Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE7250GXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 1.27mm terminal pitch. It is designed for telecom applications requiring small outline package style and dual terminal position for compact designs.
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$0.671
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Rochester
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$0.996
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Corphita
$0.604
Modulus Dynamics
$0.826
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Corohmni
Advanced Electronics
$0.851
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Continental Prestige Electronics
$0.973
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Argo Parts USA
Netroflash
$0.976
Aztec Data Supply Inc.
$10.860
AZTECH Wire
$14.603
RC Electronics
$0.910
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GreenTree Electronics
Perfect Parts
Infinite Electronics LLP (Excess)
Plastic/Epoxy material ensures durability and lightweight design, making this product suitable for various applications.
Being surface mountable simplifies the assembly process and saves space on the PCB, enhancing overall efficiency.
AEC-Q100 screening ensures high reliability and quality, making this product suitable for automotive applications where stringent standards are required.
Rectangular shape offers versatility in placement and integration within different electronic systems.
Having 8 terminals allows for multiple connections and functions, providing flexibility in usage.
Small outline package style saves space on the PCB and is suitable for compact electronic designs.
Nickel, gold, and palladium finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.
Dual terminal position allows for a secure connection and improved stability in the circuit.
Low seated height enables a sleek and slim profile of the product, ideal for space-constrained applications.
Compact width dimensions provide versatility in placement and compatibility with various PCB designs.
Optimal length measurement allows for easy integration into electronic systems without occupying excessive space.
Gull wing terminal form facilitates easy soldering and efficient electrical connections, enhancing the assembly process.
Designed specifically for interface circuits in telecom applications, ensuring compatibility and reliable performance in communication systems.
Operates at a nominal supply voltage of 5V, making it compatible with standard power sources in various electronic devices.
With a terminal pitch of 1.27mm, this product allows for precise and secure connections on the PCB, ensuring reliable performance.
MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage or assembly processes, ensuring robustness in different environments.
Network Interfaces TLE7250GXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
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No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
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Telecom IC Type:
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TLE7250GXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Hy Electronic
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
Surge Components
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Comchip Technology
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MAX33041EASA+
Maxim Integrated
CAN TRANSCEIVER; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
TCAN1051HDRQ1
Texas Instruments
TCAN1051HDRQ1 by Texas Instruments is a Network Interface with AEC-Q100 screening. It operates b/w -55 to 125°C, supporting data rates up to 2 Mbps. Ideal for automotive applications due to its MILITARY temperature grade and small outline package design.
LAN9303-ABZJ
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
ISO1042BQDWVQ1
ISO1042BQDWVQ1 by Texas Instruments is an AEC-Q100 compliant network interface with 8 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. Featuring a small outline package style, it has a terminal pitch of 1.27mm and nominal voltage of 1.8V.
DP83826ERHBT
DP83826ERHBT by Texas Instruments is an Ethernet transceiver with 100000 Mbps data rate. It operates at -40 to 105 °C, suitable for industrial use. The chip carrier package has 32 terminals, nickel palladium gold finish, and is surface mountable.
VSC8211XVW
Microchip VSC8211XVW is a network interface IC with 117 terminals in a rectangular package. It operates at temperatures from 0 to 100°C, drawing a max current of 324mA at 1.2V. This Ethernet transceiver supports data rates up to 1000Mbps, making it ideal for high-speed networking applications.
TJA1028TK/3V3/20/X
NXP Semiconductors
NXP Semiconductors' TJA1028TK/3V3/20/X is a LIN transceiver with 8 terminals, operating at -40 to 150°C. It has a supply voltage of 3.3V and max current of 4.5mA, suitable for automotive applications meeting AEC-Q100 standards. This small outline package with heat sink is surface mountable and ideal for telecom networks.
TJA1041T/CM,118
NXP Semiconductors' TJA1041T/CM,118 is a Network Interface IC with 14 terminals in a small outline package. It operates at 5V nominal voltage and has a peak reflow temperature of 260°C. Ideal for telecom applications, it features Gull Wing terminal form and dual position.
KSZ8081RNAIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
LAN8720AI-CP-TR
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
DP83848QSQE/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
LAN8740AI-EN
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
DP83867IRRGZT
DP83867IRRGZT by Texas Instruments is an Ethernet transceiver with 1.1V supply voltage, 1000000 Mbps data rate, and operates in industrial temperature range. It comes in a square chip carrier package with 48 terminals for surface mount applications. Ideal for high-speed network interfaces requiring reliable performance in harsh environments.
MAX13054ASA-T
MAX13054ASA-T by Maxim Integrated is a network interface with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 5V, data rate of 1Mbps, and is ideal for automotive applications requiring small outline packages.
LTC2875HDD#PBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
SN65HVD231QDR
SN65HVD231QDR by Texas Instruments is a BICMOS interface circuit with 1Mbps data rate and 3.3V nominal voltage. It operates in automotive temperature grade range (-40 to 125°C) and has a small outline package style for surface mount applications. With low supply current (0.017mA), it's ideal for network interfaces in automotive electronics.
DP83848IVVX/NOPB
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
Microsemi
ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 117; Package Code: LBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 1.2 V;
SN65HVD233DRG4
SN65HVD233DRG4 by Texas Instruments is a network interface IC with 1 channel and a data rate of 1 Mbps. It operates at temperatures ranging from -40 to 125 °C and has a small outline package style, making it suitable for automotive applications.
USB3320C-EZK-TR
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
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TLE7250GVIOXUMA2
Infineon Technologies
TLE7250GVIOXUMA2 by Infineon Technologies is a network interface IC with 8 terminals in a small outline package. It operates at a nominal voltage of 5V and has gull wing terminal form. This AEC-Q100 compliant device is commonly used in automotive communication systems.
TLE7268SKXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
TLE72593GEXUMA3
TLE72593GEXUMA3 by Infineon is an 8-terminal interface circuit with a nominal voltage of 8V. It features a small outline package style, gull wing terminal form, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE7268LCXUMA1
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3; Terminal Finish: TIN;
TLE7251VSJXUMA1
TLE7251VSJXUMA1 by Infineon Technologies is an AEC-Q100 compliant network interface IC with 8 terminals in a small outline package. It operates at 5V, has gull wing terminals, and is suitable for telecom applications requiring interface circuits.
TLE7257LEXUMA1
LIN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE72593LEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE7250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE7250XLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Maximum Seated Height: 1.15 mm;
TLE7250LEXUMA1
TLE7250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V supply voltage. It features a square package shape, tin terminal finish, and dual terminal position. Ideal for automotive applications requiring a compact design and reliable network interfaces.
TLE7250VLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; JESD-609 Code: e3;
TLE7251VLEXUMA1
TLE7251VLEXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline, heat sink package. It operates at a nominal voltage of 5V and has a max seated height of 1.15mm. This IC is commonly used in telecom applications for interface circuitry.
TLE7263EXUMA2
LAN SWITCHING CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE7263E
TLE7263E by Infineon Technologies is a LAN switching circuit with 36 terminals in a small outline package. It operates at a nominal voltage of 13.5V and has a peak reflow temperature of 260°C. This network interface IC is designed for surface mount applications in telecommunications equipment.
TLE7250XSJ
INTERFACE CIRCUIT; Terminal Finish: NICKEL GOLD PALLADIUM; Moisture Sensitivity Level (MSL): 2A;
TLE7250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE7250SJ
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE7251VLE
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Terminal Pitch: .65 mm;
TLE7250GVIO
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
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