Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE7250GVIOXUMA2 by Infineon Technologies is a network interface IC with 8 terminals in a small outline package. It operates at a nominal voltage of 5V and has gull wing terminal form. This AEC-Q100 compliant device is commonly used in automotive communication systems.
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$1.655
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Chip1Stop
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$1.540
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$1.140
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$1.087
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Farnell
$1.850
$1.190
$0.805
$0.751
Newark
$2.400
$1.450
$1.330
DigiKey
$2.730
$1.652
$1.457
Arrow
$1.081
Verical
$1.085
Rochester
$1.430
$1.060
Element14
$1.770
$1.560
$1.470
Nova Conductors
$1.040
Digiode
$1.076
Chip Stock
TME
$1.400
Vyrian
Rutronik
$2.350
ComSIT Distribution GmbH
ComSIT USA
Argo Parts USA
$0.865
Semicontronic
$0.920
$0.897
$0.892
Ampacity Inc.
Aranea Global
$1.019
$0.978
Corphita
$1.020
Component Stockers USA
$1.150
$1.050
$0.970
Advanced Electronics
$7.441
$7.069
Aztec Data Supply Inc.
$8.720
Modulus Dynamics
$9.898
$9.502
$9.106
Corohmni
$11.017
QUARKTWIN TECHNOLOGY LTD
Continental Prestige Electronics
$1.310
$0.954
Eastek
GreenTree Electronics
Infinite Electronics LLP (Excess)
Robosynatics
Lucentia Tech
Provides durability and protection for the internal components of the network interface.
Allows for easy and secure installation onto circuit boards, saving time and ensuring stability.
Ensures that the network interface meets the rigorous automotive industry standards for quality and reliability.
Provides multiple connection points for interfacing with other components, increasing flexibility and functionality.
Operates efficiently at a standard voltage level, making it compatible with a wide range of applications.
Network Interfaces TLE7250GVIOXUMA2 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
TLE7250GVIOXUMA2 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022 Mult Dev Label Chgs 11/Jan/2018
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
Goodwork Semiconductor
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
EU2B-YS2J03F
Idec
ROTARY SWITCH;
Changzhou Starsea Electronics
1N4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
1N4148WS
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358AN
Samsung
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
1N4148WT
Tak Cheong Electronics Holdings
DP83849CVS/NOPB
Texas Instruments
DP83849CVS/NOPB by Texas Instruments is a Network Interface with 3.3V power supply, 2 transceivers, and 100000 Mbps data rate. It is an Ethernet transceiver suitable for commercial temperature grade applications. The package style is flatpack with thin profile and fine pitch, making it ideal for surface mount designs.
88E3018-A2-NNC1I000
Marvell Technology
Marvell Technology's 88E3018-A2-NNC1I000 is a CMOS Ethernet transceiver with 64 terminals in a square chip carrier package. It operates in industrial temperature range (-40 to 85°C) with matte tin finish and no lead terminal form. Nominal voltage is 2.5V, making it suitable for network interfaces requiring high reliability and compact design.
DP83849IFVS/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE;
VSC8541XMV-05
Microchip Technology
Microchip Technology's VSC8541XMV-05 is an Ethernet transceiver IC with a data rate of 1000 Mbps. Operating temperature ranges from -40 to 125°C, suitable for automotive applications. The chip carrier package has 68 terminals in a square shape, with a very thin profile and no lead terminal form.
LAN8710A-EZC
LAN8710A-EZC by Microchip Technology is a 32-terminal Ethernet transceiver with 100 Mbps data rate. Operating b/w 0-85°C, it's ideal for network interfaces in commercial applications. This square chip carrier has a terminal pitch of 0.5 mm and requires a nominal voltage of 1.2 V.
LAN8740AI-EN-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
KSZ8091RNAIA-TR
KSZ8091RNAIA-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at -40 to 85 °C, in industrial settings. Features quad terminal position, matte tin finish, and square chip carrier package style for network interfaces. Suitable for surface mount applications with a compact size of 4x4 mm.
DP83867IRPAPT
DP83867IRPAPT by Texas Instruments is a Network Interface with 4 transceivers, supporting data rate of 1Gbps. It operates in industrial temperature range (-40 to 85°C) and has a low supply current of 73mA. Ideal for Ethernet applications requiring high-speed connectivity in compact spaces.
TCAN334GDCNT
TCAN334GDCNT by Texas Instruments is a Network Interface IC with 8 terminals, operating temperature range of -40 to 125°C. It features a small outline package style and supports data rates up to 5 Mbps. Ideal for automotive applications requiring a 3.3V supply voltage and interface circuit functionality.
