-

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Chip Stock

USA . 13,600 parts In-Stock

1+ parts

-

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13,600

-

-

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HZD GmbH

Germany . 1,500 parts In-Stock

1+ parts

-

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1,500

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Semtec, LLC

USA . 50 parts In-Stock

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-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,979 parts In-Stock

1+ parts

$1.797

100+ parts

-

1k+ parts

-

10k+ parts

$1.761

3,979

$1.797

-

-

$1.761

Argo Parts USA

USA . 3,167 parts In-Stock

1+ parts

$1.797

100+ parts

-

1k+ parts

-

10k+ parts

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3,167

$1.797

-

-

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Semicontronic

India . 24,495 parts In-Stock

1+ parts

$1.940

100+ parts

$1.892

1k+ parts

$1.882

10k+ parts

-

24,495

$1.940

$1.892

$1.882

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Ampacity Inc.

Singapore . 24,399 parts In-Stock

1+ parts

$1.940

100+ parts

-

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24,399

$1.940

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Corphita

USA . 2,702 parts In-Stock

1+ parts

$2.058

100+ parts

-

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2,702

$2.058

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Corohmni

South Africa . 379 parts In-Stock

1+ parts

$7.272

100+ parts

-

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379

$7.272

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$9.381

100+ parts

$8.912

1k+ parts

$8.912

10k+ parts

-

200

$9.381

$8.912

$8.912

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Parana Technologies

USA . 1,098 parts In-Stock

1+ parts

$15.170

100+ parts

-

1k+ parts

$15.569

10k+ parts

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1,098

$15.170

-

$15.569

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DigiPath Technology Company

USA . 2,352 parts In-Stock

1+ parts

$16.704

100+ parts

$15.368

1k+ parts

-

10k+ parts

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2,352

$16.704

$15.368

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ChromeModa Solutions

Germany . 3,627 parts In-Stock

1+ parts

$17.045

100+ parts

$13.977

1k+ parts

-

10k+ parts

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3,627

$17.045

$13.977

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IDEA Electronic Components Group

UK . 1,422 parts In-Stock

1+ parts

$17.045

100+ parts

$16.193

1k+ parts

$15.340

10k+ parts

-

1,422

$17.045

$16.193

$15.340

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Lixinc

USA . 9,109 parts In-Stock

1+ parts

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9,109

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Robosynatics

Brazil . 5,000 parts In-Stock

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5,000

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-

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Lucentia Tech

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$0.546

1k+ parts

$0.546

10k+ parts

$0.546

5,000

-

$0.546

$0.546

$0.546

Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

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500

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-

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Overview

Discover the TCAN4550RGYT by Texas Instruments, a high-quality network interface designed to revolutionize your connectivity experience. As a leading manufacturer, Texas Instruments brings its expertise and innovation to every product, ensuring reliability and superior performance. This interface circuit boasts numerous applications, making it a versatile choice for all your networking needs. But what truly sets the TCAN4550RGYT apart is its value to customers. With its compact design and advanced features, you'll enjoy seamless data transmission at lightning-fast speeds of up to 5 Mbps. Say goodbye to connectivity issues and hello to effortless communication. Upgrade your network today with the TCAN4550RGYT and experience the benefits and advantages it offers firsthand.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product's plastic/epoxy body material ensures durability and reliability, making it a good choice for long-term use.

Surface Mount:

YES - With surface mount capability, this product offers easy installation and integration into various systems, making it a convenient choice for network interfaces.

No. of Functions:

1 - This product's single function design simplifies usage and ensures efficient performance, making it an ideal choice for network interfaces.

Package Shape:

RECTANGULAR - The rectangular shape of this product allows for easy placement and compact integration, making it a space-efficient choice for network interfaces.

No. of Terminals:

20 - With 20 terminals, this product provides versatile connectivity options and allows for multiple connections, making it a versatile choice for network interfaces.

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE - The chip carrier package style with a very thin profile enhances the product's compactness and facilitates efficient heat dissipation, making it an excellent choice for network interfaces.

Maximum Operating Temperature:

125 °C - This product's high maximum operating temperature ensures reliable and stable performance even in demanding operating conditions, making it a reliable choice for network interfaces.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature capability of this product enables seamless performance in extreme temperature conditions, making it a suitable choice for network interfaces in various environments.

Terminal Finish:

MATTE TIN - The matte tin terminal finish ensures excellent electrical conductivity and corrosion resistance, enhancing the product's longevity and reliability, thus making it a durable choice for network interfaces.

Terminal Position:

QUAD - The quad terminal position offers precise and secure connections, maximizing the product's performance and making it a reliable choice for network interfaces.

Maximum Seated Height:

1 mm - With a low maximum seated height, this product can be easily integrated into compact systems, making it a space-saving choice for network interfaces.

Width:

3.5 mm - The compact width of this product allows for easy integration and optimal space utilization, making it an efficient choice for network interfaces.

Maximum Time At Peak Reflow Temperature (s):

30 - This product's capability to withstand a maximum time at peak reflow temperature of 30 seconds ensures easy and efficient soldering, making it a convenient choice for network interfaces.

Peak Reflow Temperature °C:

260 - With a high peak reflow temperature, this product enables effective soldering and ensures reliable connections, making it a suitable choice for network interfaces.

Length:

4.5 mm - The compact length of this product facilitates easy integration and optimal space utilization, making it a space-efficient choice for network interfaces.

Temperature Grade:

AUTOMOTIVE - This product's automotive temperature grade ensures reliable performance in automotive applications, making it a suitable choice for network interfaces in automotive systems.

No. of Channels:

1 - With one channel, this product offers simplified usage and ensures efficient data transmission, making it an ideal choice for network interfaces.

Terminal Form:

NO LEAD - The no lead terminal form of this product enhances connectivity and eliminates potential lead-related issues, making it a reliable choice for network interfaces.

Telecom IC Type:

INTERFACE CIRCUIT - With an interface circuit telecom IC type, this product provides seamless integration and optimized communication capabilities, making it a suitable choice for network interfaces in telecom applications.

Nominal Supply Voltage:

12 V - This product's nominal supply voltage of 12 V ensures stable and reliable power input, making it a suitable choice for network interfaces in various systems.

Terminal Pitch:

0.5 mm - The compact terminal pitch of 0.5 mm allows for efficient space utilization and easy integration, making it an optimal choice for network interfaces.

Data Rate:

5 Mbps - With a data rate of 5 Mbps, this product offers fast and efficient data transmission, making it a high-performance choice for network interfaces.

Moisture Sensitivity Level (MSL):

2 - The moisture sensitivity level 2 of this product ensures safe and reliable performance even in humid environments, making it a suitable choice for network interfaces in various conditions.

Technical Specifications

Network Interfaces TCAN4550RGYT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e3

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

TCAN4550RGYT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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