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TJA1028TK/3V3/20/J

NXP Semiconductors

TJA1028TK/3V3/20/J by NXP Semiconductors

NXP Semiconductors' TJA1028TK/3V3/20/J is a LIN transceiver with 8 terminals, operating at 3.3V and drawing 4.5mA max current. AEC-Q100 screened for automotive use, it has a temp range of -40 to 150°C. Its small outline package measures 3x3mm with 0.65mm terminal pitch, suitable for telecom applications.

Median Price

$1.153

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15,150 parts In-Stock

1+ parts

$1.440

100+ parts

$0.844

1k+ parts

$0.735

10k+ parts

$0.654

15,150

$1.440

$0.844

$0.735

$0.654

DigiKey

USA . 653 parts In-Stock

1+ parts

$1.440

100+ parts

$0.845

1k+ parts

$0.752

10k+ parts

-

653

$1.440

$0.845

$0.752

-

Rochester

USA . 108,000 parts In-Stock

1+ parts

-

100+ parts

$0.835

1k+ parts

$0.693

10k+ parts

$0.618

108,000

-

$0.835

$0.693

$0.618

Verical

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.866

10k+ parts

$0.772

66,000

-

-

$0.866

$0.772

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,600 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

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3,600

$1.320

-

-

-

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$1.388

100+ parts

-

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-

10k+ parts

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52

$1.388

-

-

-

Chip Stock

USA . 39,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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39,500

-

-

-

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Vyrian

USA . 9,684 parts In-Stock

1+ parts

-

100+ parts

-

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9,684

-

-

-

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Anansix

USA . 402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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402

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,061 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

10,061

$0.600

-

-

-

Continental Prestige Electronics

USA . 2,034 parts In-Stock

1+ parts

$1.137

100+ parts

-

1k+ parts

-

10k+ parts

$1.114

2,034

$1.137

-

-

$1.114

Argo Parts USA

USA . 367 parts In-Stock

1+ parts

$1.137

100+ parts

-

1k+ parts

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10k+ parts

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367

$1.137

-

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Semicontronic

India . 12,054 parts In-Stock

1+ parts

$1.180

100+ parts

$1.150

1k+ parts

$1.145

10k+ parts

-

12,054

$1.180

$1.150

$1.145

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Corphita

USA . 2,193 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

-

10k+ parts

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2,193

$1.251

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$7.728

100+ parts

$7.342

1k+ parts

$7.342

10k+ parts

-

2,500

$7.728

$7.342

$7.342

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Corohmni

South Africa . 83 parts In-Stock

1+ parts

$8.825

100+ parts

-

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-

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83

$8.825

-

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Aztec Data Supply Inc.

USA . 812 parts In-Stock

1+ parts

$16.473

100+ parts

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812

$16.473

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iodParts Technologies Inc.

India . 100,000 parts In-Stock

1+ parts

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100,000

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Microchip USA

USA . 10,512 parts In-Stock

1+ parts

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10,512

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QUARKTWIN TECHNOLOGY LTD

USA . 8,295 parts In-Stock

1+ parts

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8,295

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Futuretech Components

Singapore . 6,000 parts In-Stock

1+ parts

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6,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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A-Z Elektronik GmbH

Germany . 1,200 parts In-Stock

1+ parts

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1,200

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UNI Independent Distributors

Spain . 517 parts In-Stock

1+ parts

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517

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Lixinc

USA . 496 parts In-Stock

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496

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Overview

Unlock seamless communication with the TJA1028TK/3V3/20/J by NXP Semiconductors. Designed for reliability, this LIN transceiver offers unparalleled quality and performance, making it the go-to choice for network interfaces in various applications. With a small outline and very thin profile, this product provides ease of installation while ensuring maximum efficiency. Experience the benefits of stable connectivity, low power consumption, and wide temperature range capabilities. Elevate your projects with the trusted solutions of NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, perfect for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, reducing production time and costs.

Screening Level: AEC-Q100

With AEC-Q100 screening level, this product meets rigorous automotive industry standards for reliability and performance, ensuring quality in demanding environments.

Package Shape: SQUARE

The square package shape allows for compact and space-efficient PCB design, ideal for applications where board space is limited.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options, allowing for versatile usage in different systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style offers efficient heat dissipation and space-saving design, making it suitable for compact devices.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this product can withstand rough environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments.

Terminal Position: DUAL

Dual terminal position enables better electrical connections, enhancing signal integrity and reducing the risk of connectivity issues.

Maximum Seated Height: 1 mm

The low seated height of 1 mm allows for a slim and compact overall product design, suitable for applications with space constraints.

Width: 3 mm

The small width of 3 mm contributes to a space-saving design, making it ideal for densely packed PCB layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during assembly, reducing the risk of solder joint failures.

Length: 3 mm

The compact length of 3 mm contributes to a small footprint, making it suitable for applications where board space is limited.

Terminal Form: NO LEAD

The no-lead terminal form complies with RoHS regulations, making it environmentally friendly and safe for use in various applications.

Maximum Supply Current: 4.5 mA

With a low maximum supply current of 4.5 mA, this product offers energy-efficient operation, reducing power consumption in the system.

Telecom IC Type: LIN TRANSCEIVER

The LIN transceiver type is ideal for automotive and industrial applications requiring reliable communication over local interconnect network (LIN), providing robust and efficient data transmission.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this product is compatible with standard voltage levels, ensuring easy integration into existing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on the PCB, enabling efficient use of board space and enabling compact designs.

Technical Specifications

Network Interfaces TJA1028TK/3V3/20/J attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

4.5 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TJA1028TK/3V3/20/J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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