SN65HVD234D
SN65HVD234D by Texas Instruments is an automotive-grade network interface IC with a data rate of 1 Mbps. It operates at temperatures ranging from -40 to 125°C and has a nominal voltage of 3.3V. This small-outline package with gull wing terminals is suitable for various interface circuit applications in automotive systems.
IFX1051LEXUMA1
Infineon Technologies
IFX1051LEXUMA1 by Infineon Technologies is a Network Interface with 8 terminals, operating temperature range of -40 to 125°C. It features a small outline package style and is suitable for automotive applications requiring a 5V supply voltage. The IC type is an interface circuit designed for surface mount assembly with tin terminal finish.
MCP2551T-I/SNG
MCP2551T-I/SNG by Microchip: CAN transceiver, 1 Mbps data rate, 5V supply voltage. Ideal for industrial applications requiring network interfaces. Small outline package with dual terminals and matte tin finish.
VSC7511XMY
Microsemi
SUPPORT CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 172; Package Code: QCCN; Package Shape: RECTANGULAR; Surface Mount: YES;
MCP2542FDT-E/MNY
MCP2542FDT-E/MNY by Microchip is a CAN FD transceiver with 8 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, with a supply voltage of 5V and max current of 140mA. The package is small outline, heat sink, very thin profile measuring 3x2mm in size.
TJA1044T,118
NXP Semiconductors
NXP Semiconductors' TJA1044T,118 is a network interface IC with 8 terminals and AEC-Q100 screening. It operates at 5V with a max supply current of 70mA. This small outline package is ideal for automotive applications requiring robust interface circuits.
LTC2875IS8#TRPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
DP83865DVH
DP83865DVH by Texas Instruments is an Ethernet transceiver IC with a data rate of 1000 Mbps. It operates at a supply voltage of 1.8V and has a terminal pitch of 0.5mm. This network interface chip is designed for commercial temperature grade applications.
88E1512PB2-NNP2C000
Marvell's 88E1512PB2-NNP2C000 is a CMOS Ethernet transceiver with 56 terminals in a square chip carrier package. Operating b/w 0-70°C, it has a low profile of 1mm and requires 1.8V supply voltage. Ideal for network interfaces, this component suits telecom applications due to its compact size and surface-mount capability.
LAN8741A-EN
LAN8741A-EN by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 0-70°C. Features 32 terminals in a square chip carrier package for surface mount applications. Ideal for commercial telecom systems requiring TS16949 screening level.
MCP2544FD-E/SN
MCP2544FD-E/SN by Microchip: CAN FD transceiver for automotive applications. Features 8 Mbps data rate, 140 mA max supply current, and operates b/w -40 to 125 °C. Ideal for network interfaces in automotive systems.
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TLE7268SKXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
TLE72593GEXUMA3
TLE72593GEXUMA3 by Infineon is an 8-terminal interface circuit with a nominal voltage of 8V. It features a small outline package style, gull wing terminal form, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE7250GXUMA1
TLE7250GXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 1.27mm terminal pitch. It is designed for telecom applications requiring small outline package style and dual terminal position for compact designs.
TLE7268LCXUMA1
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3; Terminal Finish: TIN;
TLE7251VSJXUMA1
TLE7251VSJXUMA1 by Infineon Technologies is an AEC-Q100 compliant network interface IC with 8 terminals in a small outline package. It operates at 5V, has gull wing terminals, and is suitable for telecom applications requiring interface circuits.
TLE7257LEXUMA1
LIN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE72593LEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE7250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE7250XLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Maximum Seated Height: 1.15 mm;
TLE7250LEXUMA1
TLE7250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V supply voltage. It features a square package shape, tin terminal finish, and dual terminal position. Ideal for automotive applications requiring a compact design and reliable network interfaces.
TLE7250VLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; JESD-609 Code: e3;
TLE7251VLEXUMA1
TLE7251VLEXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline, heat sink package. It operates at a nominal voltage of 5V and has a max seated height of 1.15mm. This IC is commonly used in telecom applications for interface circuitry.
TLE7263EXUMA2
LAN SWITCHING CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE7263E
TLE7263E by Infineon Technologies is a LAN switching circuit with 36 terminals in a small outline package. It operates at a nominal voltage of 13.5V and has a peak reflow temperature of 260°C. This network interface IC is designed for surface mount applications in telecommunications equipment.
TLE7250XSJ
INTERFACE CIRCUIT; Terminal Finish: NICKEL GOLD PALLADIUM; Moisture Sensitivity Level (MSL): 2A;
TLE7250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE7250SJ
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE7251VLE
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Terminal Pitch: .65 mm;
TLE7250GVIO
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
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