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AMIS42665TJAA6RG

Onsemi

AMIS42665TJAA6RG by Onsemi

AMIS42665TJAA6RG by Onsemi is a network interface IC with 1 Mbps data rate and 5V nominal voltage. It is designed for automotive applications and has a small outline package style, making it suitable for space-constrained environments.

Median Price

$1.530

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 36,944 parts In-Stock

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$1.530

36,944

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$1.530

Flip Electronics (Authorized)

USA . 36,944 parts In-Stock

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36,944

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Chip Stock

USA . 47,000 parts In-Stock

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47,000

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Flip Electronics

USA . 36,944 parts In-Stock

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36,944

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DigiKey Marketplace

USA . 36,944 parts In-Stock

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36,944

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Vyrian

USA . 36,767 parts In-Stock

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36,767

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ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

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4,000

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Q Components

USA . 2,147 parts In-Stock

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VNN

France . 1,396 parts In-Stock

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1,396

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Digiode

USA . 315 parts In-Stock

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315

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 36,617 parts In-Stock

1+ parts

$1.420

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36,617

$1.420

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Corohmni

South Africa . 226 parts In-Stock

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$1.670

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226

$1.670

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TANS Electronics

Latvia . 8,139 parts In-Stock

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Lixinc

USA . 7,486 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,725 parts In-Stock

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6,725

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Problanco Electronics

Mexico . 5,877 parts In-Stock

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Continental Prestige Electronics

USA . 5,346 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,483 parts In-Stock

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SupplyDigital Components

Austria . 4,039 parts In-Stock

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Kulean Microsystems

USA . 3,608 parts In-Stock

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Kepictronics

USA . 2,807 parts In-Stock

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2,807

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Corphita

USA . 2,074 parts In-Stock

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UHIMA Technologies

Türkiye . 375 parts In-Stock

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375

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Argo Parts USA

USA . 332 parts In-Stock

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332

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Discover the AMIS42665TJAA6RG by Onsemi, a Network Interface that redefines excellence. With its high-quality manufacturing and impeccable reputation, Onsemi guarantees unmatched reliability and durability. This versatile product is designed to excel in various applications, delivering outstanding performance every time. But what truly sets the AMIS42665TJAA6RG apart is its value to customers. Experience seamless connectivity, enhanced efficiency, and unparalleled convenience with this game-changing device. Say goodbye to complicated setups and hello to effortless networking. Trust the AMIS42665TJAA6RG to elevate your connectivity experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material enhances the durability and resistance of the product, making it a reliable choice in a variety of environments and applications.

Surface Mount: YES

The surface mount feature enables easy installation of the network interface, making it suitable for compact and space-constrained devices, while also simplifying the manufacturing process.

No. of Functions: 1

With a single function, this network interface provides a straightforward and efficient solution for its intended purpose, ensuring simplicity and ease of use.

Package Shape: RECTANGULAR

The rectangular package shape allows for convenient integration and mounting options, facilitating seamless incorporation into electronic systems and devices.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this network interface ensures compatibility with a wide range of systems and power sources, enhancing its versatility.

No. of Terminals: 8

The presence of 8 terminals provides sufficient connectivity options, offering flexibility in establishing connections and facilitating smooth data transmission.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the compactness and portability of the network interface, making it an ideal choice for devices that prioritize space efficiency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this network interface is designed to withstand high operating conditions, ensuring reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The network interface's minimum operating temperature of -40°C enables operation in extreme cold environments, further expanding its usability and application range.

Terminal Finish: MATTE TIN

The use of matte tin as the terminal finish ensures a high level of conductivity and corrosion resistance, providing stable and long-lasting connections for optimal data transmission.

Terminal Position: DUAL

The dual terminal position offers increased flexibility in circuit designs and connectivity options, enabling easy integration into various electronic systems.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75mm, this network interface's compact design allows for seamless incorporation into space-limited devices without compromising performance.

Width: 3.9 mm

The narrow width of 3.9mm makes this network interface suitable for compact devices, ensuring efficient utilization of available space in electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The network interface's capability to withstand peak reflow temperature for up to 30 seconds enables reliable soldering during manufacturing processes, ensuring proper assembly and functionality.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this network interface can withstand high-temperature reflow processes during manufacturing, ensuring secure and stable connections.

Length: 4.9 mm

The compact length of 4.9mm contributes to the overall space efficiency of the network interface, making it suitable for devices with limited board space.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this network interface meets the stringent temperature requirements and reliability standards for automotive electronic systems, making it a reliable choice for automotive manufacturers.

Terminal Form: GULL WING

The gull wing terminal form provides stress relief and secure mounting of the network interface, ensuring durable and reliable connections in various electronic systems.

No. of Transceivers: 1

With a single transceiver, this network interface offers a practical solution for establishing communication between devices, providing effective data transmission capabilities.

Maximum Supply Current: 0.065 mA

Consuming only a maximum supply current of 0.065mA, this network interface is energy-efficient, minimizing power consumption and prolonging device battery life.

Telecom IC Type: INTERFACE CIRCUIT

With its telecom IC type as an interface circuit, this network interface effectively bridges communication between telecommunication components, facilitating seamless data transfer in telecom applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this network interface aligns with standard voltage levels, ensuring compatibility with a wide range of systems and power sources.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for compact integration and easy PCB layout, simplifying the integration and manufacturing process of electronic devices.

Data Rate: 1 Mbps

With a data rate of 1Mbps, this network interface offers fast and efficient data transmission capabilities, enabling smooth communication between devices.

Moisture Sensitivity Level (MSL): 2

Featuring a moisture sensitivity level of 2, this network interface can withstand moderate moisture exposure during transportation and storage, ensuring long-term reliability and performance.

Technical Specifications

Network Interfaces AMIS42665TJAA6RG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

AMIS42665TJAA6RG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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