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TJA1050T/VM,518

NXP Semiconductors

TJA1050T/VM,518 by NXP Semiconductors

NXP Semiconductors' TJA1050T/VM,518 is a Network Interface IC with 1Mbps data rate and 5V supply voltage. It features CMOS technology, operates in automotive temperature grade (-40 to 125°C), and has a small outline package style. Ideal for interface circuits in automotive applications due to its low power consumption of 0.075mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,557 parts In-Stock

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Digiode

USA . 4,870 parts In-Stock

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Anansix

USA . 1,457 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,761 parts In-Stock

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$8.115

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4,761

$8.115

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AZTECH Wire

Italy . 260 parts In-Stock

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$9.473

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Microchip USA

USA . 436 parts In-Stock

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$10.780

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436

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Corohmni

South Africa . 517 parts In-Stock

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$14.878

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517

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Component Stockers USA

USA . 655 parts In-Stock

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$99.990

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Ampacity Inc.

Singapore . 1,296 parts In-Stock

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$613.000

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Semicontronic

India . 659 parts In-Stock

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$715.000

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$697.125

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$693.550

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659

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One Stop Electronics

USA . 1,051 parts In-Stock

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$732.000

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UNI Independent Distributors

Spain . 6,820 parts In-Stock

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Argo Parts USA

USA . 4,699 parts In-Stock

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Continental Prestige Electronics

USA . 3,389 parts In-Stock

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Corphita

USA . 2,160 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience seamless communication with the TJA1050T/VM,518 by NXP Semiconductors. This network interface, designed with precision and quality in mind, offers unparalleled reliability for automotive applications. With its small outline package and low power consumption, this interface circuit provides optimal performance while ensuring efficient data transmission at a high data rate of 1 Mbps. Trust NXP Semiconductors to deliver cutting-edge technology that enhances connectivity and functionality in your automotive systems. Elevate your communication capabilities with the TJA1050T/VM,518.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the product is lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes installation and integration easier and more efficient.

Power Supplies (V): 5

The standard power supply of 5V allows for compatibility with a wide range of devices.

Temperature Grade: AUTOMOTIVE

The automotive grade temperature range ensures the product can withstand harsh environmental conditions, making it ideal for automotive applications.

Data Rate: 1 Mbps

The high data rate of 1 Mbps enables fast and reliable data transmission, suitable for network interfaces.

Technical Specifications

Network Interfaces TJA1050T/VM,518 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJA1050T/VM,518 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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