Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE7263E by Infineon Technologies is a LAN switching circuit with 36 terminals in a small outline package. It operates at a nominal voltage of 13.5V and has a peak reflow temperature of 260°C. This network interface IC is designed for surface mount applications in telecommunications equipment.
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This material provides durability and light weight, making the product suitable for various applications.
The surface mount design allows for easy installation and provides a space-saving solution.
The rectangular shape offers compatibility with standard equipment and ensures a secure fit.
The high number of terminals allows for complex connectivity options, making the product versatile.
This package style enhances heat dissipation and reduces signal interference, ensuring optimal performance.
The dual terminal position provides redundancy and improves reliability in case of a single terminal failure.
The low seated height allows for a compact design, ideal for space-constrained applications.
The narrow width makes the product suitable for installations where space is limited.
The high peak reflow temperature ensures solder joints are properly formed, enhancing the product's reliability.
The moderate length strikes a balance between compactness and ease of handling during installation.
The gull-wing terminal form provides mechanical strength and easy visual inspection of solder joints.
The LAN switching circuit type offers fast and efficient data transfer capabilities for networking applications.
The nominal supply voltage is suitable for a wide range of power sources, making the product versatile.
The small terminal pitch allows for high-density mounting, increasing the product's functionality in crowded PCBs.
The MSL 3 rating indicates the product can withstand moderate exposure to moisture, enhancing its durability in varied environments.
Network Interfaces TLE7263E attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
TLE7263E Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
LL4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Philips Components
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Diodes Incorporated
TJA1043T,112
NXP Semiconductors
NXP Semiconductors' TJA1043T,112 is a CAN transceiver with 1Mbps data rate and 5V nominal voltage. It features 14 terminals in a small outline package for automotive applications. AEC-Q100 screening level ensures reliability in harsh environments.
TJA1050T/VM,112
NXP Semiconductors' TJA1050T/VM,112 is a Network Interface with 1 Mbps Data Rate and 5V Nominal Voltage. It is designed for automotive applications, featuring a CMOS Technology and operating temperature range from -40 to 125°C. The package style is small outline with dual terminal position in a rectangular shape.
IFX1051LEXUMA1
Infineon Technologies
IFX1051LEXUMA1 by Infineon Technologies is a Network Interface with 8 terminals, operating temperature range of -40 to 125°C. It features a small outline package style and is suitable for automotive applications requiring a 5V supply voltage. The IC type is an interface circuit designed for surface mount assembly with tin terminal finish.
TCAN1044VDDFRQ1
Texas Instruments
TCAN1044VDDFRQ1 by Texas Instruments is an AEC-Q100 compliant CAN FD transceiver with 8 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, with a supply voltage of 5V and max current of 130mA. The package is small outline, thin profile, with gull wing terminals and nickel palladium gold finish.
TJA1040T/VM,112
NXP Semiconductors' TJA1040T/VM,112 is a CMOS interface circuit with 8 terminals and 5V supply voltage. It operates at 1Mbps data rate, suitable for network interfaces. The small outline package measures 4.9mm x 3.9mm with gull wing terminals, making it ideal for surface mount applications.
KSZ8041FTLI-TR
Microchip Technology
Microchip's KSZ8041FTLI-TR is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85°C. It features a 48-terminal flatpack package suitable for industrial applications. With a supply voltage of 3.3V and low current draw of 58.3mA, it's ideal for network interfaces in various electronic devices.
DP83867IRPAPT
DP83867IRPAPT by Texas Instruments is a Network Interface with 4 transceivers, supporting data rate of 1Gbps. It operates in industrial temperature range (-40 to 85°C) and has a low supply current of 73mA. Ideal for Ethernet applications requiring high-speed connectivity in compact spaces.
LAN8742AI-CZ
LAN8742AI-CZ by Microchip is an Ethernet transceiver with 100 Mbps data rate. It operates at -40 to 85 °C, suitable for industrial use. The chip carrier package has 24 terminals in a square shape, making it ideal for network interfaces.
