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AMIS30600LINI1G

Onsemi

AMIS30600LINI1G by Onsemi

AMIS30600LINI1G by Onsemi is a network interface IC with 8 terminals, operating temperature range of -40 to 125 °C, and supply current of 0.7mA. It is designed for automotive applications, featuring a small outline package style and gull wing terminal form. The IC has a nominal voltage of 5V and is suitable for telecom interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Chip Stock

USA . 15,522 parts In-Stock

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Vyrian

USA . 8,550 parts In-Stock

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Digiode

USA . 1,539 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,183 parts In-Stock

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ComSIT USA

USA . 1,087 parts In-Stock

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A&K Electronics

USA . 17 parts In-Stock

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Rotakorn

Sweden . 17 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 577 parts In-Stock

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$12.310

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Native Components

USA . 521 parts In-Stock

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$19.270

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Northwest PG Solutions

USA . 904 parts In-Stock

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$21.197

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$19.077

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,098 parts In-Stock

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TANS Electronics

Latvia . 6,491 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 4,732 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 4,265 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,014 parts In-Stock

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Kulean Microsystems

USA . 2,585 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 1,092 parts In-Stock

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Corphita

USA . 619 parts In-Stock

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Corohmni

South Africa . 158 parts In-Stock

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UHIMA Technologies

Türkiye . 30 parts In-Stock

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Overview

Elevate your network interfaces with the AMIS30600LINI1G by Onsemi, a cutting-edge solution that guarantees high quality and reliability. Manufactured by Onsemi, a renowned industry leader, this product offers unparalleled performance and durability. Ideal for automotive applications, this small outline package is designed to withstand extreme operating temperatures while providing a seamless interface circuit. Say goodbye to connectivity issues and experience the superior value and benefits that this product brings to your projects. Trust Onsemi for all your networking needs and elevate your systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the network interface easy to handle and able to withstand everyday use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this network interface is suitable for a wide range of environments and applications.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes this network interface compatible with most electronic devices and systems.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for efficient use of space on the circuit board, making this network interface compact and versatile.

Technical Specifications

Network Interfaces AMIS30600LINI1G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9276 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.24,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Maximum Supply Current:

.7 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

AMIS30600LINI1G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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