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AMIS40616AGA

Onsemi

AMIS40616AGA by Onsemi

AMIS40616AGA by Onsemi is a CMOS Network Interface IC with 14 terminals in a small outline package. It operates b/w -40 to 105 °C, suitable for industrial use. Features include matte tin/nickel palladium gold finish and 12V supply voltage, ideal for interface circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,297 parts In-Stock

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Digiode

USA . 1,747 parts In-Stock

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1,747

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 128 parts In-Stock

1+ parts

$0.550

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128

$0.550

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Northwest PG Solutions

USA . 2,108 parts In-Stock

1+ parts

$0.605

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2,108

$0.605

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SupplyDigital Components

Austria . 5,507 parts In-Stock

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5,507

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Corphita

USA . 1,689 parts In-Stock

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1,689

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Problanco Electronics

Mexico . 1,641 parts In-Stock

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1,641

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UHIMA Technologies

Türkiye . 475 parts In-Stock

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475

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Corohmni

South Africa . 174 parts In-Stock

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174

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TANS Electronics

Latvia . 154 parts In-Stock

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154

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Kulean Microsystems

USA . 137 parts In-Stock

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137

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Overview

Unleash the power of seamless connectivity with the AMIS40616AGA by Onsemi. Crafted with precision and expertise, this network interface device offers unparalleled reliability and performance. Ideal for a wide range of applications, this product is designed to elevate your connectivity experience. With its advanced technology and industrial-grade components, this gem from Onsemi guarantees a smooth and efficient operation. Say goodbye to connectivity issues and embrace a world of seamless communication with the AMIS40616AGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the network interface, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable makes it easy to install and replace without the need for additional components, saving time and effort.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and functionality, making this network interface versatile for various applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this network interface can perform reliably in a wide range of environments without overheating.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making this network interface energy-efficient and cost-effective in operation.

Technical Specifications

Network Interfaces AMIS40616AGA attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3/e4

Length:

8.69 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.937 mm

Trade Compliance

AMIS40616AGA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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