NCV7344D13R2G
NCV7344D13R2G by Onsemi is an AEC-Q100 compliant CAN FD transceiver with 5 Mbps data rate, suitable for automotive applications. It operates at temperatures ranging from -40 to 150°C and has a nominal voltage of 5V. This small outline package features gull wing terminals and matte tin finish, making it ideal for network interfaces in automotive systems.
TCAN1044VDDFR
TCAN1044VDDFR by Texas Instruments is a Network Interface IC with 8 terminals, operating temperature range of -40 to 125°C. It features Gull Wing terminals, 5V supply voltage, and supports data rate up to 8 Mbps. Ideal for automotive applications due to its small form factor and high-temperature grade suitability.
SN65HVD230QDRG4
SN65HVD230QDRG4 by Texas Instruments is a BICMOS technology interface circuit with a data rate of 1 Mbps. It operates at a nominal voltage of 3.3V and is commonly used in automotive applications due to its temperature grade and small outline package style.
KSZ8041TL
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;
SN65HVD251DRG4
SN65HVD251DRG4 by Texas Instruments is a BICMOS interface circuit with 1Mbps data rate, suitable for automotive applications. It operates at temperatures ranging from -40 to 125°C and requires a 5V power supply. This small outline package has dual terminals and is designed for surface mount assembly.
TJA1057GTKZ
INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1;
KSZ8081RNBIA-TR
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
SN65HVD231DG4
SN65HVD231DG4 by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, operating at 3.3V. It has 8 terminals in a small outline package suitable for industrial temperature range applications. The device features gull wing terminal form and nickel/palladium/gold finish, making it ideal for network interfaces requiring low supply current.
LAN8742AI-CZ-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
DP83822HRHBT
DP83822HRHBT by Texas Instruments is an Ethernet transceiver with 4 transceivers, operating at 100Gbps. It has a temperature range of -40 to 125°C, suitable for automotive applications. The chip carrier package style with a low profile makes it ideal for surface mount designs.
KSZ8081MLXCA-TR
KSZ8081MLXCA-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 0-70°C. Features 48 terminals in a low profile flatpack package. Ideal for network interfaces in commercial telecom applications.
PCA82C251T/N3
Philips Semiconductors
CAN TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TLE7250GVIOXUMA2
TLE7250GVIOXUMA2 by Infineon Technologies is a network interface IC with 8 terminals in a small outline package. It operates at a nominal voltage of 5V and has gull wing terminal form. This AEC-Q100 compliant device is commonly used in automotive communication systems.
TLE7268SKXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
TLE72593GEXUMA3
TLE72593GEXUMA3 by Infineon is an 8-terminal interface circuit with a nominal voltage of 8V. It features a small outline package style, gull wing terminal form, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact size and surface-mount capability.
TLE7250GXUMA1
TLE7250GXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 1.27mm terminal pitch. It is designed for telecom applications requiring small outline package style and dual terminal position for compact designs.
TLE7268LCXUMA1
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3; Terminal Finish: TIN;
TLE7251VSJXUMA1
TLE7251VSJXUMA1 by Infineon Technologies is an AEC-Q100 compliant network interface IC with 8 terminals in a small outline package. It operates at 5V, has gull wing terminals, and is suitable for telecom applications requiring interface circuits.
TLE7257LEXUMA1
LIN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE72593LEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE7250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE7250XLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Maximum Seated Height: 1.15 mm;
TLE7250LEXUMA1
TLE7250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V supply voltage. It features a square package shape, tin terminal finish, and dual terminal position. Ideal for automotive applications requiring a compact design and reliable network interfaces.
TLE7250VLEXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; JESD-609 Code: e3;
TLE7251VLEXUMA1
TLE7251VLEXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline, heat sink package. It operates at a nominal voltage of 5V and has a max seated height of 1.15mm. This IC is commonly used in telecom applications for interface circuitry.
TLE7263EXUMA2
LAN SWITCHING CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE7250XSJ
INTERFACE CIRCUIT; Terminal Finish: NICKEL GOLD PALLADIUM; Moisture Sensitivity Level (MSL): 2A;
TLE7250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
TLE7250SJ
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE7251VLE
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Terminal Pitch: .65 mm;
TLE7250GVIO
CAN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
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