Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE6250GV33XT by Infineon Technologies is a CAN transceiver with 1 function and 8 terminals. It operates at a nominal voltage of 3.3V and has a small outline package style. This network interface is commonly used in telecom applications.
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The plastic/epoxy package body material provides durability and protection for the network interface, making it a reliable choice for various applications.
The surface mount feature allows for easy and convenient installation on a printed circuit board, streamlining the assembly process and making it an efficient option.
With a single integrated function, this network interface simplifies the overall design and reduces complexity, contributing to a more cost-effective solution.
The rectangular package shape allows for efficient space utilization on the circuit board, making it suitable for compact designs where layout optimization is crucial.
The network interface's eight terminals provide sufficient connectivity options, enabling seamless integration with other components or devices in a network system.
The small outline package style enhances the network interface's versatility, allowing it to be used in a wide range of systems, including space-constrained environments.
The dual terminal position facilitates easy and reliable electrical connections, ensuring stable performance of the network interface even under demanding conditions.
The low maximum seated height minimizes the overall height of the network interface, enabling its integration in slim devices or applications with limited space requirements.
The compact width dimension supports efficient board layouts, enabling the network interface to be used in designs where space optimization is essential.
The compact length dimension allows for flexible placement of the network interface on the circuit board, accommodating diverse design requirements without compromising functionality.
The BICMOS technology used in this network interface offers a combination of bipolar and CMOS circuits, resulting in enhanced performance, low power consumption, and improved reliability.
The gull wing terminal form ensures reliable solder connections and easy handling during the assembly process, promoting the network interface's usability and manufacturing efficiency.
This network interface is specifically designed as a CAN transceiver, making it an ideal choice for applications requiring robust and efficient communication within automotive or industrial networks.
The 3.3 V nominal supply voltage provides compatibility with common voltage levels in various systems, ensuring seamless integration and optimal performance.
The 1.27 mm terminal pitch allows for easy and precise connection to other components, facilitating smooth signal transmission and contributing to the overall reliability of the network interface.
Network Interfaces TLE6250GV33XT attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
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Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
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Technology:
Telecom IC Type:
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TLE6250GV33XT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Secos
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
BAV99
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
ERJ2RKF1002X
Panasonic
Panasonic's ERJ2RKF1002X is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance and operating temperature range of -55 to 155 °C.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
General Semiconductor
LM7805CT
Texas Instruments
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
OPA2277UA
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
LM317BD2TG
Onsemi
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
Rugao Dachang Electronic
LAN8742AI-CZ
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
TJA1044T/1Z
NXP Semiconductors
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
ISO1050DW
ISO1050DW by Texas Instruments is a network interface IC with 16 terminals in a small outline package. It operates at temperatures ranging from -55 to 105 °C and has a nominal voltage of 5V. This interface circuit is commonly used in telecom applications.
TJA1042T/3
NXP Semiconductors' TJA1042T/3 is an AEC-Q100 compliant interface circuit with 1Mbps data rate, suitable for automotive applications. It operates at a voltage of 5V, with a low supply current of 0.07mA. The package style is small outline, making it ideal for space-constrained designs.
KSZ8995XA
Micrel
LAN SWITCHING CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
VSC8514XMK-14
Microchip Technology
VSC8514XMK-14 by Microchip: 4 Ethernet transceivers, 1000 Mbps data rate, 605 mA max supply current. Ideal for automotive applications with operating temp range -40 to 125°C. Chip carrier package style with 138 terminals in square shape.
LAN8742AI-CZ-TR
MAX33040EAKA+T
Maxim Integrated
CAN TRANSCEIVER; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD;
KSZ8721CL
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
TCAN1042HGVDRBRQ1
Texas Instruments' TCAN1042HGVDRBRQ1 is an Ethernet transceiver with 5 Mbps data rate, operating at -55 to 125°C. It features a small outline package with 8 terminals and matte tin finish, suitable for military-grade applications. With a nominal voltage of 5V and max supply current of 110mA, it is ideal for automotive electronics requiring AEC-Q100 screening.
DP83865DVH
DP83865DVH by Texas Instruments is an Ethernet transceiver IC with a data rate of 1000 Mbps. It operates at a supply voltage of 1.8V and has a terminal pitch of 0.5mm. This network interface chip is designed for commercial temperature grade applications.
