Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE6250GV33XT by Infineon Technologies is a CAN transceiver with 1 function and 8 terminals. It operates at a nominal voltage of 3.3V and has a small outline package style. This network interface is commonly used in telecom applications.
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The plastic/epoxy package body material provides durability and protection for the network interface, making it a reliable choice for various applications.
The surface mount feature allows for easy and convenient installation on a printed circuit board, streamlining the assembly process and making it an efficient option.
With a single integrated function, this network interface simplifies the overall design and reduces complexity, contributing to a more cost-effective solution.
The rectangular package shape allows for efficient space utilization on the circuit board, making it suitable for compact designs where layout optimization is crucial.
The network interface's eight terminals provide sufficient connectivity options, enabling seamless integration with other components or devices in a network system.
The small outline package style enhances the network interface's versatility, allowing it to be used in a wide range of systems, including space-constrained environments.
The dual terminal position facilitates easy and reliable electrical connections, ensuring stable performance of the network interface even under demanding conditions.
The low maximum seated height minimizes the overall height of the network interface, enabling its integration in slim devices or applications with limited space requirements.
The compact width dimension supports efficient board layouts, enabling the network interface to be used in designs where space optimization is essential.
The compact length dimension allows for flexible placement of the network interface on the circuit board, accommodating diverse design requirements without compromising functionality.
The BICMOS technology used in this network interface offers a combination of bipolar and CMOS circuits, resulting in enhanced performance, low power consumption, and improved reliability.
The gull wing terminal form ensures reliable solder connections and easy handling during the assembly process, promoting the network interface's usability and manufacturing efficiency.
This network interface is specifically designed as a CAN transceiver, making it an ideal choice for applications requiring robust and efficient communication within automotive or industrial networks.
The 3.3 V nominal supply voltage provides compatibility with common voltage levels in various systems, ensuring seamless integration and optimal performance.
The 1.27 mm terminal pitch allows for easy and precise connection to other components, facilitating smooth signal transmission and contributing to the overall reliability of the network interface.
Network Interfaces TLE6250GV33XT attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
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Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
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Telecom IC Type:
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TLE6250GV33XT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
STM32F405RGT6TR
STMicroelectronics
STM32F405RGT6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 26 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Nexperia
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Diotec Semiconductor Ag
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
Hy Electronic
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
STM32H753ZIT6
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Onsemi
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
Excel (Suzhou) Semiconductor
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SS14
LM317LMX/NOPB
Texas Instruments
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
KSZ9031RNXUB-VAO
Microchip Technology
Microchip Technology's KSZ9031RNXUB-VAO is an Ethernet transceiver with 1000 Mbps data rate, AEC-Q100 screening level, and operates at -40 to 85°C. It has a square chip carrier package style suitable for industrial applications requiring reliable network interfaces.
TCAN1051HDRQ1
TCAN1051HDRQ1 by Texas Instruments is a Network Interface with AEC-Q100 screening. It operates b/w -55 to 125°C, supporting data rates up to 2 Mbps. Ideal for automotive applications due to its MILITARY temperature grade and small outline package design.
PCA82C251T
CAN TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
TJA1462AT/0Z
NXP Semiconductors
NXP Semiconductors' TJA1462AT/0Z is a CAN FD transceiver with 8 Mbps data rate. It operates at a nominal voltage of 5V and has a max supply current of 70mA. This small outline package is suitable for network interfaces in automotive applications.
MCP2551-E/P
MCP2551-E/P by Microchip Tech is a CAN transceiver with 5V supply, 1 Mbps data rate, and TS16949 screening. Ideal for automotive applications due to -40 to 125 °C operating temp range and matte tin finish on terminals. Package style is in-line with 8 terminals in rectangular shape.
AR8033-AL1A-R
Qualcomm
Qualcomm's AR8033-AL1A-R is a network interface chip with 48 terminals and a square package shape. It operates at temperatures ranging from 0 to 70 °C and has a data rate of 1000 Mbps. This Ethernet transceiver is commonly used in commercial applications requiring high-speed networking capabilities.
LTC2875MPDD#PBF
Analog Devices
LTC2875MPDD#PBF by Analog Devices is a BICMOS technology interface circuit with 8 terminals, operating from -55 to 125°C. It features matte tin finish, small outline package style, and is suitable for telecom applications requiring a 3.3V supply voltage in military-grade temperature environments.
