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NCN5120MNG

Onsemi

NCN5120MNG by Onsemi

The Onsemi NCN5120MNG is a 40-terminal Ethernet transceiver with a 3.3V supply voltage, suitable for telecom applications. It operates b/w -25°C to 85°C and features a square package shape with a compact size of 6mm x 6mm. This surface-mount chip carrier has a very thin profile and quad terminal position, making it ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,571 parts In-Stock

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1,571

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Digiode

USA . 372 parts In-Stock

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372

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 677 parts In-Stock

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$14.680

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677

$14.680

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Aztec Data Supply Inc.

USA . 177 parts In-Stock

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$16.570

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177

$16.570

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Semicontronic

India . 365 parts In-Stock

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$646.000

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$629.850

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$626.620

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365

$646.000

$629.850

$626.620

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Ampacity Inc.

Singapore . 269 parts In-Stock

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$823.000

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269

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Problanco Electronics

Mexico . 6,573 parts In-Stock

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TANS Electronics

Latvia . 5,017 parts In-Stock

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Continental Prestige Electronics

USA . 3,454 parts In-Stock

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SupplyDigital Components

Austria . 3,043 parts In-Stock

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Corphita

USA . 1,204 parts In-Stock

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Argo Parts USA

USA . 731 parts In-Stock

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Kulean Microsystems

USA . 537 parts In-Stock

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UHIMA Technologies

Türkiye . 315 parts In-Stock

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Corohmni

South Africa . 232 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the Onsemi NCN5120MNG, a high-quality Ethernet transceiver that offers reliable networking solutions for various applications. With Onsemi's reputation for excellence in manufacturing, you can trust in the performance and durability of this network interface. Whether you're looking to enhance your industrial automation systems or streamline your communication networks, the NCN5120MNG delivers value, efficiency, and seamless connectivity. Upgrade your networking capabilities today with this innovative product from a trusted industry leader.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a surface, making it convenient for installation.

Package Shape: SQUARE

The square shape of this product allows for efficient use of space on a circuit board.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, ensuring compatibility with most systems.

No. of Terminals: 40

With 40 terminals, this product can handle a wide range of connections and data transfer.

Package Style (Meter): CHIP CARRIER

The chip carrier style of this product provides a compact and efficient design.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments up to 85°C, making it suitable for various applications.

Minimum Operating Temperature: -25 °C

Can operate in low temperature environments down to -25°C, ensuring reliability in extreme conditions.

Terminal Position: QUAD

The quad terminal position allows for secure connections and stable performance.

Maximum Seated Height: 1 mm

With a low seated height of 1mm, this product is space-saving and can fit into tight spaces.

Width: 6 mm

The 6mm width of this product provides a compact footprint on a circuit board.

Length: 6 mm

The 6mm length of this product is another feature that contributes to its space-saving design.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder bridging and improves overall reliability.

Telecom IC Type: ETHERNET TRANSCEIVER

This Ethernet transceiver type ensures fast and reliable data transmission over a network.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is standard and widely supported in networking applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for a high density of terminals on a circuit board.

Technical Specifications

Network Interfaces NCN5120MNG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

NCN5120MNG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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