Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE6250GV33XT by Infineon Technologies is a CAN transceiver with 1 function and 8 terminals. It operates at a nominal voltage of 3.3V and has a small outline package style. This network interface is commonly used in telecom applications.
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The plastic/epoxy package body material provides durability and protection for the network interface, making it a reliable choice for various applications.
The surface mount feature allows for easy and convenient installation on a printed circuit board, streamlining the assembly process and making it an efficient option.
With a single integrated function, this network interface simplifies the overall design and reduces complexity, contributing to a more cost-effective solution.
The rectangular package shape allows for efficient space utilization on the circuit board, making it suitable for compact designs where layout optimization is crucial.
The network interface's eight terminals provide sufficient connectivity options, enabling seamless integration with other components or devices in a network system.
The small outline package style enhances the network interface's versatility, allowing it to be used in a wide range of systems, including space-constrained environments.
The dual terminal position facilitates easy and reliable electrical connections, ensuring stable performance of the network interface even under demanding conditions.
The low maximum seated height minimizes the overall height of the network interface, enabling its integration in slim devices or applications with limited space requirements.
The compact width dimension supports efficient board layouts, enabling the network interface to be used in designs where space optimization is essential.
The compact length dimension allows for flexible placement of the network interface on the circuit board, accommodating diverse design requirements without compromising functionality.
The BICMOS technology used in this network interface offers a combination of bipolar and CMOS circuits, resulting in enhanced performance, low power consumption, and improved reliability.
The gull wing terminal form ensures reliable solder connections and easy handling during the assembly process, promoting the network interface's usability and manufacturing efficiency.
This network interface is specifically designed as a CAN transceiver, making it an ideal choice for applications requiring robust and efficient communication within automotive or industrial networks.
The 3.3 V nominal supply voltage provides compatibility with common voltage levels in various systems, ensuring seamless integration and optimal performance.
The 1.27 mm terminal pitch allows for easy and precise connection to other components, facilitating smooth signal transmission and contributing to the overall reliability of the network interface.
Network Interfaces TLE6250GV33XT attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
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Peak Reflow Temperature (C):
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TLE6250GV33XT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Texas Instruments
ULN2803A by Texas Instruments is a peripheral driver with 8 functions. It has a max supply voltage of 3V and can operate in temperatures ranging from -40 to 85°C. This IC is commonly used as a buffer or inverter based peripheral driver for various applications.
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
SMBJ18CA
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
Crimson Semiconductor
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
TLE7250GXUMA1
Infineon Technologies
TLE7250GXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 1.27mm terminal pitch. It is designed for telecom applications requiring small outline package style and dual terminal position for compact designs.
KSZ9131RNXI
Microchip Technology
The Microchip Technology KSZ9131RNXI is an Ethernet transceiver with a data rate of 1000 Mbps. It operates in industrial temperature range from -40 to 85°C and has a supply voltage of 1.2V. This network interface chip comes in a square chip carrier package with 48 terminals, suitable for surface mount applications.
DP83640TVV
DP83640TVV by Texas Instruments is an Ethernet transceiver with 100000 Mbps data rate. It operates at 3.3 V, suitable for industrial temperature range (-40 to 85 °C). The package style is flatpack, low profile, fine pitch, with a quad terminal position.
NTS0104BQ,115
NXP Semiconductors
NTS0104BQ,115 by NXP Semiconductors is a Network Interface with 4 functions. It operates in automotive grade at temperatures from -40 to 125°C. This interface circuit has a nominal voltage of 3.3V and comes in a chip carrier package style for various applications.
KSZ9021RLI
KSZ9021RLI by Microchip Technology is an Ethernet transceiver with a data rate of 1000 Mbps. It operates in an industrial temperature range of -40 to 85 °C and has a compact package size of 10mm x 10mm, making it suitable for network interface applications.
SN65HVD233HD
SN65HVD233HD by Texas Instruments is a network interface IC with 8 terminals, operating at 3.3V. It has a data rate of 1 Mbps and can withstand temperatures from -55 to 175°C. Ideal for military-grade applications requiring reliable communication in harsh environments.
DP83849IFVS/NOPB
DP83849IFVS/NOPB by Texas Instruments is a Network Interface with 2 transceivers supporting 100000 Mbps data rate. Operating at 3.3V, it has a temperature range of -40 to 85 °C and comes in a square package with GULL WING terminals. Ideal for Ethernet applications in industrial settings.
KSZ8041MLL
Microchip Technology's KSZ8041MLL is an Ethernet transceiver with 100 Mbps data rate, operating at 0-70°C. It features a 48-terminal flatpack package with matte tin finish, suitable for network interfaces in commercial-grade applications. The IC has a low profile of 1.6 mm and consumes up to 58.3 mA at 3.3 V supply voltage.
