Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE7250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V supply voltage. It features a square package shape, tin terminal finish, and dual terminal position. Ideal for automotive applications requiring a compact design and reliable network interfaces.
Median Price
$1.620
Lifecycle Status
Suppliers In-Stock
7
In-Stock Inventory
1k+
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1+ parts
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$1.235
TME
$1.300
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$1.100
Corphita
$1.170
Microchip USA
$7.842
Corohmni
$12.278
Modulus Dynamics
$15.809
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Aztec Data Supply Inc.
$17.402
AZTECH Wire
$18.150
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$1.440
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Argo Parts USA
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Authorized Procurement Solutions
Aranea Global
The use of plastic/epoxy material makes this product lightweight and durable, ensuring long-term performance.
Being surface mountable allows for easy and efficient installation onto circuit boards, saving time and effort during production.
The AEC-Q100 screening level ensures that this product meets rigorous automotive industry standards for reliability and performance.
The square package shape provides a compact design, making it easy to integrate into various applications with limited space constraints.
With 8 terminals, this product offers multiple connection points for more versatile and complex circuit configurations.
The small outline, heat sink/slub, and thin profile package style offers efficient heat dissipation and space-saving benefits.
The tin terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections.
Dual terminal positioning allows for improved signal integrity and reduced noise interference in high-frequency applications.
With a low maximum seated height, this product is suitable for compact electronic devices and applications with height restrictions.
The 3mm width of this product allows for easy placement on circuit boards without taking up too much space.
The 3mm length of this product contributes to its compact and space-efficient design, ideal for applications with limited board space.
The no-lead terminal form is environmentally friendly and complies with RoHS regulations, making this product a sustainable option.
Designed specifically for interface circuit applications, this product offers reliable and efficient performance in telecommunications systems.
The 5V nominal supply voltage makes this product compatible with standard power sources, ensuring easy integration into existing systems.
With a terminal pitch of 0.65mm, this product allows for precise and secure connections between components on the circuit board.
The MSL 2A rating indicates that this product has moderate moisture sensitivity, making it suitable for a wide range of environmental conditions.
Network Interfaces TLE7250LEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
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No. of Terminals:
Package Body Material:
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TLE7250LEXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Goodwork Semiconductor
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
1N4148
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Bourns
C0805C104K5RACTU
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
Comchip Technology
DP83848YB/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
DP83822HRHBT
Texas Instruments
DP83822HRHBT by Texas Instruments is an Ethernet transceiver with 4 transceivers, operating at 100Gbps. It has a temperature range of -40 to 125°C, suitable for automotive applications. The chip carrier package style with a low profile makes it ideal for surface mount designs.
KSZ9021GNI
Microchip Technology
Microchip Technology's KSZ9021GNI is a 64-terminal Ethernet transceiver with a data rate of 1000 Mbps. Operating in industrial temperature range (-40 to 85°C), it features a square chip carrier package style and terminal pitch of 0.4 mm. Ideal for network interfaces, this surface-mount component is compact (8x8 mm) and has a low seated height (0.9 mm).
88E6321-A0-NAZ2I000
Marvell Technology
SUPPORT CIRCUIT; No. of Functions: 1; Data Rate: 1000 Mbps;
LAN8741AI-EN
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
88E1512-A0-NNP2I000
Marvell's 88E1512-A0-NNP2I000 is a square-shaped, surface-mount Ethernet transceiver with 56 terminals. Operating at 1000 Mbps with a nominal voltage of 3.3 V, it is ideal for high-speed network interfaces in various telecom applications.
LAN8710AI-EZK-ABC
LAN8710AI-EZK-ABC by Microchip: Ethernet transceiver with 100 Mbps data rate, operates in -40 to 85 °C range. Features 32 terminals in a square chip carrier package for industrial applications. TS 16949 screening level ensures high quality and reliability.
KSZ8993MI
Micrel
LAN SWITCHING CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
TCAN1051HVDRBRQ1
TCAN1051HVDRBRQ1 by Texas Instruments is a network interface IC with AEC-Q100 screening. It operates b/w -55 to 125°C, has 8 terminals, and supports a data rate of 2 Mbps. Ideal for automotive applications requiring a reliable interface circuit in harsh environments.
VSC8211XVW
ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 117; Package Code: LBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 1.2 V;
DP83848CVV
DP83848CVV by Texas Instruments is an Ethernet transceiver with 48 terminals in a square flatpack package. It operates b/w 0-70°C, with a supply voltage of 3.3V. Ideal for network interfaces, this CMOS technology chip is surface mountable and has a terminal pitch of 0.5mm.
