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AMIS42665TJAA1RG

Onsemi

AMIS42665TJAA1RG by Onsemi

AMIS42665TJAA1RG by Onsemi is a network interface with 8 terminals, operating at 5V. It has a data rate of 1 Mbps and is ideal for automotive applications due to its temperature range of -40 to 125°C. The package style is small outline, making it suitable for surface mount designs in compact spaces.

Median Price

$1.027

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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Bristol Electronics

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Digiode

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Elcom Components

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Benley Electronics

USA . 1 parts In-Stock

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$1.000

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Continental Prestige Electronics

USA . 6,612 parts In-Stock

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Argo Parts USA

USA . 1,113 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 40 parts In-Stock

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$6.424

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AZTECH Wire

Italy . 721 parts In-Stock

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Ampacity Inc.

Singapore . 1,596 parts In-Stock

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RC Electronics

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Lixinc

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TANS Electronics

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Problanco Electronics

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Glotronic Ltd.

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SupplyDigital Components

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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iodParts Technologies Inc.

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Kulean Microsystems

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Corphita

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South Africa . 273 parts In-Stock

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UHIMA Technologies

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GreenTree Electronics

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Overview

Discover the ultimate solution for network interfaces with the AMIS42665TJAA1RG by Onsemi. Crafted with precision and quality materials, this small outline package offers seamless surface mounting for easy integration. Ideal for automotive applications, this interface circuit ensures reliable performance in extreme temperatures. With a nominal supply voltage of 5V and a data rate of 1 Mbps, customers can experience efficient connectivity with minimal power consumption. Elevate your networking capabilities with the AMIS42665TJAA1RG and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, perfect for portable or high-use applications.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on circuit boards, saving space and enhancing assembly efficiency.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 8

Having 8 terminals provides ample connections for versatile usage and compatibility with different devices.

Maximum Operating Temperature: 125°C

With a high maximum operating temperature, this product can perform reliably in a variety of environments and conditions.

Minimum Operating Temperature: -40°C

The low minimum operating temperature ensures the product can function in extreme cold environments without any issues.

Data Rate: 1 Mbps

1 Mbps data rate allows for fast and efficient data transfer, ideal for high-speed networking and communication applications.

Technical Specifications

Network Interfaces AMIS42665TJAA1RG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

AMIS42665TJAA1RG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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