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TCAN337GDCNT

Texas Instruments

TCAN337GDCNT by Texas Instruments

TCAN337GDCNT by Texas Instruments is a network interface IC with 8 terminals, operating temperature range of -40 to 125°C, and data rate of 5 Mbps. It is ideal for automotive applications requiring a small outline package with low profile and shrink pitch design. The IC features nickel palladium gold terminal finish and gull wing terminal form for reliable performance in telecom interfaces.

Median Price

$2.479

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 127,396 parts In-Stock

1+ parts

$2.479

100+ parts

$2.172

1k+ parts

$1.227

10k+ parts

-

127,396

$2.479

$2.172

$1.227

-

Mouser Electronics

USA . 39 parts In-Stock

1+ parts

$3.720

100+ parts

$2.270

1k+ parts

$1.990

10k+ parts

$1.940

39

$3.720

$2.270

$1.990

$1.940

DigiKey

USA . 2,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.022

10k+ parts

$1.938

2,777

-

-

$2.022

$1.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$2.159

100+ parts

-

1k+ parts

-

10k+ parts

-

41

$2.159

-

-

-

Digiode

USA . 218 parts In-Stock

1+ parts

$2.355

100+ parts

-

1k+ parts

-

10k+ parts

-

218

$2.355

-

-

-

IBS Electronics

USA . 1,594 parts In-Stock

1+ parts

$3.152

100+ parts

$1.951

1k+ parts

$1.756

10k+ parts

-

1,594

$3.152

$1.951

$1.756

-

Vyrian

USA . 42,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,837

-

-

-

-

Chip Stock

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,500

-

-

-

-

Semtec, LLC

USA . 2,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,503

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 43,283 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

-

10k+ parts

-

43,283

$2.110

-

-

-

Argo Parts USA

USA . 1,437 parts In-Stock

1+ parts

$2.159

100+ parts

-

1k+ parts

-

10k+ parts

-

1,437

$2.159

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.159

100+ parts

-

1k+ parts

$2.051

10k+ parts

$2.008

1,000

$2.159

-

$2.051

$2.008

Continental Prestige Electronics

USA . 567 parts In-Stock

1+ parts

$2.159

100+ parts

-

1k+ parts

-

10k+ parts

$2.116

567

$2.159

-

-

$2.116

Corphita

USA . 1,880 parts In-Stock

1+ parts

$2.231

100+ parts

-

1k+ parts

-

10k+ parts

-

1,880

$2.231

-

-

-

Semicontronic

India . 42,672 parts In-Stock

1+ parts

$4.590

100+ parts

$4.475

1k+ parts

$4.452

10k+ parts

-

42,672

$4.590

$4.475

$4.452

-

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$9.265

100+ parts

$8.802

1k+ parts

$8.802

10k+ parts

-

270

$9.265

$8.802

$8.802

-

Corohmni

South Africa . 722 parts In-Stock

1+ parts

$10.337

100+ parts

-

1k+ parts

-

10k+ parts

-

722

$10.337

-

-

-

Parana Technologies

USA . 519 parts In-Stock

1+ parts

$15.299

100+ parts

-

1k+ parts

$15.692

10k+ parts

-

519

$15.299

-

$15.692

-

DigiPath Technology Company

USA . 1,330 parts In-Stock

1+ parts

$16.846

100+ parts

-

1k+ parts

-

10k+ parts

-

1,330

$16.846

-

-

-

ChromeModa Solutions

Germany . 3,425 parts In-Stock

1+ parts

$17.190

100+ parts

$14.096

1k+ parts

-

10k+ parts

-

3,425

$17.190

$14.096

-

-

IDEA Electronic Components Group

UK . 1,570 parts In-Stock

1+ parts

$17.190

100+ parts

$16.330

1k+ parts

$15.471

10k+ parts

-

1,570

$17.190

$16.330

$15.471

-

Lixinc

USA . 6,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,945

-

-

-

-

A-Z Elektronik GmbH

Germany . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Perfect Parts

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

280

-

-

-

-

Overview

Enhance your network interface capabilities with the TCAN337GDCNT by Texas Instruments. Trusted for its superior quality and reliability, Texas Instruments is a leading manufacturer in the industry. This small outline, low profile package offers a wide range of applications in automotive and telecom circuits. With a nominal supply voltage of 3.3V and a data rate of 5 Mbps, this interface circuit provides seamless connectivity and efficient operation. Upgrade your networking experience with the TCAN337GDCNT and enjoy the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a cost-effective choice.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Offers a compact design that saves space within a device or system, ideal for applications with limited room.

No. of Terminals: 8

Provides ample connection points for various components, allowing for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Enables a streamlined layout and efficient use of board space, optimizing overall system design.

Maximum Operating Temperature: 125 °C

Guarantees reliable performance even in high-temperature environments, ensuring long-term functionality.

Minimum Operating Temperature: -40 °C

Means the network interface can operate in extreme cold conditions without any issues, making it versatile for diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures strong and stable connections, reducing the risk of corrosion and enhancing overall signal integrity.

Terminal Position: DUAL

Provides redundancy and improved signal reliability, minimizing the chance of connection failure.

Maximum Seated Height: 1.45 mm

Offers a low-profile design that is suitable for compact devices or systems, delivering a sleek and unobtrusive appearance.

Width: 1.6 mm

Small dimensions facilitate easy integration into confined spaces, making it ideal for applications with limited room for components.

Maximum Time At Peak Reflow Temperature (s): 30

Simplifies the soldering process and ensures proper bonding, contributing to a quicker and more efficient assembly.

Peak Reflow Temperature °C: 260

Allows for secure soldering joints and reliable connections, maintaining consistent performance under various operating conditions.

Length: 2.9 mm

Compact size facilitates flexible placement and installation in a variety of systems or devices, enhancing versatility.

Temperature Grade: AUTOMOTIVE

Designed to meet rigorous automotive industry standards, ensuring high performance and durability in demanding automotive applications.

Terminal Form: GULL WING

Provides a robust terminal design that enhances mechanical strength and facilitates easy soldering, contributing to reliable connectivity.

Telecom IC Type: INTERFACE CIRCUIT

Tailored for telecom applications, ensuring compatibility and seamless integration into telecom systems for reliable data transmission.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage level, suitable for many applications without the need for additional voltage regulation.

Terminal Pitch: 0.65 mm

Offers a fine pitch that allows for precise and secure connections, enhancing signal integrity and overall performance.

Data Rate: 5 Mbps

Supports high-speed data transfer, making it suitable for applications requiring fast and reliable data communication.

Technical Specifications

Network Interfaces TCAN337GDCNT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TCAN337GDCNT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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