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TLE7250VLEXUMA1

Infineon Technologies

TLE7250VLEXUMA1 by Infineon Technologies

TLE7250VLEXUMA1 by Infineon is an 8-terminal interface circuit with a 5V supply voltage. It features a small outline package style, tin terminal finish, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact square shape and surface-mount capability.

Median Price

$1.650

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 34,750 parts In-Stock

1+ parts

$3.560

100+ parts

$2.221

1k+ parts

$1.979

10k+ parts

$1.882

34,750

$3.560

$2.221

$1.979

$1.882

Rochester

USA . 8,658 parts In-Stock

1+ parts

-

100+ parts

$1.590

1k+ parts

$1.320

10k+ parts

$1.180

8,658

-

$1.590

$1.320

$1.180

Verical

USA . 3,849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

$1.475

3,849

-

-

$1.650

$1.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 705 parts In-Stock

1+ parts

$1.235

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$1.235

-

-

-

TME

Poland . 38 parts In-Stock

1+ parts

$1.340

100+ parts

$0.840

1k+ parts

$0.770

10k+ parts

-

38

$1.340

$0.840

$0.770

-

Vyrian

USA . 18,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,146

-

-

-

-

Chip Stock

USA . 10,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,720

-

-

-

-

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

94

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,202 parts In-Stock

1+ parts

$1.100

100+ parts

-

1k+ parts

-

10k+ parts

-

12,202

$1.100

-

-

-

Corphita

USA . 731 parts In-Stock

1+ parts

$1.170

100+ parts

-

1k+ parts

-

10k+ parts

-

731

$1.170

-

-

-

Aztec Data Supply Inc.

USA . 807 parts In-Stock

1+ parts

$5.880

100+ parts

-

1k+ parts

-

10k+ parts

-

807

$5.880

-

-

-

Microchip USA

USA . 1,860 parts In-Stock

1+ parts

$7.842

100+ parts

-

1k+ parts

-

10k+ parts

-

1,860

$7.842

-

-

-

Corohmni

South Africa . 308 parts In-Stock

1+ parts

$10.793

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$10.793

-

-

-

Modulus Dynamics

Lithuania . 1,175 parts In-Stock

1+ parts

$14.355

100+ parts

$13.781

1k+ parts

$13.207

10k+ parts

-

1,175

$14.355

$13.781

$13.207

-

RC Electronics

USA . 20,700 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.190

10k+ parts

$1.170

20,700

-

$1.270

$1.190

$1.170

Continental Prestige Electronics

USA . 3,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,680

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Argo Parts USA

USA . 819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

819

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Upgrade your network interfaces with the TLE7250VLEXUMA1 from Infineon Technologies, a leading manufacturer known for its top-quality products. This small outline package offers a reliable solution for various applications, ensuring seamless connectivity and optimized performance. With its advanced features and AEC-Q100 screening level, this interface circuit delivers unmatched value and benefits to customers. Trust in Infineon Technologies to provide you with cutting-edge solutions that meet your networking needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive applications.

No. of Terminals: 8

Having 8 terminals provides flexibility and connectivity options for the network interface.

Terminal Finish: TIN

The terminal finish of tin offers good conductivity and corrosion resistance, ensuring stable performance over time.

Maximum Seated Height: 1.1 mm

With a low seated height, the product helps in minimizing the overall profile of the device.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, the product is compatible with standard power sources.

Width: 3 mm

The compact width of 3mm saves space on the circuit board and allows for efficient use of available area.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm enables high-density packing and connectivity in limited spaces.

Moisture Sensitivity Level (MSL): 2A

The MSL 2A rating indicates the product can withstand moderate moisture exposure during storage or handling.

Technical Specifications

Network Interfaces TLE7250VLEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE7250VLEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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