MCP251863T-H/SS
CAN FD TRANSCEIVER;
KSZ9031MNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;
VSC8541XMV-02
VSC8541XMV-02 by Microchip Tech is an Ethernet transceiver with 1000 Mbps data rate. It operates b/w 0-125°C, has 68 terminals in a square package style, and is surface mountable. Ideal for telecom applications requiring high-speed network interfaces.
VSC8514XMK-03
Microsemi
ETHERNET TRANSCEIVER; Terminal Form: BUTT; No. of Terminals: 138; Package Code: HVBCC; Package Shape: SQUARE; JESD-30 Code: S-PBCC-B138;
DP83865DVH/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
PCA82C250T/N4,118
PCA82C250T/N4,118 by NXP Semiconductors is an automotive-grade interface circuit with 5V supply voltage. It features BICMOS technology, operates b/w -40 to 125 °C, and has a small outline package style. Ideal for network interfaces in automotive applications due to its nickel palladium gold terminal finish and dual terminal position.
TCAN1044AEVDRQ1
TCAN1044AEVDRQ1 by Texas Instruments is a CAN FD transceiver with 8 Mbps data rate, operating at -40 to 150°C. It has 8 terminals in a small outline package suitable for automotive applications meeting AEC-Q100 standards. The device supports a nominal voltage of 5V and consumes up to 130mA supply current.
LTC2875HDD#PBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
KSZ8794CNXIC
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HQCCN; Package Shape: SQUARE;
MCP2561T-E/SNVAO
MCP2561T-E/SNVAO by Microchip is an AEC-Q100, TS 16949 certified CAN transceiver with 1Mbps data rate. Operating at -40 to 125°C, it has a supply voltage of 5V and consumes max. 70mA current. Ideal for automotive applications due to its small outline package and dual terminal position.
USB3320C-EZK
Standard Microsystems
USB3320C-EZK by Standard Microsystems is a surface mount network interface with 1 function and 32 terminals. It has a square package shape, very thin profile, and operates in industrial temperature range (-40 to 85 °C). It is commonly used as an interface circuit for telecom applications.
WJLXT971ALE.A4
Cortina Systems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
ISO1042BDWR
ISO1042BDWR by Texas Instruments is a 16-terminal network interface with a small outline package style. It operates in temperatures ranging from -40 to 125°C, making it suitable for automotive applications. The terminal finish is nickel palladium gold, and it has a gull wing terminal form for easy installation.
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TLE6250GV33XUMA1
Infineon Technologies
TLE6250GV33XUMA1 by Infineon Technologies is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its surface mount capability and gull wing terminal form.
TLE6250GV33
TLE6250GV33 by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, operating at 3.3V nominal voltage. It features BICMOS technology, AEC-Q100 screening level, and GULL WING terminal form. Ideal for automotive network interfaces due to its small outline package style and dual terminal position.
TLE6250GXUMA1
TLE6250GXUMA1 by Infineon Technologies is a CAN transceiver with BICMOS technology, 8 terminals, and 5V supply voltage. It is used in network interfaces for automotive applications due to its small outline package and gull wing terminal form.
TLE6250GV33NT
TLE6250GV33NT by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6250GV33NTMA1
TLE6250GV33NTMA1 by Infineon is a CAN transceiver with 3.3V supply voltage, BICMOS technology, and 8 terminals in a small outline package. It is used for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE6251DSXUMA2
TLE6251DSXUMA2 by Infineon is a small outline network interface IC with 8 terminals, 5V supply voltage, and AEC-Q100 screening. It has a gull wing terminal form, tin finish, and is suitable for telecom applications due to its interface circuit design.
TLE62512GXUMA3
TLE62512GXUMA3 by Infineon is a 14-terminal interface circuit with 5V supply voltage. It features a small outline package, gull wing terminal form, and AEC-Q100 screening level. Ideal for automotive network interfaces, it has a peak reflow temperature of 260°C and moisture sensitivity level of 2A.
TLE62513GXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2A;
TLE6251DXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE6250GXT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE6250G
TLE6250G by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, 5V supply voltage, and BICMOS technology. It has 8 terminals in a small outline package for automotive applications meeting AEC-Q100 standards. The device is surface mountable with gull wing terminal form and operates at a max supply current of 0.07 mA.
TLE62543GXUMA1
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TLE6251-2G
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP14,.25;
TLE62512GXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Width: 4 mm;
TLE6250GNT
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
TLE6250CX3MA2
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
TLE6250GNTMA1
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE6250RV33
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE6250CV33
CAN TRANSCEIVER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; No. of Functions: 1;
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