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AMIS41682CANM1RG

Onsemi

AMIS41682CANM1RG by Onsemi

AMIS41682CANM1RG by Onsemi is a network interface with 14 terminals, operating at -40 to 125°C. It has a supply voltage of 5V and terminal pitch of 1.27mm, suitable for automotive applications requiring interface circuits. The package is small outline, surface mountable, with matte tin finish and gull wing terminals.

Median Price

$1.597

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$1.597

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$1.597

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Chip Stock

USA . 33,370 parts In-Stock

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Component Sense

UK . 17,424 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Infinite Electronics LLP

India . 9,580 parts In-Stock

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9,580

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Vyrian

USA . 3,981 parts In-Stock

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VNN

France . 2,348 parts In-Stock

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Digiode

USA . 2,116 parts In-Stock

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Flip Electronics

USA . 1,300 parts In-Stock

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ComSIT Distribution GmbH

Germany . 301 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,981 parts In-Stock

1+ parts

$1.597

100+ parts

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$1.565

3,981

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$1.565

Argo Parts USA

USA . 1,858 parts In-Stock

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$1.597

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1,858

$1.597

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Aztec Data Supply Inc.

USA . 28 parts In-Stock

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$6.540

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28

$6.540

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AZTECH Wire

Italy . 588 parts In-Stock

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$15.477

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588

$15.477

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Ampacity Inc.

Singapore . 884 parts In-Stock

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$349.000

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884

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Perfect Parts

USA . 58,453 parts In-Stock

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RC Electronics

USA . 30,301 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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Kulean Microsystems

USA . 8,011 parts In-Stock

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Assy Fe

Spain . 7,276 parts In-Stock

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Problanco Electronics

Mexico . 6,847 parts In-Stock

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SupplyDigital Components

Austria . 4,720 parts In-Stock

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TANS Electronics

Latvia . 3,992 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Futuretech Components

Singapore . 2,980 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,994 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,329 parts In-Stock

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GreenTree Electronics

Israel . 1,260 parts In-Stock

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Corphita

USA . 1,060 parts In-Stock

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Lixinc

USA . 977 parts In-Stock

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Microchip USA

USA . 436 parts In-Stock

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436

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UHIMA Technologies

Türkiye . 325 parts In-Stock

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Corohmni

South Africa . 112 parts In-Stock

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Overview

Elevate your network interfaces with the AMIS41682CANM1RG by Onsemi. Crafted with precision and reliability, this product offers top-notch quality that surpasses industry standards. Perfect for automotive applications, this interface circuit ensures seamless connectivity and optimal performance. Experience the value of superior technology with Onsemi's innovative solution, delivering unmatched benefits and advantages to customers. Upgrade your network interfaces today and unlock endless possibilities with the AMIS41682CANM1RG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the network interface, ensuring longevity and ease of installation.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, saving space and enhancing overall device compactness.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of existing systems and setups.

Terminal Finish: MATTE TIN

Offers reliable electrical connections and resistance to corrosion, ensuring stable performance over time.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for various environments and applications.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for telecom applications, ensuring optimal performance and compatibility in networking setups.

Technical Specifications

Network Interfaces AMIS41682CANM1RG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.6868 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.012 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

AMIS41682CANM1RG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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