DP83867IRPAPR
DP83867IRPAPR by Texas Instruments is an Ethernet transceiver with 8 transceivers, supporting data rate of 1000000 Mbps. It operates in industrial temperature range (-40 to 85 °C) and has a package style of flatpack with gull wing terminals. Ideal for network interfaces requiring high-speed connectivity in harsh environments.
TJA1044GT/1Z
INTERFACE CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1;
KSZ8041TL
Microchip Technology's KSZ8041TL is a Network Interface with 100 Mbps data rate, 3.3V supply voltage, and 58.3mA supply current. It is an Ethernet transceiver suitable for commercial temperature grade applications in various electronic devices requiring network connectivity.
LAN8741A-EN
LAN8741A-EN by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 0-70°C. Features 32 terminals in a square chip carrier package for surface mount applications. Ideal for commercial telecom systems requiring TS16949 screening level.
TJA1057GTJ
NXP Semiconductors' TJA1057GTJ is a network interface IC with 5V supply voltage, 8 terminals, and 5 Mbps data rate. It is AEC-Q100 compliant for automotive applications, featuring gull wing terminal form and small outline package style. Suitable for telecom interfaces, it has a compact rectangular shape ideal for surface mount assembly.
TJA1029TK,118
NXP Semiconductors' TJA1029TK,118 is an AEC-Q100 compliant network interface IC with 8 terminals in a small outline package. It operates at 5V nominal voltage and can withstand peak reflow temperature of 260°C for up to 30 seconds. Ideal for telecom applications requiring interface circuitry with a compact form factor.
88E1111-XX-BAB1I000
Marvell Technology
Marvell Technology's 88E1111-XX-BAB1I000 is a CMOS Ethernet transceiver with a data rate of 1000 Mbps. Its package style is grid array, low profile, and it has 117 terminals in a rectangular shape. This network interface IC is designed for telecom applications requiring high-speed connectivity.
ISO1042BDWV
ISO1042BDWV by Texas Instruments is an 8-terminal network interface with a small outline package style. It operates b/w -40 to 125°C, ideal for automotive applications. With nickel palladium gold terminal finish and gull wing form, it has a nominal voltage of 5V.
TJA1050T/V,112
NXP Semiconductors' TJA1050T/V,112 is a network interface IC with 8 terminals and 5V supply voltage. It operates at data rates up to 1 Mbps, suitable for automotive applications due to its temperature range of -40 to 125°C. The small outline package with gull wing terminals makes it ideal for surface mount designs in various electronic systems.
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TLE6250GV33XUMA1
Infineon Technologies
TLE6250GV33XUMA1 by Infineon Technologies is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its surface mount capability and gull wing terminal form.
TLE6250GV33
TLE6250GV33 by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, operating at 3.3V nominal voltage. It features BICMOS technology, AEC-Q100 screening level, and GULL WING terminal form. Ideal for automotive network interfaces due to its small outline package style and dual terminal position.
TLE6250GXUMA1
TLE6250GXUMA1 by Infineon Technologies is a CAN transceiver with BICMOS technology, 8 terminals, and 5V supply voltage. It is used in network interfaces for automotive applications due to its small outline package and gull wing terminal form.
TLE6250GV33NT
TLE6250GV33NT by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6250GV33NTMA1
TLE6250GV33NTMA1 by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6251DSXUMA2
TLE6251DSXUMA2 by Infineon is a small outline network interface IC with 8 terminals, 5V supply voltage, and AEC-Q100 screening. It has a gull wing terminal form, tin finish, and is suitable for telecom applications due to its interface circuit design.
TLE62512GXUMA3
TLE62512GXUMA3 by Infineon is a 14-terminal interface circuit with 5V supply voltage. It features a small outline package, gull wing terminal form, and AEC-Q100 screening level. Ideal for automotive network interfaces, it has a peak reflow temperature of 260°C and moisture sensitivity level of 2A.
TLE62513GXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2A;
TLE6251DXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE6250GXT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE6250G
TLE6250G by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, 5V supply voltage, and BICMOS technology. It has 8 terminals in a small outline package for automotive applications meeting AEC-Q100 standards. The device is surface mountable with gull wing terminal form and operates at a max supply current of 0.07 mA.
TLE62543GXUMA1
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TLE6251-2G
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP14,.25;
TLE62512GXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Width: 4 mm;
TLE6250GNT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
TLE6250CX3MA2
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
TLE6250GNTMA1
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE6250RV33
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE6250CV33
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
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