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TLE6250GV33

Infineon Technologies

TLE6250GV33 by Infineon Technologies

TLE6250GV33 by Infineon Technologies is a CAN transceiver with 1 Mbps data rate, operating at 3.3V nominal voltage. It features BICMOS technology, AEC-Q100 screening level, and GULL WING terminal form. Ideal for automotive network interfaces due to its small outline package style and dual terminal position.

Median Price

$1.993

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 913 parts In-Stock

1+ parts

$2.680

100+ parts

$1.330

1k+ parts

$0.959

10k+ parts

$0.803

913

$2.680

$1.330

$0.959

$0.803

Verical

USA . 1,402 parts In-Stock

1+ parts

-

100+ parts

$1.306

1k+ parts

$1.169

10k+ parts

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1,402

-

$1.306

$1.169

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Distributors (In-Stock)

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Maritex

Poland . 30,000 parts In-Stock

1+ parts

$0.774

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30,000

$0.774

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Voyager Components

USA . 37 parts In-Stock

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$1.256

100+ parts

$1.256

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$1.256

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$1.256

37

$1.256

$1.256

$1.256

$1.256

Digiode

USA . 903 parts In-Stock

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$1.662

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903

$1.662

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Ozdisan Elektronik

Türkiye . 4,886 parts In-Stock

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$1.796

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4,886

$1.796

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Chip Stock

USA . 30,436 parts In-Stock

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Cyclops Electronics Ltd

UK . 15,204 parts In-Stock

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Astute Electronics Inc

. 8,994 parts In-Stock

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Vyrian

USA . 6,769 parts In-Stock

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Connector Distribution Corp

USA . 2,224 parts In-Stock

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Right Parts Inc.

USA . 2,224 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,950 parts In-Stock

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Sensible Micro Corp

USA . 1,164 parts In-Stock

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J2 Sourcing AB

Sweden . 296 parts In-Stock

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296

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Bristol Electronics

USA . 150 parts In-Stock

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150

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ComSIT Distribution GmbH

Germany . 119 parts In-Stock

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119

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ComSIT USA

USA . 119 parts In-Stock

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119

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NexGen Digital

USA . 65 parts In-Stock

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65

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

CoreStaff

Japan . 1,602 parts In-Stock

1+ parts

$1.098

100+ parts

$0.726

1k+ parts

$0.723

10k+ parts

-

1,602

$1.098

$0.726

$0.723

-

Ampacity Inc.

Singapore . 663 parts In-Stock

1+ parts

$1.110

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663

$1.110

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Semicontronic

India . 274 parts In-Stock

1+ parts

$1.110

100+ parts

$1.082

1k+ parts

$1.077

10k+ parts

-

274

$1.110

$1.082

$1.077

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Corphita

USA . 674 parts In-Stock

1+ parts

$1.575

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674

$1.575

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$12.517

100+ parts

$11.891

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$11.891

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350

$12.517

$11.891

$11.891

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Corohmni

South Africa . 58 parts In-Stock

1+ parts

$12.738

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58

$12.738

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Aztec Data Supply Inc.

USA . 2,160 parts In-Stock

1+ parts

$13.970

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$13.970

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Modulus Dynamics

Lithuania . 4,339 parts In-Stock

1+ parts

$15.135

100+ parts

$14.530

1k+ parts

$13.924

10k+ parts

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4,339

$15.135

$14.530

$13.924

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Resion (Excess)

USA . 65,000 parts In-Stock

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65,000

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A-Z Elektronik GmbH

Germany . 37,041 parts In-Stock

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Perfect Parts

USA . 33,870 parts In-Stock

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33,870

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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S.R.D Solutions

India . 8,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,569 parts In-Stock

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Robosynatics

Brazil . 5,000 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

1+ parts

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$20.520

1k+ parts

$20.520

10k+ parts

$20.520

5,000

-

$20.520

$20.520

$20.520

Lixinc

USA . 4,268 parts In-Stock

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4,268

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Infinite Electronics LLP (Excess)

. 2,500 parts In-Stock

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2,500

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Alle Elektronik GmbH

Germany . 2,500 parts In-Stock

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2,500

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Argo Parts USA

USA . 1,750 parts In-Stock

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Assy Fe

Spain . 1,591 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

USA . 347 parts In-Stock

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347

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ChipstoGo Electronic ltd

UK . 83 parts In-Stock

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Kepictronics

USA . 53 parts In-Stock

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Overview

Unlock seamless communication and connectivity with the TLE6250GV33 by Infineon Technologies. As a trusted leader in network interfaces, Infineon delivers unparalleled quality and reliability. Whether in automotive or industrial applications, this CAN transceiver offers exceptional performance and efficiency with its 3.3V nominal supply voltage and 1 Mbps data rate. With a compact design and low power consumption, the TLE6250GV33 provides unmatched value and benefits to customers looking for a superior solution in networking technology. Experience the advantages of cutting-edge technology with Infineon's TLE6250GV33.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and providing a clean finish.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making it suitable for automotive applications where robustness is crucial.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages offers flexibility in various operating environments and applications.

No. of Terminals: 8

Having multiple terminals allows for connectivity with other components, enabling complex network configurations.

Terminal Finish: TIN

The use of tin terminal finish provides good corrosion resistance and solderability, ensuring long-term reliability.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, the product can support high-speed data transmission, essential for efficient network communication.

Technical Specifications

Network Interfaces TLE6250GV33 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.07 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE6250GV33 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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