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TLE62512GXUMA3

Infineon Technologies

TLE62512GXUMA3 by Infineon Technologies

TLE62512GXUMA3 by Infineon is a 14-terminal interface circuit with 5V supply voltage. It features a small outline package, gull wing terminal form, and AEC-Q100 screening level. Ideal for automotive network interfaces, it has a peak reflow temperature of 260°C and moisture sensitivity level of 2A.

Median Price

$2.999

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5,428 parts In-Stock

1+ parts

$2.830

100+ parts

$1.850

1k+ parts

$1.330

10k+ parts

-

5,428

$2.830

$1.850

$1.330

-

Mouser Electronics

USA . 889 parts In-Stock

1+ parts

$3.170

100+ parts

$1.940

1k+ parts

$1.700

10k+ parts

$1.690

889

$3.170

$1.940

$1.700

$1.690

Newark

USA . 3,780 parts In-Stock

1+ parts

$3.200

100+ parts

$1.980

1k+ parts

$1.750

10k+ parts

-

3,780

$3.200

$1.980

$1.750

-

DigiKey

USA . 651 parts In-Stock

1+ parts

$3.650

100+ parts

$2.253

1k+ parts

$2.000

10k+ parts

-

651

$3.650

$2.253

$2.000

-

Element14

Singapore . 4,384 parts In-Stock

1+ parts

$4.190

100+ parts

$2.580

1k+ parts

$2.330

10k+ parts

$2.210

4,384

$4.190

$2.580

$2.330

$2.210

Rochester

USA . 13,050 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.310

10k+ parts

$1.230

13,050

-

$1.460

$1.310

$1.230

Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.637

10k+ parts

$1.538

12,500

-

-

$1.637

$1.538

Chip1Stop

Japan . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.270

7,500

-

-

-

$1.270

RS (Exports)

UK . 6,520 parts In-Stock

1+ parts

-

100+ parts

$3.168

1k+ parts

$2.858

10k+ parts

-

6,520

-

$3.168

$2.858

-

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.751

5,000

-

-

-

$1.751

EBV Elektronik

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$1.444

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.444

-

-

-

Greenchips

USA . 1,060 parts In-Stock

1+ parts

$1.447

100+ parts

$1.378

1k+ parts

$1.313

10k+ parts

$1.185

1,060

$1.447

$1.378

$1.313

$1.185

Digiode

USA . 345 parts In-Stock

1+ parts

$1.463

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$1.463

-

-

-

Vyrian

USA . 6,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,969

-

-

-

-

NAC Semi

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.360

2,500

-

-

-

$2.360

Cyclops Electronics Ltd

UK . 1,719 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,719

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 1,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,739 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

6,739

$1.080

-

-

-

Semicontronic

India . 6,537 parts In-Stock

1+ parts

$1.080

100+ parts

$1.053

1k+ parts

$1.048

10k+ parts

-

6,537

$1.080

$1.053

$1.048

-

Corphita

USA . 910 parts In-Stock

1+ parts

$1.386

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$1.386

-

-

-

Argo Parts USA

USA . 4,206 parts In-Stock

1+ parts

$1.444

100+ parts

-

1k+ parts

-

10k+ parts

-

4,206

$1.444

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.444

100+ parts

-

1k+ parts

$1.371

10k+ parts

$1.343

100

$1.444

-

$1.371

$1.343

Aztec Data Supply Inc.

USA . 100 parts In-Stock

1+ parts

$9.800

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$9.800

-

-

-

Microchip USA

USA . 3,763 parts In-Stock

1+ parts

$10.121

100+ parts

-

1k+ parts

-

10k+ parts

-

3,763

$10.121

-

-

-

Corohmni

South Africa . 39 parts In-Stock

1+ parts

$12.107

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$12.107

-

-

-

Modulus Dynamics

Lithuania . 2,070 parts In-Stock

1+ parts

$13.124

100+ parts

$12.599

1k+ parts

$12.074

10k+ parts

-

2,070

$13.124

$12.599

$12.074

-

Perfect Parts

USA . 310,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

310,800

-

-

-

-

Continental Prestige Electronics

USA . 5,843 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

$1.340

10k+ parts

-

5,843

-

$1.550

$1.340

-

Eastek

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.990

10k+ parts

-

5,000

-

-

$1.990

-

Overview

Unlock the potential of your network interfaces with the TLE62512GXUMA3 by Infineon Technologies. Designed with top-quality materials and AEC-Q100 screening level, this small outline package delivers superior performance and reliability for a wide range of applications. From automotive to industrial, this interface circuit offers customers unmatched value, benefits, and advantages. Upgrade your systems with the trusted expertise of Infineon Technologies and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

No. of Terminals: 14

Having a high number of terminals allows for more connectivity options and versatility in networking applications.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of nickel gold palladium finish ensures good conductivity and corrosion resistance for reliable connections.

Nominal Supply Voltage: 5 V

Operating at a standard voltage of 5V makes it compatible with most systems and ensures consistent performance.

Moisture Sensitivity Level (MSL): 2A

With a low moisture sensitivity level of 2A, the product can withstand environmental conditions without risking damage.

Technical Specifications

Network Interfaces TLE62512GXUMA3 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.75 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TLE62512GXUMA3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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