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TLE7263E

Infineon Technologies

TLE7263E by Infineon Technologies

TLE7263E by Infineon Technologies is a LAN switching circuit with 36 terminals in a small outline package. It operates at a nominal voltage of 13.5V and has a peak reflow temperature of 260°C. This network interface IC is designed for surface mount applications in telecommunications equipment.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,670 parts In-Stock

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2,670

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Digiode

USA . 995 parts In-Stock

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995

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Modulus Dynamics

Lithuania . 3,224 parts In-Stock

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$10.453

100+ parts

$10.035

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$9.617

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3,224

$10.453

$10.035

$9.617

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Corohmni

South Africa . 141 parts In-Stock

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$11.836

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141

$11.836

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AZTECH Wire

Italy . 498 parts In-Stock

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$16.399

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498

$16.399

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Aztec Data Supply Inc.

USA . 2,306 parts In-Stock

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$16.578

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2,306

$16.578

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Andel Nordic

Denmark . 305 parts In-Stock

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$27.090

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$18.965

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$18.965

305

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$18.965

$18.965

Ampacity Inc.

Singapore . 824 parts In-Stock

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$554.000

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824

$554.000

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A-Z Elektronik GmbH

Germany . 11,336 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 5,477 parts In-Stock

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Continental Prestige Electronics

USA . 5,457 parts In-Stock

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Benley Electronics

USA . 4,000 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 262 parts In-Stock

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262

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Argo Parts USA

USA . 197 parts In-Stock

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197

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Microchip USA

USA . 132 parts In-Stock

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132

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Kepictronics

USA . 66 parts In-Stock

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Overview

Elevate your network interface capabilities with the TLE7263E by Infineon Technologies. Designed with precision and quality in mind, this LAN switching circuit offers unparalleled performance and reliability. Whether you're looking to enhance your telecommunications systems or optimize your network infrastructure, this versatile component is the perfect solution. With its compact size, dual terminal position, and high supply voltage, the TLE7263E delivers exceptional value and benefits to our customers. Upgrade your networking experience today with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and light weight, making the product suitable for various applications.

Surface Mount: YES

The surface mount design allows for easy installation and provides a space-saving solution.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard equipment and ensures a secure fit.

No. of Terminals: 36

The high number of terminals allows for complex connectivity options, making the product versatile.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style enhances heat dissipation and reduces signal interference, ensuring optimal performance.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves reliability in case of a single terminal failure.

Maximum Seated Height: 2.55 mm

The low seated height allows for a compact design, ideal for space-constrained applications.

Width: 7.6 mm

The narrow width makes the product suitable for installations where space is limited.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures solder joints are properly formed, enhancing the product's reliability.

Length: 12.8 mm

The moderate length strikes a balance between compactness and ease of handling during installation.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and easy visual inspection of solder joints.

Telecom IC Type: LAN SWITCHING CIRCUIT

The LAN switching circuit type offers fast and efficient data transfer capabilities for networking applications.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage is suitable for a wide range of power sources, making the product versatile.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, increasing the product's functionality in crowded PCBs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product can withstand moderate exposure to moisture, enhancing its durability in varied environments.

Technical Specifications

Network Interfaces TLE7263E attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G36

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

7.6 mm

Trade Compliance

TLE7263E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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