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AMIS30663CANG2G

Onsemi

AMIS30663CANG2G by Onsemi

AMIS30663CANG2G by Onsemi is a network interface IC with 8 terminals, operating at 5V. It has a data rate of 1 Mbps and is designed for automotive applications. With a small outline package style and dual terminal position, it offers high reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,062 parts In-Stock

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VNN

France . 2,389 parts In-Stock

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Digiode

USA . 1,562 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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AZTECH Wire

Italy . 445 parts In-Stock

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$9.420

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445

$9.420

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Aztec Data Supply Inc.

USA . 2,751 parts In-Stock

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$10.230

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Ampacity Inc.

Singapore . 884 parts In-Stock

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$441.000

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884

$441.000

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Semicontronic

India . 824 parts In-Stock

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$910.000

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$887.250

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$882.700

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824

$910.000

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$882.700

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TANS Electronics

Latvia . 6,862 parts In-Stock

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Kulean Microsystems

USA . 6,662 parts In-Stock

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Perfect Parts

USA . 4,552 parts In-Stock

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Microchip USA

USA . 4,523 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Continental Prestige Electronics

USA . 3,018 parts In-Stock

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SupplyDigital Components

Austria . 2,507 parts In-Stock

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Problanco Electronics

Mexico . 2,482 parts In-Stock

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Argo Parts USA

USA . 1,734 parts In-Stock

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UHIMA Technologies

Türkiye . 826 parts In-Stock

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826

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Corohmni

South Africa . 446 parts In-Stock

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446

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Corphita

USA . 143 parts In-Stock

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143

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the AMIS30663CANG2G by Onsemi, a top-notch network interface designed to elevate your connectivity experience. With a focus on quality and innovation, Onsemi has crafted this product with precision and expertise. Ideal for automotive applications, this interface circuit offers seamless communication at high speeds of up to 1 Mbps. Say goodbye to connectivity issues and hello to efficiency with the AMIS30663CANG2G - your gateway to reliable networking solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation in compact spaces.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extended use in diverse environments without overheating.

Data Rate: 1 Mbps

Supporting a data rate of 1 Mbps ensures efficient and fast data transmission, suitable for most networking needs.

Terminal Pitch: 1.27 mm

The small terminal pitch enables a high-density layout, optimizing space usage on a circuit board.

Technical Specifications

Network Interfaces AMIS30663CANG2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9276 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

AMIS30663CANG2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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