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AMIS30663NGA

Onsemi

AMIS30663NGA by Onsemi

AMIS30663NGA by Onsemi is a Network Interface with 8 terminals, operating at 5V. It has a small outline package style, suitable for automotive applications. With a temperature range of -40 to 125 °C, it features gull wing terminal form and requires only 0.065mA supply current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,403 parts In-Stock

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1,403

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Digiode

USA . 215 parts In-Stock

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215

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Distributors (Availability)

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Native Components

USA . 931 parts In-Stock

1+ parts

$0.068

100+ parts

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$0.065

931

$0.068

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$0.065

Northwest PG Solutions

USA . 1,153 parts In-Stock

1+ parts

$0.075

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$0.066

1,153

$0.075

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$0.066

Problanco Electronics

Mexico . 6,450 parts In-Stock

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6,450

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TANS Electronics

Latvia . 5,402 parts In-Stock

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5,402

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Kulean Microsystems

USA . 5,091 parts In-Stock

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5,091

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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SupplyDigital Components

Austria . 2,100 parts In-Stock

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Corphita

USA . 1,761 parts In-Stock

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1,761

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UHIMA Technologies

Türkiye . 370 parts In-Stock

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370

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Corohmni

South Africa . 50 parts In-Stock

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50

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Overview

Upgrade your network interfaces with the AMIS30663NGA by Onsemi, a top-quality product designed to provide seamless connectivity and optimal performance. Manufactured by Onsemi, a trusted name in the industry, this small outline package features dual terminal positions, gull wing terminal form, and a wide operating temperature range suitable for automotive applications. With a nominal supply voltage of 5V and low supply current, this interface circuit offers reliability and efficiency. Experience the benefits of improved connectivity and functionality with the AMIS30663NGA by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides compatibility with standard mounting configurations, making it easier to integrate into existing systems.

Power Supplies (V): 5

The 5V power supply ensures compatibility with a wide range of devices and systems, making it a versatile choice for various applications.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for flexible connection configurations to meet specific requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold temperatures, expanding its range of use in various environments.

Terminal Position: DUAL

The dual terminal position enhances connectivity options and provides redundancy in case of one terminal failure, ensuring uninterrupted operation.

Width: 3.937 mm

The compact width of 3.937mm allows for space-saving installation, making it suitable for applications with limited space constraints.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and component reliability during assembly, contributing to product longevity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables efficient and reliable soldering during assembly, ensuring a secure connection for enhanced performance.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification indicates the product's suitability for automotive applications, where temperature fluctuations are common, ensuring durable performance.

Maximum Supply Current: 0.065 mA

The low maximum supply current of 0.065 mA reduces power consumption, making the product energy-efficient and cost-effective in long-term use.

Telecom IC Type: INTERFACE CIRCUIT

The telecom IC type of interface circuit ensures seamless communication and data transfer between devices, making it a reliable choice for networking applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides stable power delivery for consistent performance, ensuring compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections, facilitating easy integration and reducing the risk of signal interference or loss.

Technical Specifications

Network Interfaces AMIS30663NGA attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3/e4

Length:

4.9276 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.065 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.937 mm

Trade Compliance

AMIS30663NGA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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