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TLE7257LEXUMA1

Infineon Technologies

TLE7257LEXUMA1 by Infineon Technologies

TLE7257LEXUMA1 by Infineon is a LIN transceiver with 8 terminals, operating at -40 to 150°C. It features a data rate of 0.02 Mbps and operates at a nominal voltage of 7V. This network interface IC is ideal for automotive applications due to its AEC-Q100 screening level and small outline package style.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4,989 parts In-Stock

1+ parts

$0.904

100+ parts

$0.462

1k+ parts

$0.396

10k+ parts

$0.375

4,989

$0.904

$0.462

$0.396

$0.375

Newark

USA . 4,968 parts In-Stock

1+ parts

$1.100

100+ parts

$0.630

1k+ parts

$0.546

10k+ parts

-

4,968

$1.100

$0.630

$0.546

-

Chip1Stop

Japan . 4,700 parts In-Stock

1+ parts

$1.120

100+ parts

$0.635

1k+ parts

$0.608

10k+ parts

-

4,700

$1.120

$0.635

$0.608

-

Mouser Electronics

USA . 1,544 parts In-Stock

1+ parts

$1.290

100+ parts

$0.739

1k+ parts

$0.585

10k+ parts

$0.498

1,544

$1.290

$0.739

$0.585

$0.498

Element14

Singapore . 4,995 parts In-Stock

1+ parts

$1.387

100+ parts

$0.930

1k+ parts

$0.636

10k+ parts

$0.593

4,995

$1.387

$0.930

$0.636

$0.593

Rochester

USA . 9,558 parts In-Stock

1+ parts

-

100+ parts

$0.616

1k+ parts

$0.511

10k+ parts

$0.456

9,558

-

$0.616

$0.511

$0.456

Verical

USA . 4,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.639

10k+ parts

$0.570

4,630

-

-

$0.639

$0.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 782 parts In-Stock

1+ parts

$0.491

100+ parts

-

1k+ parts

-

10k+ parts

-

782

$0.491

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.852

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.852

-

-

-

NAC Semi

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.708

5,000

-

-

-

$0.708

Vyrian

USA . 4,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,531

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,561 parts In-Stock

1+ parts

$0.439

100+ parts

$0.428

1k+ parts

$0.426

10k+ parts

-

4,561

$0.439

$0.428

$0.426

-

Ampacity Inc.

Singapore . 4,358 parts In-Stock

1+ parts

$0.439

100+ parts

-

1k+ parts

-

10k+ parts

-

4,358

$0.439

-

-

-

Corphita

USA . 73 parts In-Stock

1+ parts

$0.465

100+ parts

-

1k+ parts

-

10k+ parts

-

73

$0.465

-

-

-

Argo Parts USA

USA . 1,897 parts In-Stock

1+ parts

$0.852

100+ parts

-

1k+ parts

-

10k+ parts

-

1,897

$0.852

-

-

-

Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

$1.610

100+ parts

$1.000

1k+ parts

$0.730

10k+ parts

-

5,000

$1.610

$1.000

$0.730

-

Microchip USA

USA . 4,004 parts In-Stock

1+ parts

$5.535

100+ parts

-

1k+ parts

-

10k+ parts

-

4,004

$5.535

-

-

-

Modulus Dynamics

Lithuania . 43 parts In-Stock

1+ parts

$13.890

100+ parts

$13.334

1k+ parts

$12.779

10k+ parts

-

43

$13.890

$13.334

$12.779

-

Perfect Parts

USA . 329,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

329,560

-

-

-

-

iodParts Technologies Inc.

India . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Overview

Unlock seamless communication with the TLE7257LEXUMA1 from Infineon Technologies, a leading manufacturer known for top-quality network interfaces. This LIN transceiver offers unparalleled reliability and performance in a compact package, making it ideal for various applications. With a wide operating temperature range and advanced technology, this product ensures smooth data transmission at high speeds. Experience the value of superior connectivity and efficiency with the TLE7257LEXUMA1 - the perfect solution for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the product sturdy and easy to handle.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the circuit board.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality standards for automotive applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C makes the product suitable for challenging environments.

Technology: BICMOS

BICMOS technology enables high speed and low power consumption, making the product efficient and reliable.

Technical Specifications

Network Interfaces TLE7257LEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

.02 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

7 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE7257LEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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