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TLE7250LEXUMA1

Infineon Technologies

TLE7250LEXUMA1 by Infineon Technologies

TLE7250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V supply voltage. It features a square package shape, tin terminal finish, and dual terminal position. Ideal for automotive applications requiring a compact design and reliable network interfaces.

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,658 parts In-Stock

1+ parts

-

100+ parts

$1.590

1k+ parts

$1.320

10k+ parts

$1.180

4,658

-

$1.590

$1.320

$1.180

Verical

USA . 4,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

$1.475

4,658

-

-

$1.650

$1.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 424 parts In-Stock

1+ parts

$1.235

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$1.235

-

-

-

TME

Poland . 8 parts In-Stock

1+ parts

$1.300

100+ parts

$0.810

1k+ parts

$0.760

10k+ parts

-

8

$1.300

$0.810

$0.760

-

Vyrian

USA . 7,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,890

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Bristol Electronics

USA . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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253

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,251 parts In-Stock

1+ parts

$1.100

100+ parts

-

1k+ parts

-

10k+ parts

-

4,251

$1.100

-

-

-

Corphita

USA . 593 parts In-Stock

1+ parts

$1.170

100+ parts

-

1k+ parts

-

10k+ parts

-

593

$1.170

-

-

-

Microchip USA

USA . 2,292 parts In-Stock

1+ parts

$7.842

100+ parts

-

1k+ parts

-

10k+ parts

-

2,292

$7.842

-

-

-

Corohmni

South Africa . 1,042 parts In-Stock

1+ parts

$12.278

100+ parts

-

1k+ parts

-

10k+ parts

-

1,042

$12.278

-

-

-

Modulus Dynamics

Lithuania . 1,924 parts In-Stock

1+ parts

$15.809

100+ parts

$15.177

1k+ parts

$14.544

10k+ parts

-

1,924

$15.809

$15.177

$14.544

-

Aztec Data Supply Inc.

USA . 25,498 parts In-Stock

1+ parts

$17.402

100+ parts

-

1k+ parts

-

10k+ parts

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25,498

$17.402

-

-

-

AZTECH Wire

Italy . 153 parts In-Stock

1+ parts

$18.150

100+ parts

-

1k+ parts

-

10k+ parts

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153

$18.150

-

-

-

RC Electronics

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.360

10k+ parts

$1.330

18,000

-

$1.440

$1.360

$1.330

Argo Parts USA

USA . 1,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,635

-

-

-

-

Continental Prestige Electronics

USA . 1,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,550

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unleash the power of seamless networking with the TLE7250LEXUMA1 by Infineon Technologies. Crafted with precision and expertise, this network interface device is designed to deliver unparalleled performance and reliability in various applications. From automotive to industrial sectors, this product offers unmatched value, benefits, and advantages to customers seeking top-notch connectivity solutions. Elevate your projects with the quality and innovation that only Infineon Technologies can provide. Trust in the TLE7250LEXUMA1 for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ensuring long-term performance.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards, saving time and effort during production.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that this product meets rigorous automotive industry standards for reliability and performance.

Package Shape: SQUARE

The square package shape provides a compact design, making it easy to integrate into various applications with limited space constraints.

No. of Terminals: 8

With 8 terminals, this product offers multiple connection points for more versatile and complex circuit configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

The small outline, heat sink/slub, and thin profile package style offers efficient heat dissipation and space-saving benefits.

Terminal Finish: TIN

The tin terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for improved signal integrity and reduced noise interference in high-frequency applications.

Maximum Seated Height: 1.15 mm

With a low maximum seated height, this product is suitable for compact electronic devices and applications with height restrictions.

Width: 3 mm

The 3mm width of this product allows for easy placement on circuit boards without taking up too much space.

Length: 3 mm

The 3mm length of this product contributes to its compact and space-efficient design, ideal for applications with limited board space.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS regulations, making this product a sustainable option.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, this product offers reliable and efficient performance in telecommunications systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage makes this product compatible with standard power sources, ensuring easy integration into existing systems.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product allows for precise and secure connections between components on the circuit board.

Moisture Sensitivity Level (MSL): 2A

The MSL 2A rating indicates that this product has moderate moisture sensitivity, making it suitable for a wide range of environmental conditions.

Technical Specifications

Network Interfaces TLE7250LEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE7250LEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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