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AMIS40615AGA

Onsemi

AMIS40615AGA by Onsemi

AMIS40615AGA by Onsemi is a Network Interface IC with 14 terminals, operating b/w -40 to 105 °C. It features CMOS technology, matte tin/nickel palladium gold finish, and a small outline package style. Ideal for telecom applications requiring a 12V supply voltage and industrial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,855 parts In-Stock

1+ parts

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1,855

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Digiode

USA . 736 parts In-Stock

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736

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 5 parts In-Stock

1+ parts

$0.396

100+ parts

-

1k+ parts

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10k+ parts

$0.380

5

$0.396

-

-

$0.380

Northwest PG Solutions

USA . 851 parts In-Stock

1+ parts

$0.436

100+ parts

-

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$0.384

851

$0.436

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$0.384

Problanco Electronics

Mexico . 6,604 parts In-Stock

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6,604

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TANS Electronics

Latvia . 6,195 parts In-Stock

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6,195

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Kulean Microsystems

USA . 3,939 parts In-Stock

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3,939

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SupplyDigital Components

Austria . 2,295 parts In-Stock

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2,295

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Corphita

USA . 1,152 parts In-Stock

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1,152

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Corohmni

South Africa . 220 parts In-Stock

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220

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UHIMA Technologies

Türkiye . 45 parts In-Stock

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45

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Overview

Unleash the power of seamless connectivity with the AMIS40615AGA by Onsemi! Crafted with precision and expertise, this network interface device offers unparalleled quality and reliability. From industrial applications to telecommunications, this versatile product ensures smooth operations and seamless data transfer. With a temperature grade of -40 to 105 °C, matte tin/nickel palladium gold finish terminals, and a small outline package style, the AMIS40615AGA guarantees optimal performance in any environment. Elevate your connectivity experience with Onsemi's cutting-edge technology and unlock a world of possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to environmental factors, making the network interface reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board, enabling compact design of electronic devices.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting the network interface to other components, ensuring compatibility with various systems.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures the network interface can withstand heat stress and operate reliably in demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the network interface to function in cold conditions without performance issues, increasing its versatility.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

Matte tin, nickel palladium, and gold terminal finish provide excellent conductivity, corrosion resistance, and solderability, ensuring stable connections.

Terminal Position: DUAL

Dual terminal position offers redundancy in connections, reducing the risk of signal loss or failure in critical communication applications.

Width: 3.937 mm

Compact width allows for space-efficient placement of the network interface on the circuit board, enabling sleek and streamlined device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the network interface can operate reliably in harsh industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with digital systems, enhancing the efficiency and performance of the network interface.

Nominal Supply Voltage: 12 V

12V nominal supply voltage offers compatibility with standard power sources, making the network interface suitable for a wide range of electronic devices.

Technical Specifications

Network Interfaces AMIS40615AGA attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3/e4

Length:

8.69 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.937 mm

Trade Compliance

AMIS40615AGA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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