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TJA1051T/3

NXP Semiconductors

TJA1051T/3 by NXP Semiconductors

NXP Semiconductors' TJA1051T/3 is an AEC-Q100 compliant CAN transceiver with 5 Mbps data rate, suitable for automotive applications. It operates at 5V nominal voltage, drawing a max of 110mA current. The small outline package measures 4.9mm x 3.9mm x 1.75mm and features gull wing terminals for surface mounting.

Median Price

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13

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1k+

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Flip Electronics

USA . 600,000 parts In-Stock

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Bristol Electronics

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Anansix

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Digiode

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ComSIT Distribution GmbH

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J2 Sourcing AB

Sweden . 1,000 parts In-Stock

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Lantek

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Nova Conductors

Japan . 300 parts In-Stock

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Microfarads

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Cyclops Electronics Ltd

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Vyrian

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Prism Electronics

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AZTECH Wire

Italy . 424 parts In-Stock

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$5.483

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$9.765

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Corohmni

South Africa . 129 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,077 parts In-Stock

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Semicontronic

India . 1,348 parts In-Stock

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$584.910

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One Stop Electronics

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Ampacity Inc.

Singapore . 762 parts In-Stock

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Lucentia Tech

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Overview

Unlock seamless communication and reliable networking with the TJA1051T/3 by NXP Semiconductors, a leading manufacturer in network interfaces. This cutting-edge CAN transceiver offers unparalleled quality and performance, perfect for automotive, industrial, and IoT applications. Experience the value of fast data rates, low power consumption, and advanced reliability that this product delivers. Trust NXP Semiconductors to provide top-of-the-line solutions for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for long-term use in various networking applications.

Surface Mount: YES

With the ability to be surface mounted, this product can be easily integrated into compact electronic devices without taking up too much space.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that this network interface meets stringent automotive industry standards for reliability and performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on PCBs, optimizing space and enhancing overall design flexibility.

No. of Terminals: 8

With 8 terminals, this network interface offers ample connectivity options, making it versatile and suitable for a wide range of networking requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact form factor, making this product ideal for applications with limited space constraints.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish of nickel palladium gold silver provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission.

Terminal Position: DUAL

The dual terminal position offers increased stability and connectivity, making this product a reliable choice for demanding networking environments.

Maximum Seated Height: 1.75 mm

With a low maximum seated height, this network interface can be easily integrated into slimline devices without compromising performance.

Width: 3.9 mm

The compact width of 3.9mm allows for efficient PCB layout and space-saving design, making this product a practical choice for compact electronic devices.

Technical Specifications

Network Interfaces TJA1051T/3 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

110 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJA1051T/3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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