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TLE7263EXUMA2

Infineon Technologies

TLE7263EXUMA2 by Infineon Technologies

TLE7263EXUMA2 by Infineon Technologies is a LAN switching circuit with 36 terminals in a small outline package. It operates at a nominal voltage of 13.5V and has a terminal pitch of 0.65mm. This network interface IC is designed for surface mount applications requiring compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,577 parts In-Stock

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2,577

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Digiode

USA . 402 parts In-Stock

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402

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Nova Conductors

Japan . 20 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,915 parts In-Stock

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$13.387

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2,915

$13.387

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AZTECH Wire

Italy . 471 parts In-Stock

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$14.521

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471

$14.521

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Modulus Dynamics

Lithuania . 4,185 parts In-Stock

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$15.677

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$15.050

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$14.423

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4,185

$15.677

$15.050

$14.423

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Corohmni

South Africa . 359 parts In-Stock

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$16.259

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359

$16.259

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Ampacity Inc.

Singapore . 550 parts In-Stock

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$661.000

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550

$661.000

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Argo Parts USA

USA . 4,339 parts In-Stock

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Continental Prestige Electronics

USA . 3,604 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 518 parts In-Stock

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Microchip USA

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Overview

Unlock seamless connectivity with the TLE7263EXUMA2 from Infineon Technologies. Crafted with precision and expertise, this network interface module offers unparalleled reliability and performance in various applications. Whether you're looking to enhance your LAN switching circuit or streamline your telecom IC systems, this product is designed to exceed expectations. Say goodbye to connectivity issues and hello to effortless networking with the TLE7263EXUMA2. Trust in Infineon Technologies for top-notch quality and innovation at every turn.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

No. of Terminals: 36

Provides flexibility and connectivity options for complex network setups.

Maximum Seated Height: 2.55 mm

Low profile design helps in minimizing the overall size of the product, making it suitable for compact devices.

Telecom IC Type: LAN SWITCHING CIRCUIT

Specifically designed for LAN environments, ensuring efficient data transfer and network performance.

Nominal Supply Voltage: 13.5 V

Stable supply voltage ensures consistent performance and reliability of the product.

Technical Specifications

Network Interfaces TLE7263EXUMA2 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G36

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.55 mm

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.6 mm

Trade Compliance

TLE7263EXUMA2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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