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TLE7250GXUMA1

Infineon Technologies

TLE7250GXUMA1 by Infineon Technologies

TLE7250GXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 1.27mm terminal pitch. It is designed for telecom applications requiring small outline package style and dual terminal position for compact designs.

Median Price

$0.671

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 141 parts In-Stock

1+ parts

$0.671

100+ parts

$0.631

1k+ parts

$0.570

10k+ parts

-

141

$0.671

$0.631

$0.570

-

Avnet

USA . 141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

141

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 725 parts In-Stock

1+ parts

$0.637

100+ parts

-

1k+ parts

-

10k+ parts

-

725

$0.637

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.996

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.996

-

-

-

Chip Stock

USA . 53,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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53,500

-

-

-

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Vyrian

USA . 5,309 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,309

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$0.570

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$0.570

-

-

-

Semicontronic

India . 141 parts In-Stock

1+ parts

$0.570

100+ parts

$0.556

1k+ parts

$0.553

10k+ parts

-

141

$0.570

$0.556

$0.553

-

Corphita

USA . 587 parts In-Stock

1+ parts

$0.604

100+ parts

-

1k+ parts

-

10k+ parts

-

587

$0.604

-

-

-

Modulus Dynamics

Lithuania . 1,456 parts In-Stock

1+ parts

$0.826

100+ parts

$0.793

1k+ parts

$0.760

10k+ parts

-

1,456

$0.826

$0.793

$0.760

-

Corohmni

South Africa . 214 parts In-Stock

1+ parts

$0.826

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$0.826

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$0.851

100+ parts

$0.808

1k+ parts

$0.808

10k+ parts

-

5,000

$0.851

$0.808

$0.808

-

Continental Prestige Electronics

USA . 2,949 parts In-Stock

1+ parts

$0.973

100+ parts

-

1k+ parts

-

10k+ parts

$0.954

2,949

$0.973

-

-

$0.954

Argo Parts USA

USA . 199 parts In-Stock

1+ parts

$0.973

100+ parts

-

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-

10k+ parts

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199

$0.973

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.996

100+ parts

$0.976

1k+ parts

-

10k+ parts

-

2,000

$0.996

$0.976

-

-

Aztec Data Supply Inc.

USA . 252 parts In-Stock

1+ parts

$10.860

100+ parts

-

1k+ parts

-

10k+ parts

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252

$10.860

-

-

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AZTECH Wire

Italy . 359 parts In-Stock

1+ parts

$14.603

100+ parts

-

1k+ parts

-

10k+ parts

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359

$14.603

-

-

-

RC Electronics

USA . 80,585 parts In-Stock

1+ parts

-

100+ parts

$0.910

1k+ parts

$0.830

10k+ parts

$0.800

80,585

-

$0.910

$0.830

$0.800

GreenTree Electronics

Israel . 79,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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79,000

-

-

-

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Perfect Parts

USA . 13,465 parts In-Stock

1+ parts

-

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13,465

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Infinite Electronics LLP (Excess)

. 2,007 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,007

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-

Overview

Enhance your network interfaces with the TLE7250GXUMA1 by Infineon Technologies. Known for their top-quality products, Infineon Technologies brings you a reliable solution that guarantees seamless connectivity and efficient performance. Whether you're looking to upgrade your automotive systems or enhance your industrial applications, this compact yet powerful interface circuit offers unparalleled value and benefits. Say goodbye to connectivity issues and hello to a smooth and reliable networking experience. Choose the TLE7250GXUMA1 and take your systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design, making this product suitable for various applications.

Surface Mount: YES

Being surface mountable simplifies the assembly process and saves space on the PCB, enhancing overall efficiency.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this product suitable for automotive applications where stringent standards are required.

Package Shape: RECTANGULAR

Rectangular shape offers versatility in placement and integration within different electronic systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functions, providing flexibility in usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact electronic designs.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel, gold, and palladium finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for a secure connection and improved stability in the circuit.

Maximum Seated Height: 1.75 mm

Low seated height enables a sleek and slim profile of the product, ideal for space-constrained applications.

Width: 4 mm

Compact width dimensions provide versatility in placement and compatibility with various PCB designs.

Length: 5 mm

Optimal length measurement allows for easy integration into electronic systems without occupying excessive space.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and efficient electrical connections, enhancing the assembly process.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuits in telecom applications, ensuring compatibility and reliable performance in communication systems.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5V, making it compatible with standard power sources in various electronic devices.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product allows for precise and secure connections on the PCB, ensuring reliable performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage or assembly processes, ensuring robustness in different environments.

Technical Specifications

Network Interfaces TLE7250GXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE7250GXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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