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KSZ9031RNXVA

Microchip Technology

KSZ9031RNXVA by Microchip Technology

Microchip Technology's KSZ9031RNXVA is an Ethernet transceiver with AEC-Q100 screening for industrial use. It features 48 terminals in a square chip carrier package, operating from -40 to 105°C. With a terminal pitch of 0.5mm and no-lead form, it suits telecom applications requiring a 1.2V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,183 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$6.820

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515

$6.820

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Aztec Data Supply Inc.

USA . 488 parts In-Stock

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$10.350

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488

$10.350

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Corohmni

South Africa . 574 parts In-Stock

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$12.170

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574

$12.170

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$12.607

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$11.977

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$11.977

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70

$12.607

$11.977

$11.977

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Semicontronic

India . 1,422 parts In-Stock

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$299.000

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$291.525

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$290.030

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$299.000

$291.525

$290.030

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Ampacity Inc.

Singapore . 564 parts In-Stock

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$977.000

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564

$977.000

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Continental Prestige Electronics

USA . 5,175 parts In-Stock

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Argo Parts USA

USA . 4,793 parts In-Stock

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RGB Technical Solutions

Ukraine . 3,725 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 244 parts In-Stock

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244

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Bastille Electronics

Australia . 97 parts In-Stock

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Overview

Unlock the power of seamless networking with the Microchip Technology KSZ9031RNXVA Network Interface. Manufactured by a trusted leader in the industry, this Ethernet transceiver offers unparalleled reliability and performance. Ideal for industrial applications, this product boasts a wide operating temperature range and is AEC-Q100 qualified. With its compact design and advanced features, the KSZ9031RNXVA provides exceptional value and benefits to customers looking for a high-quality networking solution that delivers superior connectivity and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient soldering onto PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures high reliability and quality, making it suitable for automotive applications where stringent standards are required.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space and easy layout design.

No. of Terminals: 48

Sufficient number of terminals for connectivity requirements in networking applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides excellent thermal management and compact size for space-constrained environments.

Maximum Operating Temperature: 105 °C

Capable of operating efficiently at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme cold conditions as well.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connections.

Maximum Seated Height: 0.9 mm

Low profile design suitable for compact devices and applications where space is limited.

Width: 7 mm

Compact width for efficient PCB layout and space optimization.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures for soldering without damage.

Length: 7 mm

Compact length for space-saving design and easy integration into systems.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and safety.

Telecom IC Type: ETHERNET TRANSCEIVER

Specifically designed for Ethernet communication applications, ensuring reliable data transmission.

Nominal Supply Voltage: 1.2 V

Operates at a low voltage for power efficiency and compatibility with various systems.

Terminal Pitch: 0.5 mm

Fine pitch for increased density and connection reliability.

Technical Specifications

Network Interfaces KSZ9031RNXVA attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

KSZ9031RNXVA Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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