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AMIS42700WCGA4H

Onsemi

AMIS42700WCGA4H by Onsemi

AMIS42700WCGA4H by Onsemi is a Network Interface with 20 terminals, operating at -40 to 125°C. It features 2 transceivers, GULL WING terminals, and a supply voltage of 5V. Ideal for automotive applications requiring small outline packages and low supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,229 parts In-Stock

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VNN

France . 3,433 parts In-Stock

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Digiode

USA . 1,559 parts In-Stock

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Nova Conductors

Japan . 52 parts In-Stock

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AZTECH Wire

Italy . 536 parts In-Stock

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$6.585

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536

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Aztec Data Supply Inc.

USA . 1,676 parts In-Stock

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$12.360

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Ampacity Inc.

Singapore . 862 parts In-Stock

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$271.000

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Semicontronic

India . 1,501 parts In-Stock

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$965.000

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$940.875

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$936.050

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TANS Electronics

Latvia . 7,612 parts In-Stock

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Microchip USA

USA . 3,834 parts In-Stock

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Problanco Electronics

Mexico . 3,519 parts In-Stock

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Kulean Microsystems

USA . 3,483 parts In-Stock

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Advanced Electronics

New Zealand . 3,373 parts In-Stock

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SupplyDigital Components

Austria . 2,610 parts In-Stock

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Continental Prestige Electronics

USA . 2,143 parts In-Stock

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Argo Parts USA

USA . 1,839 parts In-Stock

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Corphita

USA . 1,680 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 424 parts In-Stock

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UHIMA Technologies

Türkiye . 159 parts In-Stock

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Discover the cutting-edge AMIS42700WCGA4H by Onsemi, a top-of-the-line network interface designed to elevate your connectivity experience. With a reputation for excellence in manufacturing, Onsemi delivers unparalleled quality and reliability with this product. Ideal for automotive applications, this small outline package boasts dual terminals, gull wing terminal form, and a nominal supply voltage of 5V. Experience seamless integration and superior performance with the AMIS42700WCGA4H, offering unmatched value and benefits to customers seeking top-tier network interfaces.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy installation and compatibility with modern circuit board designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for use in various environments without risk of overheating.

No. of Transceivers: 2

Having 2 transceivers allows for efficient communication and data transfer between devices, enhancing the overall performance of the network interface.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V provides a stable power source for consistent and reliable performance.

Technical Specifications

Network Interfaces AMIS42700WCGA4H attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.7762 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

No. of Transceivers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.6416 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.1375 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5184 mm

Trade Compliance

AMIS42700WCGA4H Telecommunications trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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