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NCN5121MNG

Onsemi

NCN5121MNG by Onsemi

The Onsemi NCN5121MNG is a network interface chip with 40 terminals in a square package. Operating temperature ranges from -40 to 105 °C, suitable for industrial use. It features a nominal voltage of 3.3V and terminal pitch of 0.5mm, ideal for telecom interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 596 parts In-Stock

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Vyrian

USA . 484 parts In-Stock

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Kulean Microsystems

USA . 7,410 parts In-Stock

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7,410

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TANS Electronics

Latvia . 5,070 parts In-Stock

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5,070

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Problanco Electronics

Mexico . 2,931 parts In-Stock

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Corphita

USA . 2,186 parts In-Stock

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UHIMA Technologies

Türkiye . 680 parts In-Stock

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680

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SupplyDigital Components

Austria . 272 parts In-Stock

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Corohmni

South Africa . 261 parts In-Stock

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Overview

Enhance your network interfaces with the NCN5121MNG by Onsemi, a high-quality product designed for industrial-grade applications. With its compact square package shape and no-lead terminal form, this interface circuit offers seamless integration and top-notch performance. Onsemi, known for its cutting-edge technology, ensures that this chip carrier delivers exceptional value and benefits to customers seeking reliable telecom IC solutions. Upgrade your network infrastructure with the NCN5121MNG and experience the advantages of superior connectivity and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and secure installation onto a PCB, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a compact design, making it suitable for applications where space is limited.

No. of Terminals: 40

Having 40 terminals allows for versatile connectivity options and compatibility with various systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation, protection for the circuitry, and a slim profile for space-constrained designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand demanding environments without the risk of overheating.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures the product can function reliably in various climates and conditions.

Terminal Position: QUAD

Quad terminal positioning simplifies the connection process and enhances stability.

Maximum Seated Height: 1 mm

The low seated height contributes to a slim and compact overall design, ideal for space-conscious applications.

Width: 6 mm

The narrow width facilitates easy integration into tight spaces or dense PCB layouts.

Length: 6 mm

The compact length makes the product suitable for applications where size is a critical factor.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminals are more environmentally friendly and can improve the longevity of the product.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, ensuring compatibility and optimal performance in telecom systems.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a typical supply voltage of 3.3V, making it compatible with standard power sources.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, enabling more connections in a limited space.

Technical Specifications

Network Interfaces NCN5121MNG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

NCN5121MNG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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