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TLE6250GV33XT

Infineon Technologies

TLE6250GV33XT by Infineon Technologies

TLE6250GV33XT by Infineon Technologies is a CAN transceiver with 1 function and 8 terminals. It operates at a nominal voltage of 3.3V and has a small outline package style. This network interface is commonly used in telecom applications.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 4,230 parts In-Stock

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Nova Conductors

Japan . 800 parts In-Stock

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800

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Vyrian

USA . 742 parts In-Stock

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742

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Digiode

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Sensible Micro Corp

USA . 70 parts In-Stock

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AZTECH Wire

Italy . 505 parts In-Stock

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$6.974

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$8.937

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$8.490

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$8.490

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Corohmni

South Africa . 17 parts In-Stock

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$12.699

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Modulus Dynamics

Lithuania . 3,406 parts In-Stock

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$13.107

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$12.583

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$12.058

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Aztec Data Supply Inc.

USA . 4,979 parts In-Stock

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$16.430

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Ampacity Inc.

Singapore . 875 parts In-Stock

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Semicontronic

India . 1,449 parts In-Stock

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$848.750

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

Australia . 500 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$29.904

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$29.904

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$29.904

100

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$29.904

$29.904

$29.904

Overview

Experience seamless networking with the TLE6250GV33XT by Infineon Technologies. As a leading manufacturer, Infineon Technologies is known for delivering top-quality products that meet industry standards. The TLE6250GV33XT belongs to the Network Interfaces category and offers a range of applications. With its compact and durable package body material, this product ensures hassle-free installation. Its advanced BICMOS technology guarantees high performance and reliability. Whether you're in the telecommunications industry or looking for a reliable CAN transceiver, the TLE6250GV33XT is your go-to solution. Unlock the potential of seamless networking with this outstanding product from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the network interface, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on a printed circuit board, streamlining the assembly process and making it an efficient option.

No. of Functions: 1

With a single integrated function, this network interface simplifies the overall design and reduces complexity, contributing to a more cost-effective solution.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on the circuit board, making it suitable for compact designs where layout optimization is crucial.

No. of Terminals: 8

The network interface's eight terminals provide sufficient connectivity options, enabling seamless integration with other components or devices in a network system.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the network interface's versatility, allowing it to be used in a wide range of systems, including space-constrained environments.

Terminal Position: DUAL

The dual terminal position facilitates easy and reliable electrical connections, ensuring stable performance of the network interface even under demanding conditions.

Maximum Seated Height: 1.75 mm

The low maximum seated height minimizes the overall height of the network interface, enabling its integration in slim devices or applications with limited space requirements.

Width: 4 mm

The compact width dimension supports efficient board layouts, enabling the network interface to be used in designs where space optimization is essential.

Length: 5 mm

The compact length dimension allows for flexible placement of the network interface on the circuit board, accommodating diverse design requirements without compromising functionality.

Technology: BICMOS

The BICMOS technology used in this network interface offers a combination of bipolar and CMOS circuits, resulting in enhanced performance, low power consumption, and improved reliability.

Terminal Form: GULL WING

The gull wing terminal form ensures reliable solder connections and easy handling during the assembly process, promoting the network interface's usability and manufacturing efficiency.

Telecom IC Type: CAN TRANSCEIVER

This network interface is specifically designed as a CAN transceiver, making it an ideal choice for applications requiring robust and efficient communication within automotive or industrial networks.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage provides compatibility with common voltage levels in various systems, ensuring seamless integration and optimal performance.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy and precise connection to other components, facilitating smooth signal transmission and contributing to the overall reliability of the network interface.

Technical Specifications

Network Interfaces TLE6250GV33XT attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

TLE6250GV33XT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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