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AMIS41682AGA

Onsemi

AMIS41682AGA by Onsemi

AMIS41682AGA by Onsemi is a Network Interface IC with 14 terminals, operating at -40 to 125 °C. It has a supply voltage of 5V and terminal pitch of 1.27mm, suitable for automotive applications requiring interface circuitry in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,032 parts In-Stock

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Vyrian

USA . 171 parts In-Stock

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Native Components

USA . 845 parts In-Stock

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$10.605

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845

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Northwest PG Solutions

USA . 2,215 parts In-Stock

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$11.665

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$10.499

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SupplyDigital Components

Austria . 6,221 parts In-Stock

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Kulean Microsystems

USA . 5,534 parts In-Stock

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Problanco Electronics

Mexico . 4,230 parts In-Stock

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TANS Electronics

Latvia . 2,249 parts In-Stock

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Corphita

USA . 1,692 parts In-Stock

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Corohmni

South Africa . 293 parts In-Stock

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UHIMA Technologies

Türkiye . 163 parts In-Stock

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Overview

Elevate your network interface solutions with the AMIS41682AGA by Onsemi. Crafted with precision and reliability in mind, this small outline package is designed to withstand extreme temperatures and demanding automotive environments. With dual terminal positions and a nominal supply voltage of 5V, this interface circuit offers seamless connectivity and enhanced performance. Experience the value of superior quality and innovation with Onsemi's AMIS41682AGA, opening up a world of possibilities for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 5

Operates efficiently at a standard voltage of 5V, making it compatible with most power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance even in challenging conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold environments, suitable for a wide range of applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

Provides corrosion resistance and good electrical conductivity, enhancing the longevity and efficiency of the product.

Maximum Seated Height: 1.7272 mm

Low profile design allows for space-saving installation in compact electronic devices.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature range and reliability, making it ideal for automotive applications.

Maximum Supply Current: 0.012 mA

Efficient power consumption ensures minimal energy usage and helps reduce operating costs.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimized performance in networking environments.

Technical Specifications

Network Interfaces AMIS41682AGA attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3/e4

Length:

8.6868 mm

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.012 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.937 mm

Trade Compliance

AMIS41682AGA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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