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NCN5130MNTWG

Onsemi

NCN5130MNTWG by Onsemi

The Onsemi NCN5130MNTWG is a network interface chip carrier with 40 terminals, operating b/w -40 to 105°C. It features matte tin finish, quad terminal position, and 3.3V supply voltage suitable for industrial telecom applications. With a compact square shape of 6x6mm and very thin profile, it's ideal for surface mount designs requiring high-temperature resilience.

Median Price

$6.855

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,812 parts In-Stock

1+ parts

$6.790

100+ parts

$4.400

1k+ parts

$3.980

10k+ parts

-

1,812

$6.790

$4.400

$3.980

-

Mouser Electronics

USA . 1,933 parts In-Stock

1+ parts

$6.920

100+ parts

$4.490

1k+ parts

-

10k+ parts

-

1,933

$6.920

$4.490

-

-

Farnell

UK . 950 parts In-Stock

1+ parts

$7.533

100+ parts

$4.474

1k+ parts

$4.384

10k+ parts

$4.114

950

$7.533

$4.474

$4.384

$4.114

Chip1Stop

Japan . 2,865 parts In-Stock

1+ parts

$23.800

100+ parts

$9.930

1k+ parts

$6.770

10k+ parts

-

2,865

$23.800

$9.930

$6.770

-

DigiKey

USA . 2,988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.729

2,988

-

-

-

$3.729

Element14

Singapore . 950 parts In-Stock

1+ parts

-

100+ parts

$4.620

1k+ parts

$4.479

10k+ parts

$4.086

950

-

$4.620

$4.479

$4.086

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Greenchips

USA . 7,987 parts In-Stock

1+ parts

$3.291

100+ parts

$3.134

1k+ parts

$2.985

10k+ parts

$2.694

7,987

$3.291

$3.134

$2.985

$2.694

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.856

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$5.856

-

-

-

Digiode

USA . 1,507 parts In-Stock

1+ parts

$6.346

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$6.346

-

-

-

Chip Stock

USA . 4,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,260

-

-

-

-

Vyrian

USA . 2,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,128

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,382 parts In-Stock

1+ parts

$2.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,382

$2.980

-

-

-

Semicontronic

India . 2,319 parts In-Stock

1+ parts

$2.980

100+ parts

$2.906

1k+ parts

$2.891

10k+ parts

-

2,319

$2.980

$2.906

$2.891

-

Corohmni

South Africa . 394 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$3.510

-

-

-

Corphita

USA . 2,341 parts In-Stock

1+ parts

$6.012

100+ parts

-

1k+ parts

-

10k+ parts

-

2,341

$6.012

-

-

-

Continental Prestige Electronics

USA . 1,290 parts In-Stock

1+ parts

$6.240

100+ parts

$4.250

1k+ parts

-

10k+ parts

-

1,290

$6.240

$4.250

-

-

Aztec Data Supply Inc.

USA . 3,409 parts In-Stock

1+ parts

$11.610

100+ parts

-

1k+ parts

-

10k+ parts

-

3,409

$11.610

-

-

-

Modulus Dynamics

Lithuania . 4,133 parts In-Stock

1+ parts

$14.541

100+ parts

$14.541

1k+ parts

$14.541

10k+ parts

-

4,133

$14.541

$14.541

$14.541

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$15.377

100+ parts

$13.993

1k+ parts

$12.609

10k+ parts

-

500

$15.377

$13.993

$12.609

-

Microchip USA

USA . 3,969 parts In-Stock

1+ parts

$28.170

100+ parts

$27.990

1k+ parts

$27.910

10k+ parts

$27.820

3,969

$28.170

$27.990

$27.910

$27.820

Perfect Parts

USA . 46,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

46,762

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,000

-

-

-

-

Problanco Electronics

Mexico . 5,802 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,802

-

-

-

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RC Electronics

USA . 5,416 parts In-Stock

1+ parts

-

100+ parts

-

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5,416

-

-

-

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Argo Parts USA

USA . 3,054 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,054

-

-

-

-

TANS Electronics

Latvia . 2,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,953

-

-

-

-

Kulean Microsystems

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,704

-

-

-

-

Robosynatics

Brazil . 1,785 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

1,785

-

-

-

-

Lucentia Tech

USA . 1,785 parts In-Stock

1+ parts

-

100+ parts

$7.423

1k+ parts

$7.271

10k+ parts

$7.271

1,785

-

$7.423

$7.271

$7.271

Lixinc

USA . 1,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,026

-

-

-

-

UHIMA Technologies

Türkiye . 942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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942

-

-

-

-

SupplyDigital Components

Austria . 812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

812

-

-

-

-

Overview

Elevate your network connections with the NCN5130MNTWG by Onsemi. This high-quality network interface chip carrier offers exceptional performance and reliability, making it the top choice for industrial applications. With a very thin profile and matte tin finish, this surface mount device provides seamless integration and optimal functionality. Trust Onsemi's expertise in telecom ICs to deliver the best value and benefits to your projects. Upgrade your network interfaces today with the NCN5130MNTWG.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving time and space in electronic devices.

Package Shape: SQUARE

The square package shape helps in compact and efficient placement of the network interface on the circuit board, optimizing space usage.

No. of Terminals: 40

Having 40 terminals provides a wide range of connectivity options, allowing for versatile integration into different electronic systems.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments where temperatures can vary.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the network interface to function effectively in cold conditions, increasing its usability range.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and excellent solderability, ensuring long-term reliability of the network interface.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes the network interface compatible with a wide range of electronic systems and power sources.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the network interface is less sensitive to moisture exposure during storage and handling, increasing its shelf life.

Technical Specifications

Network Interfaces NCN5130MNTWG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

NCN5130MNTWG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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