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TJA1051TK/3

NXP Semiconductors

TJA1051TK/3 by NXP Semiconductors

NXP's TJA1051TK/3 is an AEC-Q100 compliant CAN transceiver with 5 Mbps data rate, 70 mA max supply current, and 5 V nominal voltage. It comes in a small outline package suitable for automotive applications requiring robust network interfaces.

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Lifecycle Status

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9

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Flip Electronics

USA . 600,000 parts In-Stock

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Digiode

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Anansix

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Cyclops Electronics Ltd

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Vyrian

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Nova Conductors

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ComSIT Distribution GmbH

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Prism Electronics

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$6.192

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$5.883

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$5.883

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500

$6.192

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Corohmni

South Africa . 61 parts In-Stock

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$7.795

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Aztec Data Supply Inc.

USA . 4,659 parts In-Stock

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$12.990

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AZTECH Wire

Italy . 622 parts In-Stock

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$14.258

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One Stop Electronics

USA . 639 parts In-Stock

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Semicontronic

India . 143 parts In-Stock

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$336.375

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$334.650

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Ampacity Inc.

Singapore . 1,580 parts In-Stock

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A-Z Elektronik GmbH

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Technoshack Inc. (Excess)

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Lixinc

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Robosynatics

Brazil . 3,000 parts In-Stock

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Lucentia Tech

USA . 3,000 parts In-Stock

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Bastille Electronics

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Kepictronics

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Overview

Unlock seamless communication and enhanced networking capabilities with the TJA1051TK/3 by NXP Semiconductors. Crafted with precision and reliability, this CAN transceiver is designed for maximum performance in automotive applications. With its compact design and advanced features, it ensures efficient data transmission at a rapid 5 Mbps speed. Elevate your connectivity experience with this cutting-edge product that promises top-notch quality and unparalleled value for customers seeking superior network interfaces.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality standards, making the product suitable for automotive applications where reliability is crucial.

Package Shape: SQUARE

The square package shape offers a compact footprint, making it easy to design into space-constrained layouts while maximizing board space usage.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components or devices, allowing for versatile integration into various systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile design of the package style contributes to better heat dissipation and space efficiency, making it suitable for compact designs.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel, palladium, gold, and silver as terminal finishes ensures good conductivity, corrosion resistance, and durability, enhancing the product's overall performance and longevity.

Terminal Position: DUAL

Having dual terminal positions enhances the product's signal transmission capabilities and allows for more secure connections, improving overall reliability.

Maximum Seated Height: 1 mm

The low seated height of 1 mm enables a slim profile and compact design, making the product suitable for applications with space constraints.

Width: 3 mm

The narrow width of 3 mm allows for efficient use of board space and enables placement in tight spaces, contributing to overall system miniaturization.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds helps prevent overheating during assembly, ensuring the product's reliability and longevity during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes, ensuring secure and reliable connections during assembly.

Length: 3 mm

The compact length of 3 mm allows for space-efficient placement on circuit boards, ideal for designs where size and space optimization are critical.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and complies with RoHS regulations, making the product a sustainable and eco-friendly choice for modern applications.

Maximum Supply Current: 70 mA

With a maximum supply current of 70 mA, the product can efficiently operate within specified power limits, ensuring stable and reliable performance in various applications.

Telecom IC Type: CAN TRANSCEIVER

The CAN transceiver type is ideal for communication in automotive and industrial applications, providing robust and reliable data transmission capability for network interfaces.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources and allows for easy integration into existing systems without requiring additional power configurations.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65 mm enables high-density mounting and efficient use of board space, making the product suitable for compact and space-constrained designs.

Data Rate: 5 Mbps

With a high data rate of 5 Mbps, the product offers fast and reliable data transmission speeds, making it suitable for high-performance networking applications where speed is crucial.

Technical Specifications

Network Interfaces TJA1051TK/3 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

5 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.19,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TJA1051TK/3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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