KSZ8041FTLI
KSZ8041FTLI by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at -40 to 85°C. Features 48 terminals in a thin profile flatpack package. Ideal for industrial applications requiring reliable network interfaces.
MCP2551-E/P
MCP2551-E/P by Microchip Tech is a CAN transceiver with 5V supply, 1 Mbps data rate, and TS16949 screening. Ideal for automotive applications due to -40 to 125 °C operating temp range and matte tin finish on terminals. Package style is in-line with 8 terminals in rectangular shape.
KSZ8794CNXCC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HQCCN; Package Shape: SQUARE;
DP83848IVV
DP83848IVV by Texas Instruments is an Ethernet transceiver with 48 terminals in a square package. It operates at -40 to 85°C, suitable for industrial use. With a supply voltage of 3.3V and CMOS technology, it's ideal for network interfaces in various applications.
MCP2562FD-H/SN
MCP2562FD-H/SN by Microchip: CAN FD transceiver, 8 Mbps data rate, 5V supply voltage. Automotive grade for network interfaces in vehicles. Small outline package with dual terminals and matte tin finish.
KSZ8041TLI
KSZ8041TLI by Microchip Tech is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85°C. It has a 48-terminal flatpack package style, matte tin finish, and requires 3.3V supply voltage. Ideal for industrial applications requiring reliable network interfaces in compact spaces.
KSZ9031RNXUB-TRVAO
Microchip's KSZ9031RNXUB-TRVAO is an Ethernet transceiver with 1000 Mbps data rate, operating from -40 to 85 °C. It features a square chip carrier package with 48 terminals and matte tin finish. Ideal for industrial applications requiring reliable network interfaces in tight spaces.
TJA1028T/3V3/20/1J
NXP Semiconductors' TJA1028T/3V3/20/1J is a LIN transceiver with 8 terminals, operating voltage of 3.3V, and max supply current of 4.5mA. It has AEC-Q100 screening level for automotive applications, with temp range from -40 to 150°C. Package style is small outline, suitable for surface mount assembly in compact designs.
WJLXT971ALE.A4SE001
Cortina Systems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
IFX1051LEXUMA1
IFX1051LEXUMA1 by Infineon Technologies is a Network Interface with 8 terminals, operating temperature range of -40 to 125°C. It features a small outline package style and is suitable for automotive applications requiring a 5V supply voltage. The IC type is an interface circuit designed for surface mount assembly with tin terminal finish.
AR8031-AL1B-R
Qualcomm Atheros
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
TJA1042T,118
NXP Semiconductors' TJA1042T,118 is a network interface with 8 terminals and 5V supply voltage. Operating b/w -40 to 125°C, it supports data rates up to 1 Mbps. Ideal for automotive applications, this IC features a small outline package and dual terminal position.
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TLE6250GV33XUMA1
TLE6250GV33XUMA1 by Infineon Technologies is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its surface mount capability and gull wing terminal form.
TLE6250GV33
TLE6250GV33 by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, operating at 3.3V nominal voltage. It features BICMOS technology, AEC-Q100 screening level, and GULL WING terminal form. Ideal for automotive network interfaces due to its small outline package style and dual terminal position.
TLE6250GXUMA1
TLE6250GXUMA1 by Infineon Technologies is a CAN transceiver with BICMOS technology, 8 terminals, and 5V supply voltage. It is used in network interfaces for automotive applications due to its small outline package and gull wing terminal form.
TLE6250GV33NT
TLE6250GV33NT by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6250GV33NTMA1
TLE6250GV33NTMA1 by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6251DSXUMA2
TLE6251DSXUMA2 by Infineon is a small outline network interface IC with 8 terminals, 5V supply voltage, and AEC-Q100 screening. It has a gull wing terminal form, tin finish, and is suitable for telecom applications due to its interface circuit design.
TLE62512GXUMA3
TLE62512GXUMA3 by Infineon is a 14-terminal interface circuit with 5V supply voltage. It features a small outline package, gull wing terminal form, and AEC-Q100 screening level. Ideal for automotive network interfaces, it has a peak reflow temperature of 260°C and moisture sensitivity level of 2A.
TLE62513GXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2A;
TLE6251DXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE6250GXT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE6250G
TLE6250G by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, 5V supply voltage, and BICMOS technology. It has 8 terminals in a small outline package for automotive applications meeting AEC-Q100 standards. The device is surface mountable with gull wing terminal form and operates at a max supply current of 0.07 mA.
TLE62543GXUMA1
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TLE6251-2G
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP14,.25;
TLE62512GXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Width: 4 mm;
TLE6250GNT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
TLE6250CX3MA2
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
TLE6250GNTMA1
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE6250RV33
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE6250CV33
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
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