Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TLE6250GV33XT by Infineon Technologies is a CAN transceiver with 1 function and 8 terminals. It operates at a nominal voltage of 3.3V and has a small outline package style. This network interface is commonly used in telecom applications.
Median Price
-
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
Chip Stock
1+ parts
100+ parts
1k+ parts
10k+ parts
Nova Conductors
Vyrian
Digiode
Sensible Micro Corp
AZTECH Wire
$6.974
Advanced Electronics
$8.937
$8.490
Corohmni
$12.699
Modulus Dynamics
$13.107
$12.583
$12.058
Aztec Data Supply Inc.
$16.430
Ampacity Inc.
$709.000
Semicontronic
$875.000
$853.125
$848.750
Authorized Procurement Solutions
Argo Parts USA
Continental Prestige Electronics
Corphita
Bastille Electronics
Robosynatics
Lucentia Tech
$29.904
The plastic/epoxy package body material provides durability and protection for the network interface, making it a reliable choice for various applications.
The surface mount feature allows for easy and convenient installation on a printed circuit board, streamlining the assembly process and making it an efficient option.
With a single integrated function, this network interface simplifies the overall design and reduces complexity, contributing to a more cost-effective solution.
The rectangular package shape allows for efficient space utilization on the circuit board, making it suitable for compact designs where layout optimization is crucial.
The network interface's eight terminals provide sufficient connectivity options, enabling seamless integration with other components or devices in a network system.
The small outline package style enhances the network interface's versatility, allowing it to be used in a wide range of systems, including space-constrained environments.
The dual terminal position facilitates easy and reliable electrical connections, ensuring stable performance of the network interface even under demanding conditions.
The low maximum seated height minimizes the overall height of the network interface, enabling its integration in slim devices or applications with limited space requirements.
The compact width dimension supports efficient board layouts, enabling the network interface to be used in designs where space optimization is essential.
The compact length dimension allows for flexible placement of the network interface on the circuit board, accommodating diverse design requirements without compromising functionality.
The BICMOS technology used in this network interface offers a combination of bipolar and CMOS circuits, resulting in enhanced performance, low power consumption, and improved reliability.
The gull wing terminal form ensures reliable solder connections and easy handling during the assembly process, promoting the network interface's usability and manufacturing efficiency.
This network interface is specifically designed as a CAN transceiver, making it an ideal choice for applications requiring robust and efficient communication within automotive or industrial networks.
The 3.3 V nominal supply voltage provides compatibility with common voltage levels in various systems, ensuring seamless integration and optimal performance.
The 1.27 mm terminal pitch allows for easy and precise connection to other components, facilitating smooth signal transmission and contributing to the overall reliability of the network interface.
Network Interfaces TLE6250GV33XT attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
TLE6250GV33XT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Rfe International
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Asi Semiconductor
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
Panjit International
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
Telcom Semiconductor
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Kingwell Technonlogy
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MCP2562FDT-E/MF
Microchip Technology
MCP2562FDT-E/MF by Microchip is a CAN FD transceiver with 8 Mbps data rate, operating at -40 to 125 °C. It has 8 terminals, matte tin finish, and small outline package suitable for automotive applications. The IC supports a nominal voltage of 5 V with a max supply current of 70 mA.
ADM3055EBRIZ-RL
Analog Devices
ADM3055EBRIZ-RL by Analog Devices is a network interface IC with 20 terminals, operating b/w -40 to 105°C. It has a supply current of 260mA at 5V and Gull Wing terminal form. Ideal for industrial applications requiring Interface Circuit Telecom ICs in compact SMD packages.
TLE6250GV33XT
KSZ8081RNAIA-G3XX-TR
KSZ8081RNAIA-G3XX-TR by Microchip is a 24-terminal Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a square chip carrier package style suitable for industrial applications requiring reliable network interfaces. The IC has a terminal pitch of 0.5 mm and operates at a nominal voltage of 3.3 V.
TJA1028TK/5V0/20:1
NXP Semiconductors
NXP Semiconductors' TJA1028TK/5V0/20:1 is a LIN transceiver with 1 function, operating at -40 to 150°C. It has a supply voltage of 3.3V and draws a max current of 4.5mA. This small outline package with 8 terminals is ideal for automotive network interfaces.
KSZ8851SNLI
KSZ8851SNLI by Microchip Technology is a network interface chip with 32 terminals and a package shape of square. It operates in an industrial temperature range of -40 to 85 °C and has a nominal voltage of 1.8 V. This Ethernet transceiver is suitable for various telecom applications.
