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TLE6251-2G

Infineon Technologies

TLE6251-2G by Infineon Technologies

TLE6251-2G by Infineon Technologies is a network interface IC with 14 terminals, BCDMOS technology, and 1 Mbps data rate. It operates at a nominal voltage of 5V and has a max supply current of 0.08 mA. This small outline package is commonly used in automotive applications for interface circuits due to its AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 4,372 parts In-Stock

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Bristol Electronics

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Q Components

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Vyrian

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Bas Electronics GmbH & Co. KG

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ACDS - Activité Composants Distribution Service

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Digiode

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R&J Components

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LIBRA Elektronik GmbH

Germany . 240 parts In-Stock

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Nova Conductors

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Corohmni

South Africa . 218 parts In-Stock

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$7.849

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AZTECH Wire

Italy . 487 parts In-Stock

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$15.868

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Modulus Dynamics

Lithuania . 463 parts In-Stock

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$16.812

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Ampacity Inc.

Singapore . 1,536 parts In-Stock

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Kepictronics

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Lixinc

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Futuretech Components

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A-Z Elektronik GmbH

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S.R.D Solutions

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Argo Parts USA

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Microchip USA

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GreenTree Electronics

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Authorized Procurement Solutions

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Assy Fe

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Continental Prestige Electronics

USA . 472 parts In-Stock

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Aranea Global

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Corphita

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Overview

Experience seamless communication and connectivity with the TLE6251-2G by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and reliability in their network interfaces, making them ideal for a wide range of applications. With its small outline package, dual terminal position, and high data rate of 1 Mbps, this interface circuit offers unparalleled performance and efficiency. Trust in Infineon Technologies to provide you with the cutting-edge technology you need for your networking needs. Elevate your connectivity experience with the TLE6251-2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving time and cost.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making the product suitable for automotive applications.

Power Supplies (V): 5,6/18

Multiple power supply options provide flexibility in different voltage environments, enhancing compatibility.

No. of Terminals: 14

Having 14 terminals allows for a greater number of connections, enabling versatile usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact designs.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel gold palladium finish ensures good conductivity and corrosion resistance, prolonging the product's lifespan.

Maximum Seated Height: 1.75 mm

Low seated height enables a slim profile, ideal for applications with space constraints.

Width: 4 mm

Narrow width allows for efficient use of board space, especially in crowded PCB layouts.

Length: 8.75 mm

Compact length contributes to the overall small footprint of the product, suitable for tight installations.

Technology: BCDMOS

BCDMOS technology offers a balance between high performance and low power consumption, ideal for energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering, ensuring reliable connections.

Maximum Supply Current: 0.08 mA

Low maximum supply current results in minimal power consumption, prolonging battery life in portable devices.

Telecom IC Type: INTERFACE CIRCUIT

Designed as an interface circuit for telecom applications, ensuring seamless communication between different network components.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent and reliable operation, meeting standard power requirements.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting, maximizing connectivity in limited board space.

Data Rate: 1 Mbps

High data rate of 1 Mbps enables fast and efficient data transmission, suitable for high-speed networking applications.

Moisture Sensitivity Level (MSL): 2A

MSL 2A indicates moderate moisture sensitivity, ensuring the product's reliability and durability in various environments.

Technical Specifications

Network Interfaces TLE6251-2G attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G14

Length:

8.75 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,6/18

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE6251-2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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