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TJA1050T/VM,118

NXP Semiconductors

TJA1050T/VM,118 by NXP Semiconductors

NXP Semiconductors' TJA1050T/VM,118 is a Network Interface with 8 terminals and 5V supply voltage. It operates at data rates up to 1 Mbps, suitable for automotive applications due to its CMOS technology and wide temperature range (-40 to 125°C).

Median Price

$9.650

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 90,000 parts In-Stock

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Freelance Electronics

USA . 5 parts In-Stock

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$9.650

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$10.132

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$9.554

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Sensible Micro Corp

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Digiode

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PC Components Company LLC

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Nova Conductors

Japan . 700 parts In-Stock

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Bristol Electronics

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Inventory MP

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Corohmni

South Africa . 48 parts In-Stock

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Advanced Electronics

New Zealand . 68 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,327 parts In-Stock

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$16.406

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AZTECH Wire

Italy . 653 parts In-Stock

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Semicontronic

India . 89,609 parts In-Stock

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Ampacity Inc.

Singapore . 89,703 parts In-Stock

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Argo Parts USA

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Perfect Parts

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iodParts Technologies Inc.

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Modulus Dynamics

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

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Overview

Unlock the power of seamless network connectivity with the NXP Semiconductors TJA1050T/VM,118. Designed with precision and reliability in mind, this interface circuit offers unparalleled performance for a wide range of automotive applications. With its small outline package style and dual terminal position, this device delivers superior quality and efficiency. Experience the benefits of fast data rates and low power consumption, making it the ideal choice for your networking needs. Trust NXP Semiconductors to provide you with cutting-edge technology that ensures optimal performance every time. Elevate your automotive systems with the TJA1050T/VM,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the network interface, making it suitable for various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Power Supplies (V): 5

Operates at a standard voltage level, compatible with most power sources and ensuring reliable performance.

Package Style (Meter): SMALL OUTLINE

Compact design allows for space-saving integration into various devices or systems.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, making it suitable for automotive applications.

Data Rate: 1 Mbps

Offers a high data transmission rate, ideal for fast and efficient communication within a network.

Technical Specifications

Network Interfaces TJA1050T/VM,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJA1050T/VM,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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