Loading...

NCN5130MNG

Onsemi

NCN5130MNG by Onsemi

The Onsemi NCN5130MNG is a 40-terminal network interface chip carrier with a very thin profile. Operating temperature ranges from -40 to 105 °C, suitable for industrial use. It features a nominal voltage of 3.3V and is ideal for telecom interface circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

639

-

-

-

-

Digiode

USA . 587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

587

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,822

-

-

-

-

SupplyDigital Components

Austria . 4,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,616

-

-

-

-

Problanco Electronics

Mexico . 2,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,222

-

-

-

-

Corphita

USA . 1,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,850

-

-

-

-

TANS Electronics

Latvia . 1,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,799

-

-

-

-

Corohmni

South Africa . 461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

461

-

-

-

-

UHIMA Technologies

Türkiye . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

89

-

-

-

-

Overview

Unlock seamless networking capabilities with the Onsemi NCN5130MNG, a high-quality network interface solution designed to elevate your connectivity experience. Manufactured by industry leader Onsemi, this product offers unparalleled reliability and performance in a compact square package with 40 terminals. From industrial applications to telecom circuits, this chip carrier with heat sink/slug and very thin profile design ensures optimal functionality in extreme temperatures ranging from -40 to 105 °C. Experience the value of effortless networking with the NCN5130MNG by Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable makes this product easy to install and saves space on the PCB.

Package Shape: SQUARE

The square package shape provides a symmetrical design that can facilitate easier PCB layout and routing.

No. of Terminals: 40

Having 40 terminals allows for connectivity to multiple signals or components, increasing versatility and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation and compact form factor, making it suitable for space-constrained applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme cold conditions, increasing the product's reliability and versatility.

Terminal Position: QUAD

The quad terminal position provides secure connections and ease of soldering, improving the overall reliability of the product.

Maximum Seated Height: 1 mm

The low seated height makes this product suitable for compact designs and applications where space is limited.

Width: 6 mm

The 6mm width provides a good balance between compact size and ease of handling during installation and maintenance.

Length: 6 mm

The 6mm length contributes to the overall compact form factor of the product, ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form improves reliability and manufacturability by reducing the risk of solder joint failures and ensuring a consistent connection.

Telecom IC Type: INTERFACE CIRCUIT

The interface circuit enables seamless communication between different components or devices, enhancing the product's connectivity capabilities.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in many electronic systems, making this product compatible with a wide range of applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and close spacing of terminals, enabling efficient use of PCB real estate.

Technical Specifications

Network Interfaces NCN5130MNG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

NCN5130MNG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7