88E1111-B2-NDC2I000
Marvell's 88E1111-B2-NDC2I000 is a CMOS Ethernet transceiver with 96 terminals in a square chip carrier package. It has a terminal pitch of 0.6mm and operates at a nominal voltage of 1V. Ideal for network interfaces, this surface-mount device measures 9x9mm with a max seated height of 0.85mm.
LTC2875HS8#TRPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LAN9303M-AKZE
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 72; Package Code: HVQCCN; Package Shape: SQUARE;
LTC2875IDD#TRPBF
Analog Devices
LTC2875IDD#TRPBF by Analog Devices is a network interface IC with 8 terminals and a small outline package. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3.3V. This IC is commonly used for telecom interface circuits.
KSZ9897STXC-TR
Microchip Technology's KSZ9897STXC-TR is an Ethernet transceiver with 128 terminals in a square package. Operating temperature ranges from 0 to 70°C, suitable for commercial telecom applications. Terminal finish is matte tin with gull wing form, ideal for surface mount assembly.
MCP2551-I/SN
MCP2551-I/SN by Microchip Technology is a CAN transceiver with a data rate of 1 Mbps. It operates at a nominal voltage of 5V and has a max supply current of 75mA. This network interface is commonly used in industrial applications requiring reliable communication.
MCP2542FDT-H/MNY
MCP2542FDT-H/MNY by Microchip is a CAN FD transceiver with 8 Mbps data rate, suitable for automotive applications. It operates at -40 to 150°C, with a supply voltage of 5V and max current of 140mA. The package is small outline, heat sink, very thin profile, with nickel palladium gold finish and dual terminals.
DP83867IRPAPR
DP83867IRPAPR by Texas Instruments is an Ethernet transceiver with 8 transceivers, supporting data rate of 1000000 Mbps. It operates in industrial temperature range (-40 to 85 °C) and has a package style of flatpack with gull wing terminals. Ideal for network interfaces requiring high-speed connectivity in harsh environments.
ADM3050EBRIZ-RL
ADM3050EBRIZ-RL by Analog Devices is a Network Interface with 8 terminals, operating from -40 to 125°C. It features a small outline package style, Gull Wing terminal form, and supports MIL-STD-1553 data bus transceiver applications in automotive environments.
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TLE7250GVIOXUMA2
Infineon Technologies
TLE7250GVIOXUMA2 by Infineon Technologies is a network interface IC with 8 terminals in a small outline package. It operates at a nominal voltage of 5V and has gull wing terminal form. This AEC-Q100 compliant device is commonly used in automotive communication systems.
TLE7268SKXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
TLE72593GEXUMA3
TLE72593GEXUMA3 by Infineon is an 8-terminal interface circuit with a nominal voltage of 8V. It features a small outline package style, gull wing terminal form, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE7250GXUMA1
TLE7250GXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 1.27mm terminal pitch. It is designed for telecom applications requiring small outline package style and dual terminal position for compact designs.
TLE7268LCXUMA1
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3; Terminal Finish: TIN;
TLE7251VSJXUMA1
TLE7251VSJXUMA1 by Infineon Technologies is an AEC-Q100 compliant network interface IC with 8 terminals in a small outline package. It operates at 5V, has gull wing terminals, and is suitable for telecom applications requiring interface circuits.
TLE7257LEXUMA1
LIN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE72593LEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE7250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE7250XLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Maximum Seated Height: 1.15 mm;
TLE7250VLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; JESD-609 Code: e3;
TLE7251VLEXUMA1
TLE7251VLEXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline, heat sink package. It operates at a nominal voltage of 5V and has a max seated height of 1.15mm. This IC is commonly used in telecom applications for interface circuitry.
TLE7263EXUMA2
LAN SWITCHING CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE7263E
TLE7263E by Infineon Technologies is a LAN switching circuit with 36 terminals in a small outline package. It operates at a nominal voltage of 13.5V and has a peak reflow temperature of 260°C. This network interface IC is designed for surface mount applications in telecommunications equipment.
TLE7250XSJ
INTERFACE CIRCUIT; Terminal Finish: NICKEL GOLD PALLADIUM; Moisture Sensitivity Level (MSL): 2A;
TLE7250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE7250SJ
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE7251VLE
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Terminal Pitch: .65 mm;
TLE7250GVIO
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
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