KSZ9131RNXV-VAO
KSZ9131RNXV-VAO by Microchip: Ethernet transceiver with 1000 Mbps data rate, operates at -40 to 105 °C, in industrial settings. Features quad terminals, matte tin finish, and AEC-Q100 screening for automotive applications. Package style is chip carrier with very thin profile.
MAX3051ESA+TCJN
Maxim Integrated
INTERFACE CIRCUIT;
88E1512-XX-NNP2I000
Marvell Technology
Marvell's 88E1512-XX-NNP2I000 is a square-shaped Ethernet transceiver chip carrier with 56 terminals. It operates at a nominal voltage of 3.3V and is designed for network interfaces, suitable for surface mount applications in telecom equipment.
SN65HVD233DRG4
SN65HVD233DRG4 by Texas Instruments is a network interface IC with 1 channel and a data rate of 1 Mbps. It operates at temperatures ranging from -40 to 125 °C and has a small outline package style, making it suitable for automotive applications.
MCP2551-I/SNVAO
MCP2551-I/SNVAO by Microchip Tech is a CAN transceiver with 1Mbps data rate, 5V supply voltage, and 75mA max supply current. Ideal for industrial applications, it operates b/w -40 to 85°C and features AEC-Q100 screening level for automotive use.
KSZ8041FTLI
KSZ8041FTLI by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at -40 to 85°C. Features 48 terminals in a thin profile flatpack package. Ideal for industrial applications requiring reliable network interfaces.
WJLXT971ALE.A4SE001
Cortina Systems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
SN65HVD235QDRQ1
SN65HVD235QDRQ1 by Texas Instruments is an AEC-Q100 compliant interface circuit with 1Mbps data rate, operating b/w -40 to 125°C. It features a small outline package with 8 terminals and is ideal for automotive applications requiring reliable network interfaces.
LAN8710AI-EZK-TR
LAN8710AI-EZK-TR by Microchip is a 32-terminal Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3V power supply, matte tin finish, and square package shape suitable for industrial applications requiring network interfaces.
KSZ8851-16MLLI-TR
Microchip Technology's KSZ8851-16MLLI-TR is an Ethernet transceiver with 48 terminals in a low profile flatpack package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features include CMOS technology, matte tin finish, and TS 16949 screening level.
KSZ9031MNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;
LAN8710AI-EZK
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
LTC2875IS8#TRPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
KSZ8081MNXIA-TR
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TLE6250GV33XUMA1
TLE6250GV33XUMA1 by Infineon Technologies is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its surface mount capability and gull wing terminal form.
TLE6250GV33
TLE6250GV33 by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, operating at 3.3V nominal voltage. It features BICMOS technology, AEC-Q100 screening level, and GULL WING terminal form. Ideal for automotive network interfaces due to its small outline package style and dual terminal position.
TLE6250GXUMA1
TLE6250GXUMA1 by Infineon Technologies is a CAN transceiver with BICMOS technology, 8 terminals, and 5V supply voltage. It is used in network interfaces for automotive applications due to its small outline package and gull wing terminal form.
TLE6250GV33NT
TLE6250GV33NT by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6250GV33NTMA1
TLE6250GV33NTMA1 by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6251DSXUMA2
TLE6251DSXUMA2 by Infineon is a small outline network interface IC with 8 terminals, 5V supply voltage, and AEC-Q100 screening. It has a gull wing terminal form, tin finish, and is suitable for telecom applications due to its interface circuit design.
TLE62512GXUMA3
TLE62512GXUMA3 by Infineon is a 14-terminal interface circuit with 5V supply voltage. It features a small outline package, gull wing terminal form, and AEC-Q100 screening level. Ideal for automotive network interfaces, it has a peak reflow temperature of 260°C and moisture sensitivity level of 2A.
TLE62513GXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2A;
TLE6251DXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE6250GXT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE6250G
TLE6250G by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, 5V supply voltage, and BICMOS technology. It has 8 terminals in a small outline package for automotive applications meeting AEC-Q100 standards. The device is surface mountable with gull wing terminal form and operates at a max supply current of 0.07 mA.
TLE62543GXUMA1
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TLE6251-2G
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP14,.25;
TLE62512GXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Width: 4 mm;
TLE6250GNT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
TLE6250CX3MA2
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
TLE6250GNTMA1
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE6250RV33
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE6250CV33
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved