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ISOW1044DFMR

Texas Instruments

ISOW1044DFMR by Texas Instruments

ISOW1044DFMR by Texas Instruments is a CAN FD transceiver with 20 terminals in a small outline package. It operates at temperatures from -40 to 125°C, with a data rate of 5 Mbps and nominal voltage of 5V. Ideal for network interfaces, this device has a moisture sensitivity level of 3 and peak reflow temperature of 260°C.

Median Price

$6.529

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$6.526

100+ parts

$6.200

1k+ parts

$6.200

10k+ parts

-

5,000

$6.526

$6.200

$6.200

-

Texas Instruments

USA . 10,160 parts In-Stock

1+ parts

$8.400

100+ parts

$7.337

1k+ parts

$5.060

10k+ parts

-

10,160

$8.400

$7.337

$5.060

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Arrow

USA . 850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.529

10k+ parts

$6.256

850

-

-

$6.529

$6.256

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,838 parts In-Stock

1+ parts

$6.200

100+ parts

-

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2,838

$6.200

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.777

100+ parts

-

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50

$7.777

-

-

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Bristol Electronics

USA . 3,747 parts In-Stock

1+ parts

-

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3,747

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Vyrian

USA . 3,451 parts In-Stock

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3,451

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Chip Stock

USA . 2,740 parts In-Stock

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2,740

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Rotakorn

Sweden . 2,550 parts In-Stock

1+ parts

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2,550

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Cyclops Electronics Ltd

UK . 1,214 parts In-Stock

1+ parts

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1,214

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Component Sense

UK . 175 parts In-Stock

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175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,031 parts In-Stock

1+ parts

$5.550

100+ parts

-

1k+ parts

-

10k+ parts

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4,031

$5.550

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Semicontronic

India . 3,649 parts In-Stock

1+ parts

$5.550

100+ parts

$5.411

1k+ parts

$5.384

10k+ parts

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3,649

$5.550

$5.411

$5.384

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Corphita

USA . 1,437 parts In-Stock

1+ parts

$5.873

100+ parts

-

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10k+ parts

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1,437

$5.873

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$6.526

100+ parts

$6.200

1k+ parts

$6.200

10k+ parts

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5,000

$6.526

$6.200

$6.200

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.777

100+ parts

-

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1,000

$7.777

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Continental Prestige Electronics

USA . 586 parts In-Stock

1+ parts

$7.777

100+ parts

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10k+ parts

$7.622

586

$7.777

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-

$7.622

Corohmni

South Africa . 180 parts In-Stock

1+ parts

$9.503

100+ parts

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180

$9.503

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Parana Technologies

USA . 781 parts In-Stock

1+ parts

$13.200

100+ parts

-

1k+ parts

$13.706

10k+ parts

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781

$13.200

-

$13.706

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DigiPath Technology Company

USA . 1,833 parts In-Stock

1+ parts

$14.534

100+ parts

$13.372

1k+ parts

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1,833

$14.534

$13.372

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ChromeModa Solutions

Germany . 2,749 parts In-Stock

1+ parts

$14.831

100+ parts

$12.161

1k+ parts

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2,749

$14.831

$12.161

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IDEA Electronic Components Group

UK . 978 parts In-Stock

1+ parts

$14.831

100+ parts

$14.089

1k+ parts

$13.348

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978

$14.831

$14.089

$13.348

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Lixinc

USA . 16,240 parts In-Stock

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Argo Parts USA

USA . 1,330 parts In-Stock

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1,330

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Overview

Upgrade your network interfaces with the ISOW1044DFMR from Texas Instruments. Designed with quality and precision in mind, this product offers unparalleled reliability and performance. Whether you're working on industrial automation, telecommunications, or automotive applications, this device provides the value and benefits you need to stay ahead of the competition. Trust in Texas Instruments to deliver cutting-edge technology that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for long-term use.

Surface Mount: YES

With surface mount capability, this product can easily be mounted onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape of this package allows for efficient use of space on a circuit board, making it suitable for compact designs.

No. of Terminals: 20

With 20 terminals, this product offers a high level of connectivity, providing flexibility for various network configurations.

Package Style: SMALL OUTLINE

The small outline package style of this product ensures compatibility with a wide range of devices and applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to perform reliably in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that this product can withstand extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position of this product allows for increased stability and reliability in network connections.

Maximum Seated Height: 3.55 mm

The low maximum seated height of 3.55 mm makes this product suitable for applications with limited vertical space.

Width: 7.5 mm

The compact width of 7.5 mm allows for efficient use of space on a circuit board, making this product ideal for compact designs.

Peak Reflow Temperature: 260

The high peak reflow temperature of 260°C ensures secure soldering during assembly, enhancing the overall reliability of this product.

Length: 12.83 mm

The length of 12.83 mm is optimal for accommodating the terminals and components of this product, ensuring a secure and efficient connection.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of assembly, making this product a reliable choice for network interfaces.

Maximum Supply Current: 136 mA

With a maximum supply current of 136 mA, this product can reliably support various network activities and devices.

Telecom IC Type: CAN FD TRANSCEIVER

The use of a CAN FD transceiver type for the telecom IC ensures high-speed and efficient data transmission, making this product suitable for advanced network applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides stable power to this product, ensuring consistent performance in network operations.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for precise connections and compact designs, making this product versatile for different applications.

Data Rate: 5 Mbps

With a data rate of 5 Mbps, this product offers high-speed communication capabilities, ideal for handling large amounts of data in network operations.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product can withstand moderate exposure to moisture, ensuring its reliability in various environmental conditions.

Technical Specifications

Network Interfaces ISOW1044DFMR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.83 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3.55 mm

Maximum Supply Current:

136 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ISOW1044DFMR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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