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NCN5110MNG

Onsemi

NCN5110MNG by Onsemi

The Onsemi NCN5110MNG is a Network Interface IC with 40 terminals, operating from -40 to 105 °C. It features a 3.3V supply voltage, suitable for industrial telecom applications. This square-shaped chip carrier has a very thin profile and no-lead terminal form, making it ideal for surface-mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,371 parts In-Stock

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Digiode

USA . 1,139 parts In-Stock

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1,139

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TANS Electronics

Latvia . 8,126 parts In-Stock

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SupplyDigital Components

Austria . 4,715 parts In-Stock

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Kulean Microsystems

USA . 3,007 parts In-Stock

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Corphita

USA . 1,856 parts In-Stock

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Problanco Electronics

Mexico . 1,334 parts In-Stock

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UHIMA Technologies

Türkiye . 429 parts In-Stock

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429

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Corohmni

South Africa . 351 parts In-Stock

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Overview

Upgrade your networking experience with the NCN5110MNG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their network interfaces. Whether you're looking to improve connectivity in your industrial applications or enhance communication in your telecom systems, this product offers unmatched value and performance. Say goodbye to slow connections and hello to seamless networking with the NCN5110MNG.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure attachment to circuit boards, making installation and assembly more efficient.

Package Shape: SQUARE

The square shape of the package provides a compact and organized layout when integrating the network interface into the overall system design.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options, allowing for versatile connection configurations in a network setup.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the network interface can withstand demanding environments and extended usage without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the network interface to function reliably even in extremely cold conditions.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure connection to other components or devices, enhancing the overall stability of the network interface.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this network interface offers a low-profile design, saving space and enabling compact system configurations.

Width: 6 mm

The 6mm width ensures compatibility with standard circuit board layouts and allows for easy integration into various electronic setups.

Length: 6 mm

The 6mm length offers a balanced footprint, making it suitable for applications where space is a concern without compromising on functionality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating signifies durability and reliability in harsh industrial environments, making this network interface suitable for demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and is environmentally friendly, ensuring a cleaner manufacturing process.

Telecom IC Type: INTERFACE CIRCUIT

The interface circuit type indicates compatibility with telecom systems, offering seamless integration and reliable performance in telecommunications applications.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in many electronic devices, ensuring compatibility and easy power integration in various setups.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise and secure connections, contributing to the overall stability and performance of the network interface.

Technical Specifications

Network Interfaces NCN5110MNG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

NCN5110MNG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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