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AMIS42770ICAW1RG

Onsemi

AMIS42770ICAW1RG by Onsemi

AMIS42770ICAW1RG by Onsemi is a Network Interface IC with 2 transceivers, operating at 5V. It has a data rate of 1 Mbps and operates in automotive temperature grade. This small outline package with dual terminals is ideal for interface circuit applications.

Median Price

$3.760

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 18,500 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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$3.760

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DigiKey Marketplace

USA . 23,647 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 840 parts In-Stock

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Sensible Micro Corp

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Corohmni

South Africa . 354 parts In-Stock

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$3.611

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Continental Prestige Electronics

USA . 5,810 parts In-Stock

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Argo Parts USA

USA . 5,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 516 parts In-Stock

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$8.940

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Modulus Dynamics

Lithuania . 2,986 parts In-Stock

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$9.526

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$9.526

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$9.526

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Advanced Electronics

New Zealand . 37 parts In-Stock

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$10.030

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$9.529

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Ampacity Inc.

Singapore . 18,482 parts In-Stock

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$22.670

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Semicontronic

India . 18,088 parts In-Stock

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$21.990

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S.R.D Solutions

India . 46,010 parts In-Stock

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Lixinc

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Perfect Parts

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

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Lucentia Tech

USA . 1,229 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 987 parts In-Stock

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iodParts Technologies Inc.

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UHIMA Technologies

Türkiye . 784 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the AMIS42770ICAW1RG by Onsemi. Manufactured with top-notch quality and reliability, this network interface device offers unparalleled performance in a compact package. Ideal for automotive applications, this product ensures optimal data transfer at a blazing speed of 1 Mbps. Experience the convenience and efficiency it brings to your projects, all while enjoying the peace of mind that comes with choosing a trusted manufacturer like Onsemi. Elevate your networking capabilities today with the AMIS42770ICAW1RG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and enabling high-density designs.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this product can be easily integrated into various systems without the need for additional power conversion.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in extreme cold environments without compromising performance.

Width: 7.5184 mm

The compact width of the package allows for efficient use of space on the PCB, making it suitable for designs where space is limited.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this product is capable of high-speed communication, making it suitable for applications requiring fast and reliable data transfer.

Technical Specifications

Network Interfaces AMIS42770ICAW1RG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.7762 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

No. of Transceivers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.6416 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.1375 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5184 mm

Trade Compliance

AMIS42770ICAW1RG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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